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Fast curing resin system and preparation method

A rapid curing and resin technology, applied in the field of epoxy resin rapid curing and accelerator, can solve the problem of shortening the gel time, and achieve the effect of short curing time, broad application background and good comprehensive performance.

Active Publication Date: 2019-01-25
BEIJING UNIV OF CHEM TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For the epoxy resin system supporting fiber reinforced composite materials, the lower viscosity can make the resin have better fluidity to fill the entire mold, and penetrate and infiltrate in the fiber, and the two-phase interface has a good combination, but through Increasing the temperature to reduce the viscosity of the resin system will lead to a significant shortening of the gel time

Method used

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  • Fast curing resin system and preparation method
  • Fast curing resin system and preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] This embodiment provides a kind of epoxy resin system that can solidify rapidly, and the preparation method of described epoxy resin system is as follows:

[0047] ① Prepare premix 1 and premix 2 according to the formula.

[0048] The formula of premix 1 is: 25 parts of bisphenol A epoxy resin, 17.9 parts of diaminodiphenyl sulfone, and 3 parts of ethylene glycol;

[0049] The formula of premix 2 is: 75 parts of bisphenol A epoxy resin, 13.7 parts of diaminodiphenyl sulfone, 2 parts of ethylene glycol, and 1 part of 1-methylimidazole.

[0050] The equivalent ratio of the epoxy equivalent of the epoxy resin to the active hydrogen equivalent of the curing agent is 1.0 / 1.0.

[0051] ②Mix the ingredients in premix 1 and premix 2 under the condition of 120°C, and carry out vacuum defoaming respectively.

[0052] According to the above recipe, Premix 1 was placed in a reaction vessel at 120°C. Mixed at low temperature for 60 min, mixed premix 2 in the reaction vessel at 12...

Embodiment 2

[0058] This embodiment provides a kind of epoxy resin system that can solidify rapidly, and the preparation method of described epoxy resin system is as follows:

[0059] ① Prepare premix 1 and premix 2 according to the formula.

[0060] Premix 1: 30 parts of bisphenol A epoxy resin, 9.8 parts of DETDA.

[0061] Premix 2: 70 parts of bisphenol A epoxy resin, 12.8 parts of DETDA, 5 parts of butanediol.

[0062] The equivalent ratio of the epoxy equivalent of the epoxy resin to the active hydrogen equivalent of the curing agent is 1.0 / 1.0.

[0063] ②Mix the ingredients in premix 1 and premix 2 under the condition of 80°C, and carry out vacuum defoaming respectively.

[0064] According to the above recipe, put the premix 1 in the reaction vessel at 80°C. Mixing at low temperature for 120 min, mixing premix 2 in the reaction vessel at 80°C for 15 min, and vacuum defoaming respectively, to obtain defoamed premix 1 and defoamed premix 2.

[0065] ② Mix the defoamed premix 1 and ...

Embodiment 3

[0079] This embodiment provides a kind of epoxy resin system that can solidify rapidly, and the preparation method of described epoxy resin system is as follows:

[0080] ① Prepare premix 1 and premix 2 according to the formula.

[0081] Premix 1: 30 parts of bisphenol A epoxy resin, 6.8 parts of DETDA, 5 parts of ethylene glycol;

[0082] Premix 2: 70 parts of bisphenol A epoxy resin, 15.8 parts of DETDA, 2-ethyl-4-methylimidazole.

[0083] ②Mix the ingredients in premix 1 and premix 2 under the condition of 40°C, and carry out vacuum defoaming respectively.

[0084] According to the above recipe, premix 1 was placed in a reaction vessel at 40°C. Mixed at low temperature for 180 min, mixed premix 2 in the reaction vessel at 80°C for 15 min, and vacuum defoamed respectively to obtain defoamed premix 1 and defoamed premix 2.

[0085] ③ Mix the defoamed premix 1 and defoamed premix 2 at 80°C.

[0086]Mix premix 1 and premix 2 at 80°C according to 8:2 (mass ratio) for 20 minu...

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Abstract

The invention provides a fast curing resin system, belonging to the technical field of preparation of epoxy resin systems. The resin system at least comprises epoxy resin, a curing agent and an accelerant, wherein the ratio of the epoxy equivalent of the epoxy resin to the active hydrogen equivalent of the curing agent is equal to 1.0 / 0.8-1.0 / 1.2; the accelerant is a polyol, and the content of theaccelerant is 0.31-3.9%. The epoxy resin system can realize rapid and uniform curing cross-linking at a specified temperature, and the cured product has excellent mechanical properties and can be used for preparing fiber-reinforced resin matrix composite automotive parts and fiber-reinforced epoxy resin composite materials. The polyol is used as the reaction accelerant of the epoxy resin and thecuring agent, so that the reaction rate of the epoxy resin system is accelerated, the molding cycle is shortened, and a better effect is achieved.

Description

technical field [0001] The invention relates to the technical field of rapid curing of epoxy resin and accelerators, in particular to a rapid curing resin system and a preparation method thereof. Background technique [0002] my country's auto industry has maintained a strong growth momentum for a long time. Driven by the rapid economic development, the per capita car ownership is also increasing year by year. At the same time, a series of problems such as air pollution caused by vehicle exhaust emissions and even global warming have become severe. Reducing automobile energy consumption and reducing environmental pollution have become key issues to be solved urgently in the automobile industry. Since the energy consumption of automobiles is directly related to the quality of the body, the lightweight of the body has become an inevitable trend in the development of the automobile industry. For new energy vehicles, the lightweight of the body can improve the endurance perfo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/56C08G59/62C08L63/00
CPCC08G59/56C08G59/62C08L63/00
Inventor 隋刚李肇晨吕晟东陈佳乐杨小平
Owner BEIJING UNIV OF CHEM TECH
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