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An adaptive diamond wire saw cutting equipment

A technology of diamond wire saw and cutting equipment, which is applied in the direction of stone processing equipment, manufacturing tools, working accessories, etc., can solve the problems of difficult processing and difficult processing, and achieve the effects of simple structure, improved processing quality and convenient operation

Active Publication Date: 2021-03-19
江苏中畅精密科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the special physical and mechanical properties of hard and brittle materials, it is difficult to process them, and it is difficult for conventional metal cutting machine tools to process them.

Method used

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  • An adaptive diamond wire saw cutting equipment
  • An adaptive diamond wire saw cutting equipment
  • An adaptive diamond wire saw cutting equipment

Examples

Experimental program
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Embodiment Construction

[0025] The technical solution of the present invention will be described in detail below in conjunction with the accompanying drawings; a self-adaptive diamond wire saw cutting device, comprising a frame (1), a horizontal feed mechanism located on the top of the frame (1), a lifting feed mechanism, and a rotation mechanism and drive mechanism;

[0026] The horizontal feed mechanism includes a stepper motor (3), a feed screw (5) and a feed nut that cooperate with the stepper motor (3) to move, and the horizontal feed mechanism is provided with a Leading screw (5) guide rail one (6) parallel to each other, described feed screw (5) is connected with the output shaft of stepper motor (3) by coupling one (4), described horizontal feeding mechanism and The lifting feed mechanism is detachably connected through a feed nut;

[0027] The lifting feed mechanism includes a lifting motor (7), a lifting screw (9) and a lifting nut that cooperate with the lifting motor to move, and a screw...

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Abstract

An adaptive diamond wire saw cutting device. The invention belongs to the technical field of diamond equipment, which uses a diamond wire saw to cut a rotating crystal ingot workpiece, and a driving wheel that rotates at high speed and reciprocates to drive the diamond wire saw to reciprocate, and the diamond wire saw is tensioned by two tensioning wheels , A cylinder is installed at the tension wheel to ensure that the diamond wire saw is in a certain tension, and two guide wheels are added to ensure the cutting accuracy and surface shape. The rotating crystal ingot workpiece is placed on the three-jaw chuck, the three-jaw chuck is fixedly connected with the rotating mechanism, driven by the rotating motor, the rotating mechanism is fixedly connected with the lifting feeding mechanism, and the lifting feeding mechanism is fixedly connected with the horizontal feeding mechanism , The horizontal feed mechanism is placed on the workbench, and the feed is driven by a stepping motor. The overall device is controlled by PLC, which has simple structure and convenient operation.

Description

technical field [0001] The invention is mainly used to realize the precision cutting of brittle and hard materials, such as monocrystalline silicon, polycrystalline silicon, ceramics, glass, refractory materials, rock samples, ore samples, building materials, PCB boards, etc., and belongs to the technical field of diamond equipment; especially relates to a A diamond wire saw cutting device. Background technique [0002] Hard and brittle materials refer to materials with high hardness and high brittleness, such as single crystal silicon, gallium arsenide, special ceramics, glass ceramics, and some composite materials. Due to the special physical and mechanical properties of hard and brittle materials, it is difficult to process them, and it is difficult to process them with conventional metal cutting machine tools. [0003] At present, diamond wire saw cutting technology is a new hard and brittle material cutting technology developed in the past ten years. It has strong cutt...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B28D5/04B28D7/04B28D7/00
CPCB28D5/0058B28D5/0082B28D5/045
Inventor 赵礼刚夏国锋刘宏西吴爱胜
Owner 江苏中畅精密科技有限公司
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