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Metal substrate surface treatment method for metal base copper-clad laminate

A metal substrate and surface treatment technology, which is applied in the secondary treatment of printed circuits, the improvement of the metal adhesion of insulating substrates, and electrical components, etc., can solve the problems of polluting the environment, easy tip discharge, and poor surface uniformity of metal substrates, etc., to achieve automation High degree, environmentally friendly process, improved adhesion and heat resistance

Active Publication Date: 2019-02-05
SHAANXI SHENGYI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to overcome the above-mentioned defects, the object of the present invention is to provide a metal substrate surface treatment method for metal-based copper-clad laminates, which is suitable for copper, aluminum, iron substrates, etc., to improve the adhesion and reliability of the metal substrate and the insulating layer, and to solve the existing problems. The metal substrate surface treated by some metal substrate surface treatment methods has poor surface uniformity and is prone to tip discharge, which pollutes the environment

Method used

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  • Metal substrate surface treatment method for metal base copper-clad laminate

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Effect test

Embodiment 1

[0026] This embodiment provides a method for surface treatment of an aluminum substrate for an aluminum-based copper-clad laminate, which specifically includes:

[0027] Step 1: Spray alcohol on the surface of the aluminum substrate by spraying and rinsing to clean the aluminum substrate, and then use compressed air to clean the residual alcohol on the surface; use spherical quartz sand with a particle size of 0.1mm and a Mohs hardness of 7.0, spray Sand blasting is performed perpendicular to the horizontal plane of the aluminum substrate, and the unit force value of the aluminum substrate subjected to the impact of the sand shot is 0.8kg / cm 2 , the sandblasting speed is 0.5m / min; the aluminum substrate that has been sandblasted is sprayed and cleaned with alcohol, and the alcohol is cleaned with compressed air after cleaning.

[0028] Step 2: Use spherical silicon carbide with a specific gravity of 3.0, a Mohs hardness of 9.5, and a particle size of 0.6 mm for the second sand...

Embodiment 2

[0034] The difference between this embodiment and Embodiment 1 is that in the first sandblasting, spherical quartz sand with a particle size of 0.12mm and a Mohs hardness of 7.3 is used, and the unit force value of the aluminum substrate subjected to the impact of the sand shot is 1.0kg / cm 2 , the sandblasting speed is 1m / min; in the second sandblasting, spherical silicon carbide with a specific gravity of 3.2, a Mohs hardness of 9.5, and a particle size of 1.0mm is used, and the unit force value of the aluminum substrate under the impact of the sand shot is 7kg / cm 2 , the sandblasting speed is 1m / min; the third sandblasting uses spherical quartz sand with a particle size of 0.25mm and a Mohs hardness of 7.3, and the unit force value of the aluminum substrate to withstand the impact of the sand shot is 3.5kg / cm 2 , the blasting speed is 1m / min.

[0035] The strengthening agent is a mixture of hydroxyethyl methacrylate and hydroxypropyl methacrylate at a weight ratio of 1:1, an...

Embodiment 3

[0039] The difference between this embodiment and Embodiment 1 is that in the first sandblasting, spherical quartz sand with a particle size of 0.11mm and a Mohs hardness of 7.1 is used, and the unit force value of the aluminum substrate subjected to the impact of the sand shot is 0.9kg / cm2 , the sandblasting speed is 0.8m / min; in the second sandblasting, spherical silicon carbide with a specific gravity of 3.1, a Mohs hardness of 9.4, and a particle size of 0.8mm is used, and the unit force value of the aluminum substrate under the impact of the sand shot is 6.5kg / cm 2 , the sandblasting speed is 0.8m / min; the third sandblasting uses spherical quartz sand with a particle size of 0.23mm and a Mohs hardness of 7.1, and the unit force value of the aluminum substrate under the impact of the sand shot is 3.2kg / cm 2 , the blasting speed is 0.8m / min.

[0040] As the reinforcing agent, choose a mixture of hydroxyethyl methacrylate and hydroxypropyl methacrylate at a weight ratio of 1:...

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Abstract

The invention discloses a metal substrate surface treatment method for a metal base copper-clad laminate. A metal substrate adopts spherical quartz sand to perform first sandblast cleaning, adopts spherical silicon carbide to perform a second sandblast surface treatment, and adopts the spherical quartz sand to perform a third sandblast surface treatment, so that metal cuspid teeth on the surface of the metal substrate can be eliminated after sandblast treatments, and specific surface areas can be increased as well; and a reinforcing agent can be applied to the surface of the processed metal substrate. The metal substrate prepared by the method is high in specific surface area, has no sharp burrs, and can work with the reinforcing agent, so that the binding force between an insulating layerand the metal substrate can be significantly enhanced, and the withstand voltage performance, stability and reliability of a metal base copper-clad laminate can be obviously improved; and through thediscovery of a bond property test, the caking property and heat resistance of the metal substrate prepared by the method are higher than that by a physical wire drawing and polishing method, and breakdown voltage stability can be enhanced to 3.5 - 3.8 kV compared with physical wire drawing and polishing treatment.

Description

technical field [0001] The invention belongs to the technical field of metal-based copper-clad laminates, and in particular relates to a method for treating the surface of a metal substrate for metal-based copper-clad laminates. Background technique [0002] With the continuous advancement of national energy conservation and emission reduction policies, the application fields of LEDs are becoming more and more extensive. There are higher reliability requirements for metal-based copper-clad laminate substrates. In order to achieve higher heat dissipation in metal-based copper-clad laminates, a large amount of thermally conductive filler needs to be added, which makes the bonding force between the insulating layer and the metal substrate in metal-based copper-clad laminates lower, and the insulating layer breaks and delaminates during PCB processing. Falling off, when used for a long time, the reliability is poor due to the low bonding force, and there is a problem of short s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/38
CPCH05K3/382
Inventor 王波李莎
Owner SHAANXI SHENGYI TECH
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