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UV adhesive tape of PO panel and preparation method thereof

A surface material and tape technology, applied in the direction of adhesive, adhesive type, film/sheet adhesive, etc., can solve the problems of insufficient adhesion of PO film, uneven expansion of PO film, etc., to improve the problem of degumming, Improve the effect of too soft or too hard adhesive layer, enhanced adhesion and cohesion

Inactive Publication Date: 2019-01-18
陈裕旺 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] In view of the technical problems of insufficient adhesion of the UV adhesive layer to the PO film and uneven expansion of the PO film in the prior art, the purpose of the present invention is to provide a PO surface material UV tape

Method used

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  • UV adhesive tape of PO panel and preparation method thereof
  • UV adhesive tape of PO panel and preparation method thereof
  • UV adhesive tape of PO panel and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1~4

[0039] Prepare PO face material UV tape as follows

[0040] Step S1

[0041] According to the formula described in Table 1, polypropylene (C 3 ), ethylene-propylene copolymer C 5 (ethylene content is 50wt%), C 9 (ethylene content is 10wt%), C 19 (ethylene content is 5wt%) and other polypropylene raw materials purchased from Mitsubishi Corporation of Japan were mixed, and the PO film was prepared by casting method.

[0042] The formula of the PO membrane of table 1 embodiment 1-4

[0043] raw material

Example 1

Example 2

Example 3

Example 4

C 3

30 copies

20 copies

25 copies

30 copies

C 5

40 copies

35 copies

35 copies

50 copies

C 9

30 copies

35 copies

35 copies

10 copies

C 19

0 copies

10 copies

5 copies

10 copies

[0044]PO film of the present invention adopts C during production 3 、C 5 、C 9 、C 19 When mixing other polypropylene raw materials, the lon...

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PUM

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Abstract

The invention discloses a UV adhesive tape of a PO panel and a preparation method thereof. The adhesive tape comprises a panel, a UV adhesive layer and a PET release protecting film which are successively laminated from top to bottom. The panel is a PO film which is prepared from the following components in parts by mass: 10-40 parts of polypropylene (C3), 30-70 parts of an ethylene-propylene copolymer (C5), 10-40 parts of (C9) and 0-10 parts of (C19). The UV adhesive layer is prepared from the following components in parts by mass: 50-100 parts of acrylic resin, 0-5 parts of epoxy resin, 1-50parts of carbon-carbon double-bond polybasic unsaturated resin and 0.5-10 parts of a photoinitiator mixed solution. By taking the PO film which is more environment-friendly as the panel of the UV adhesive tape and improving the defect that the adhesive layer is too soft or hard, the adhesive force and the cohesion between the adhesive layer and the PO film are enhanced greatly as a result of a polycondensation reaction of an epoxy resin crosslinking agent and acrylic resin, so that a adhesive residue on the back of a wafer is prevented from being separated from an iron ring. The viscosity reducing effect of the adhesive tape can be also improved greatly, so that the picking rate is 100%.

Description

technical field [0001] The invention belongs to the technical field of films, and in particular relates to a PO surface material UV adhesive tape and a preparation method thereof. Background technique [0002] UV tape is an indispensable material in the processing of wafers (wafers, silicon wafers used in the production of silicon semiconductor integrated circuits). It is used to fix the wafers on the cutting machine for cutting. (UV light hereinafter referred to as ultraviolet light) irradiation, at this time the adhesive tape is rapidly reduced from extremely high to almost zero, so as to facilitate the next process selection. At present, the UV tape used in China usually comes from Japan. Its structure includes PVC film (polyvinyl chloride film) surface material, UV adhesive layer and release protective film (PET film). Pasted on the back of the wafer, when the processing is completed, the UV adhesive layer is irradiated from the direction of PVC, and the adhesion of the...

Claims

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Application Information

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IPC IPC(8): C09J7/24C09J7/40C08L23/08C08L23/14C08L23/12C09J133/08C09J11/06
CPCC08L23/0815C08L23/14C08L2205/03C08L2205/035C09J7/24C09J7/40C09J11/06C09J133/08C09J2301/122C09J2423/046C09J2423/106C09J2467/005C08L23/12C08L101/02C08K5/18
Inventor 陈裕旺
Owner 陈裕旺
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