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Filling glue used at bottom of electronic device

A technology for electronic devices and filling glue, applied in the directions of adhesives, epoxy resin glue, polymer adhesive additives, etc., can solve the problem that thermal conductivity cannot be further improved, and achieve improved thermal conductivity, improved interface bonding, and reduced contact heat. blocking effect

Inactive Publication Date: 2019-02-01
王景硕
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The technical problem mainly solved by the present invention is: aiming at the problem that the thermal conductivity of the filler used for the bottom of the traditional electronic device cannot be further improved, a kind of filler used for the bottom of the electronic device is provided.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

example 1

[0027] Put glass fiber and hydrofluoric acid with a mass fraction of 35% in a reaction kettle at a mass ratio of 1:20, and mix and soak for 30 minutes at a speed of 500r / min to obtain a soaking mixture, and then filter the soaking mixture. The filter residue is obtained, and then the filter residue is washed with 30% ammonia water until the washing liquid is neutral, and then the washed filter residue is placed in an oven, and dried to constant weight at a temperature of 110°C to obtain a primary treatment glass fiber , in parts by weight, put 30 parts of primary treatment glass fiber, 5 parts of biogas slurry, 2 parts of sucrose, and 30 parts of water in a fermentation tank, and mix and ferment for 5 One day, the fermentation mixture was obtained, and then the fermentation mixture was filtered to obtain the No. 1 filter cake, and then the No. 1 filter cake was washed 8 times with deionized water to obtain the secondary treatment glass fiber, and the secondary treatment glass f...

example 2

[0029]In parts by weight, successively get 100 parts of epoxy resin, 40 parts of diluent, 10 parts of curing agent, 8 parts of defoamer, 8 parts of curing accelerator and 10 parts of nano humic acid, put epoxy resin and diluent In the mixer, under the condition of rotating speed of 600r / min, stir and dilute for 60min, then add curing agent, defoamer, curing accelerator and nano humic acid into the mixer, at the condition of rotating speed of 800r / min, Stir and mix for 60 minutes to obtain the filling glue for the bottom of the electronic device. The epoxy resin is bisphenol A liquid epoxy resin. The diluent is allyl glycidyl ether. The curing agent is vinyltriamine. The defoamer is emulsified silicone oil. The curing accelerator is dicyandiamide.

example 3

[0031] Put glass fiber and hydrofluoric acid with a mass fraction of 35% in a reaction kettle at a mass ratio of 1:20, and mix and soak for 30 minutes at a speed of 500r / min to obtain a soaking mixture, and then filter the soaking mixture. The filter residue is obtained, and then the filter residue is washed with 30% ammonia water until the washing liquid is neutral, and then the washed filter residue is placed in an oven, and dried to constant weight at a temperature of 110°C to obtain a primary treatment glass fiber , in parts by weight, put 30 parts of primary treatment glass fiber, 5 parts of biogas slurry, 2 parts of sucrose, and 30 parts of water in a fermentation tank, and mix and ferment for 5 One day, the fermentation mixture was obtained, and then the fermentation mixture was filtered to obtain the No. 1 filter cake, and then the No. 1 filter cake was washed 8 times with deionized water to obtain the secondary treatment glass fiber, and the secondary treatment glass f...

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Abstract

The invention discloses a filling glue used at a bottom of an electronic device, which belongs to the technical field of electron packaging. According to the invention, glass fiber and hydrofluoric acid are mixed in a mass ratio of 1:10 to 1:20, a mixture is filtered, washed and dried to obtain the primarily processed glass fiber, in terms of parts by weight, 20 to 30 parts of primarily processedglass fiber 3 to 5 parts of biogas slurry, 1 to 2 parts of cane sugar, and 20 to 30 parts of water are mixed and fermented, filtered, and washed to obtain the secondary processed glass fiber, the secondary processed glass fiber and ethyl orthosilicate are stirred and mixed at the mass ratio of 1:10 to 1:20, the mixture is filtered, dried, charred, stepwise heated, high temperature treated, cooled,and ball milled to obtain a modified filler; the epoxy resin and a diluent are stirred and diluted, and then a curing agent, the modified filler, an antifoaming agent, and a curing accelerator and the nano humic acid are stirred and mixed, and the filling glue used at the bottom of the electronic device is obtained. The filling glue used at the bottom of the electronic device prepared by the technical scheme has the characteristics of excellent thermal conductivity.

Description

technical field [0001] The invention discloses a filling glue for the bottom of an electronic device, which belongs to the technical field of electronic packaging. Background technique [0002] In an information age, the electronics industry, which is closely related to information products, has become the largest industry, and this has also played a huge role in promoting the development of electronic packaging materials, which are closely related to electronic products. The production link of electronic packaging has a great impact on the quality and competitiveness of microelectronic products. It is an indispensable process after the production of integrated circuit chips is completed, and it is a bridge from device to system. The challenges and opportunities faced by electronic packaging materials in the information age have never been encountered since the advent of electronic products. It is a very comprehensive new high-tech discipline. [0003] In recent years, the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/04C09J11/06C09J11/08
CPCC08L2203/206C09J11/04C09J11/06C09J11/08C09J163/00C08L97/00C08K13/06C08K9/04C08K9/06C08K7/14
Inventor 王景硕兰梅菊宋宇星
Owner 王景硕
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