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Plastic composition for encapsulation and its application

A technology of plastic composition and epoxy resin, applied in circuits, electric solid devices, semiconductor devices, etc., can solve the problems of poor performance, water absorption and heat resistance, and achieve high thermal conductivity, low viscosity and low expansion coefficient. Effect

Inactive Publication Date: 2020-11-24
MIDEA SMART TECH CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a plastic composition for encapsulation and its application in order to overcome the problems of poor performance (especially water absorption and heat resistance) in the prior art

Method used

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  • Plastic composition for encapsulation and its application
  • Plastic composition for encapsulation and its application
  • Plastic composition for encapsulation and its application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0056] The method for preparing plastics for encapsulation comprises: after accurately weighing the components (g) as shown in Table 1, the filler is treated with a silane coupling agent in a mixer, first mixed for 5 minutes, and then left to stand for 3 minutes, so Repeat 5 times for surface treatment; then add other components in proportion, use a metal detector to detect and remove metal impurities through magnetic separation, and then mix for 3 minutes to melt and knead the mixture. The kneading temperature is 100°C. The time is 4 minutes; after the product is cooled, it is pulverized and sieved (the undersize of a 100-mesh sieve is taken), transported in a pipeline, magnetically separated, stirred and mixed, ingoted and subjected to a performance test. The performance test method is as follows:

[0057] The thermal conductivity is detected by a thermal conductivity tester (Tianjin Inbell Technology Development Co., Ltd., imDRY3001-II);

[0058] Melt viscosity: measured b...

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Abstract

The present invention relates to the field of packaging materials, and discloses a plastic composition for packaging and an application thereof. The plastic composition contains epoxy resin having specific type and proportion, a curing agent, silicon micropowder, an imidazole curing accelerator, a mold release agent, a silane coupling agent, and a toughening agent, wherein, the epoxy resin comprises liquid crystal epoxy resin, glycidyl amine epoxy resin, o-cresol formaldehyde epoxy resin and biphenyl epoxy resin, wherein the curing agent is melamine modified novolac phenolic resin. The invention also discloses an application of the composition in preparation of the plastic used for package of an integrated circuit. Through cooperation usage of the specific epoxy resin, the curing agent, the filler, the auxiliary agent and the like, the plastic used for packaging with better performance is obtained, can be used for packaging the large-scale integrated circuit, and has advantage of environmental protection.

Description

technical field [0001] The invention relates to the field of packaging materials, in particular to plastic compositions for packaging and applications thereof. Background technique [0002] With the advancement of chip technology, integrated circuits are developing towards high integration and surface mount technology. The development trend of electronic packaging and substrate materials that are compatible with this is to make materials with low thermal expansion, high thermal conductivity and high heat resistance. feature. Epoxy molding compound is one of the main raw materials for integrated circuit (IC) back-end packaging, and its development follows closely the development of integrated circuit and packaging technology. The development of electronic products towards high performance, multi-function, miniaturization, and portability not only continuously improves the performance requirements of integrated circuits, but also has higher requirements for electronic packagi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08L63/04C08L13/00C08K13/02C08K3/36C08K5/09C08K5/098C08K3/04C08G59/62H01L23/29
CPCC08G59/623C08L63/00C08L63/04C08L2201/02C08L2201/08C08L2201/22C08L2203/206C08L2205/02C08L2205/035H01L23/295C08L13/00C08K13/02C08K3/36C08K5/09C08K5/098C08K3/04
Inventor 梁海浪
Owner MIDEA SMART TECH CO LTD
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