Self-emulsifying aqueous low-temperature epoxy resin curing agent based on heterocyclic compound

A technology for epoxy resin curing and heterocyclic compounds, which is applied in the field of water-based synthesis, can solve the problems of high curing temperature and achieve the effects of high crosslinking density, good aging resistance and high hardness

Active Publication Date: 2019-01-29
广州飞思合成材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the epoxy curing agent prepared by this invention has the disadvantage of high curing temperature due to the reaction between epoxy resin and polyamine.

Method used

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  • Self-emulsifying aqueous low-temperature epoxy resin curing agent based on heterocyclic compound
  • Self-emulsifying aqueous low-temperature epoxy resin curing agent based on heterocyclic compound
  • Self-emulsifying aqueous low-temperature epoxy resin curing agent based on heterocyclic compound

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Effect test

Embodiment 1

[0028] A self-emulsifying water-based low-temperature epoxy resin curing agent based on heterocyclic compounds. The formula for preparing the curing agent consists of 10 parts of N-vinylimidazole and 3 parts of aminoethyl methacrylate in parts by weight. , 2 parts of N-vinylpyrrolidone, 1 part of sodium dodecyl allyl succinate sulfonate, 30 parts of water, 0.05 part of peroxybenzoic acid, 0.05 part of thioglycolic acid, 3 parts of ethanol;

[0029] Wherein, the preparation method of described curing agent is:

[0030] Under the condition of blowing nitrogen, add the formula amount of water into the reactor, stir and raise the temperature to 110°C, then add the formula amount of N-vinylimidazole, the formula amount of aminoethyl methacrylate, and the formula amount of The mixture of N-vinylpyrrolidone, sodium dodecyl allyl succinate sulfonate, 90% benzoic acid peroxide, 90% mercaptoacetic acid and ethanol in the formula quantity, the dropping time is In 1.5 hours, after the dr...

Embodiment 2

[0032] A self-emulsifying type water-based low-temperature epoxy resin curing agent based on heterocyclic compounds. The formula for preparing the curing agent consists of: 6 parts of N-vinylimidazole, dimethylaminoethyl methacrylate 5 parts of ester, 1 part of N-vinylpyrrolidone, 2 parts of 2-allyl ether 3-hydroxypropane-1-sulfonate sodium, 15 parts of water, 0.1 part of benzoyl peroxide, 0.02 part of mercaptopropionic acid, ethanol 5 copies;

[0033] Wherein, the preparation method of described curing agent is:

[0034] Under the condition of nitrogen, add the formula amount of water into the reactor, stir and raise the temperature to 105°C, then add the formula amount of N-vinylimidazole, formula amount of dimethylaminoethyl methacrylate, Formulated amount of N-vinylpyrrolidone, formulated amount of 2-allyl ether 3-hydroxypropane-1-sodium sulfonate, formulated amount of 90% benzoyl peroxide, formulated amount of 90% mercaptopropionic acid, ethanol The mixed solution, the ...

Embodiment 3

[0036] A self-emulsifying type water-based low-temperature epoxy resin curing agent based on heterocyclic compounds. The formula for preparing the curing agent consists of: 8 parts of N-vinylimidazole, methylaminoethyl methacrylate 4 parts, 1.5 parts of N-vinylpyrrolidone, 1.2 parts of styrylphenol polyoxyethylene ether, 19 parts of water, 0.06 parts of tert-butyl peroxybenzoate, 0.04 parts of mercaptoethanol, 4 parts of ethanol;

[0037] Wherein, the preparation method of described curing agent is:

[0038] Under the condition of nitrogen, add the formula amount of water into the reactor, stir and raise the temperature to 120°C, then add the formula amount of N-vinylimidazole, formula amount of methylaminoethyl methacrylate, formula N-vinylpyrrolidone, styrene-based phenol polyoxyethylene ether, 90% tert-butyl peroxybenzoate, 90% mercaptoethanol, ethanol mixture, the time for adding is In 1 hour, after the dropwise addition was completed, the reaction was continued for 1 hou...

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Abstract

The invention relates to a self-emulsifying aqueous low-temperature epoxy resin curing agent based on a heterocyclic compound, and a formula comprises: 6-10 parts of N-vinylimidazole, 3-5 parts of aminoalkyl acrylate, 1-2 parts of N-vinylpyrrolidone, 1-2 parts of a reactive emulsifier, 15-30 parts of water, 0.05-0.1 part of an initiator, 0.02-0.05 part of a chain transfer agent, and 3-5 parts of ethanol. The curing agent of the invention can perform at a low temperature, has a high drying speed at normal temperature, overcomes the shortcoming of slow curing speed of a conventional aqueous curing agent/epoxy resin system; and the cured epoxy resin has high hardness.

Description

technical field [0001] The invention relates to an epoxy resin curing agent, in particular to a heterocyclic compound-based self-emulsifying water-based low-temperature epoxy resin curing agent, which belongs to the technical field of water-based synthesis. Background technique [0002] With the increasing concern of the environment, the requirements for VOC content in coatings are becoming more and more stringent. Traditional solvent-based coatings cannot meet environmental requirements, and are gradually developing towards solvent-free and water-based coatings. Water-based epoxy coatings account for a large proportion of coatings, and the core of its technology is water-based epoxy curing agents. The water-based curing agent in the existing market is divided into two categories, one is the water-based curing agent combined with water-based epoxy resin, this curing agent cannot be used directly with ordinary commercially available epoxy resin, water-based epoxy resin must ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/50C08F226/06C08F220/34C08F226/10C09D163/00
CPCC08F226/06C08G59/506C08G59/5073C09D163/00C08F220/34C08F226/10
Inventor 万章文曹冰
Owner 广州飞思合成材料有限公司
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