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High Thermal Conductivity Composite Materials

A composite material and high thermal conductivity technology, applied in the direction of heat exchange materials, chemical instruments and methods, etc., can solve the problems of miniaturization, intensified thin film, increased hardness, and increased heat-resistant temperature

Active Publication Date: 2021-03-12
NIHON YAMAMURA GLASS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in recent power modules, etc., as mentioned above, the miniaturization and film reduction have intensified, and the required heat resistance temperature has gradually increased.
In addition, in the next-generation SiC and GaN power modules, which have attracted attention in recent years and are being accelerated in research and development, the operating temperature is as high as 200°C or higher. , many volatile components, etc.

Method used

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  • High Thermal Conductivity Composite Materials
  • High Thermal Conductivity Composite Materials
  • High Thermal Conductivity Composite Materials

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0106] Using examples, the present invention will be further specifically described. In addition, "part" and "%" in an Example are mass basis (mass part, mass %) unless otherwise indicated. In addition, this invention is not limited at all by these Examples.

Synthetic example 1

[0108] [Preparation of Phenyl-modified Hybrid Prepolymer (A)]

[0109] The reaction vessel equipped with a stirring device, a thermometer, and a dropping line was fully filled with nitrogen. At this time, nitrogen gas produced by a nitrogen gas production device (UNX-200 manufactured by Japan Unix Corporation) was used as nitrogen gas.

[0110] As polydimethylsiloxane (PDMS-1) having silanol groups at both ends, FM9927 (evaporator-treated product, number-average molecular weight Mn=44000, molecular weight distribution index (Mw / Mn ) = 1.37) 226.2 parts, phenyltriethoxysilane (Ph-1; Tokyo Chemical Industry Co., Ltd., molecular weight = 240.37) 3.4 parts, and Matsumoto Fine Chemical Co., Ltd. tetrakis (2-ethylhexyl) titanate (ORGATIX 0.40 part of TA-30; molecular weight=564.75) was put into the reaction vessel fully filled with nitrogen gas according to the procedure described above. The mixture was heated while being stirred by a hot plate with a magnetic stirrer, and the sti...

Synthetic example 2

[0113] [Preparation of Phenyl-modified Hybrid Prepolymer (B)]

[0114] The reaction vessel equipped with a stirring device, a thermometer, and a dropping line was fully filled with nitrogen. At this time, nitrogen gas produced by a nitrogen gas production device (UNX-200 manufactured by Japan Unix Corporation) was used as nitrogen gas.

[0115] As polydimethylsiloxane (PDMS-2) having trialkoxysilyl groups at both ends, FM8826 (number average molecular weight (Mn) = 20000, molecular weight distribution index (Mw / Mn) = 1.06) 495.8 parts, diphenyldimethoxysilane (Ph-2; Shin-Etsu Chemical Co., Ltd. KBM-202SS, molecular weight = 244.36) 12.1 parts, 35 parts of water diluted 20 times with ethanol, phenyl trimethoxysilane 11.9 parts of ethoxysilane (Ph-1; manufactured by Tokyo Chemical Industry Co., Ltd., molecular weight = 240.37), 1.4 parts of tetrakis(2-ethylhexyl) titanate (ORGATIX TA-30; molecular weight = 564.75) manufactured by Matsumoto Fine Chemical Co., Ltd. , according ...

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Abstract

The present invention provides a high thermal conductivity composite material excellent in heat resistance and thermal conductivity. The high thermal conductivity composite material has a thermal conductivity of 20W m －1 ·K －1 A composite material for thermal conduction in which the above thermally conductive filler is blended in a resin, the resin is a phenyl-modified polydimethylsiloxane-based hybrid containing the reaction products of the following prepolymers (A) and (B) polymer. Prepolymer (A) is a phenyl-modified hybrid prepolymer comprising a condensation reaction product of polydimethylsiloxane having silanol groups at both ends and phenyltrialkoxysilane, and prepolymer (B) is a product containing a hydrolysis-condensation reaction product of polydimethylsiloxane having trialkoxysilyl groups at both terminals, phenyltrialkoxysilane, and diphenyldialkoxysilane Phenyl modified hybrid prepolymer.

Description

technical field [0001] The invention relates to a heat-conducting composite material matched with heat-conducting fillers. Background technique [0002] Composite members (hereinafter referred to as heat dissipation members) for the purpose of heat dissipation and heat dissipation based on thermal conductivity properties are widely used mainly in heavy-duty motor-related products and electrical products. The radiating member is composed of a composite material of fillers such as ceramics and metals having high thermal conductivity and heat-resistant resin that can impart elasticity. In recent years, due to the increase in density and integration of electronic components, the required thermal conductivity has increased, and the amount of heat emitted from computing elements has gradually increased. In addition, in applications requiring high miniaturization and thinning of products and insulation properties, stable and high insulation properties are also required in high ope...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09K5/14C08L83/04C08L83/10
CPCC08L83/04C08L83/10C09K5/14
Inventor 信藤卓也佐藤绿手塚宏茂濑户翔太山村卓
Owner NIHON YAMAMURA GLASS CO LTD