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Heat-resistant insulating adhesive for transformers

A heat-resistant insulation and adhesive technology, applied in the field of transformers, can solve the problems of reducing the service life and stability of electronic components, the heat is too late to dissipate, and the process operation is inconvenient, etc., to achieve small size, improve heat resistance, and The effect of large surface area

Inactive Publication Date: 2019-01-25
岳西县明杰电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing resin has high viscosity and poor heat dissipation, which brings some inconvenience to the process operation, and the heat is too late to dissipate, which will reduce the service life and stability of electronic components.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] A heat-resistant insulating adhesive for transformers, the raw materials of which include by weight: 50 parts of modified phenolic resin, 9 parts of curing agent, 4 parts of diluent, 5 parts of coupling agent, 1 part of plasticizer, Fuel agent 4 parts.

Embodiment 2

[0019] A heat-resistant insulating adhesive for transformers, the raw materials of which include by weight: 75 parts of modified phenolic resin, 5 parts of curing agent, 11 parts of diluent, 1 part of coupling agent, 3 parts of plasticizer, resistance 1 part fuel;

[0020] Wherein, the preparation method of the modified phenolic resin is as follows: add phenol and water to the reaction kettle, heat up, stir until the phenol is completely dissolved, add eugenol and formaldehyde, stir evenly, add a catalyst, adjust the pH to acidity, heat up, and keep warm Polycondensation reaction, heating up distillation dehydration, cooling down, adding nano-silica, stirring reaction, heating up distillation dehydration, to obtain reactants, and vacuum dephenolization of reactants to obtain modified phenolic resin;

[0021] The plasticizer is tributyl phosphate.

Embodiment 3

[0023] A heat-resistant insulating adhesive for transformers, the raw materials of which include by weight: 65 parts of modified phenolic resin, 7 parts of curing agent, 7 parts of diluent, 3 parts of coupling agent, 2 parts of plasticizer, 2.5 parts of fuel;

[0024] Wherein, the preparation method of the modified phenolic resin is as follows: add phenol and water to the reaction kettle, heat up to 65°C, stir until the phenol is completely dissolved, add eugenol and formaldehyde, stir evenly, add a catalyst, adjust the pH to 1, Raise the temperature to 93°C, heat-preserve polycondensation for 1.5 hours, raise the temperature to 130°C for distillation and dehydration, cool down to 105°C, add nano-silica, stir and react for 65 minutes, heat up to 150°C for distillation and dehydration, and obtain the reactant. After carrying out vacuum dephenolization under a certain pressure, a modified phenolic resin is obtained;

[0025] The mass ratio of the phenol, eugenol, formaldehyde a...

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Abstract

The invention relates to the technical field of transformers, and particularly discloses a heat-resistant insulating adhesive for transformers, wherein the raw materials comprise, by weight, 50-75 parts of a modified phenol formaldehyde resin, 5-9 parts of a curing agent, 4-11 parts of a diluent, 1-5 parts of a coupling agent, 1-3 parts of a plasticizer, and 1-4 parts of flame retardant. The heat-resistant insulating adhesive of the present invention has excellent heat resistance and excellent aging resistance.

Description

technical field [0001] The invention relates to the technical field of transformers, in particular to a heat-resistant insulating adhesive used for transformers. Background technique [0002] Due to the thinness, lightness and small size of the electronic components and electronic equipment of the transformer in the mobile phone charger, the demand for thermally conductive adhesives, especially thermally conductive and insulating adhesives, used as packaging and thermal interface materials is increasing. [0003] Resin adhesives are mainly composed of resin and curing agent. In order to improve certain properties, auxiliary materials such as tougheners, diluents, accelerators, and coupling agents can also be added to meet different purposes. Due to the high bonding strength and strong versatility of resin adhesives, they are widely used in aviation, aerospace, automobile, machinery, construction, chemical industry, light industry, electronics, electrical appliances and dail...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J161/06C09J11/04C09J11/06C09J11/08C08G8/24
CPCC08G8/24C08K2201/011C08L2201/08C09J11/04C09J11/06C09J11/08C09J161/06C08L67/00C08K3/36C08K5/521C08L71/00
Inventor 胡锋舒小群刘春胡雪锋徐玉峰
Owner 岳西县明杰电子有限公司
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