The invention discloses a filling glue used at a bottom of an electronic device, which belongs to the technical field of electron packaging. According to the invention, glass fiber and hydrofluoric acid are mixed in a mass ratio of 1:10 to 1:20, a mixture is filtered, washed and dried to obtain the primarily processed glass fiber, in terms of parts by weight, 20 to 30 parts of primarily processedglass fiber 3 to 5 parts of biogas slurry, 1 to 2 parts of cane sugar, and 20 to 30 parts of water are mixed and fermented, filtered, and washed to obtain the secondary processed glass fiber, the secondary processed glass fiber and ethyl orthosilicate are stirred and mixed at the mass ratio of 1:10 to 1:20, the mixture is filtered, dried, charred, stepwise heated, high temperature treated, cooled,and ball milled to obtain a modified filler; the epoxy resin and a diluent are stirred and diluted, and then a curing agent, the modified filler, an antifoaming agent, and a curing accelerator and the nano humic acid are stirred and mixed, and the filling glue used at the bottom of the electronic device is obtained. The filling glue used at the bottom of the electronic device prepared by the technical scheme has the characteristics of excellent thermal conductivity.