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Low-temperature curing silver-coated copper conducting resin and preparation method thereof

A silver-coated copper, conductive adhesive technology, applied in conductive adhesives, adhesives, epoxy resin adhesives, etc., can solve the problems of difficult welding of temperature-sensitive materials, high curing temperature, increased energy consumption, etc., to improve the conductivity. And other performance, low curing temperature, reduce the effect of comprehensive cost

Active Publication Date: 2019-02-15
BEIJING INST OF TECH ZHUHAI CAMPUS +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, most of the conductive adhesives currently on the market are cured at medium and high temperatures, and the curing temperature is relatively high, mostly above 120°C, which increases energy consumption, causes damage to the substrate, and makes it difficult or impossible to weld temperature-sensitive materials.

Method used

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  • Low-temperature curing silver-coated copper conducting resin and preparation method thereof
  • Low-temperature curing silver-coated copper conducting resin and preparation method thereof
  • Low-temperature curing silver-coated copper conducting resin and preparation method thereof

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preparation example Construction

[0035] A preparation method for low-temperature curing silver-clad copper conductive adhesive, comprising the following steps:

[0036] (1) Weigh each raw material according to the following weight ratio:

[0037]

[0038]

[0039] The conductive filler is micron silver-clad copper powder;

[0040] (2) Preheat the epoxy resin in an ultrasonic water bath at 30-70°C for 1-10 minutes, dilute, and vacuum defoam;

[0041] (3) Add diluent, conductive filler and plasticizer to the epoxy resin after degassing in step (2), stir at 45-55°C until there is no phase separation, and vacuum degassing;

[0042] (4) Add curing agent to the mixed liquid after degassing in step (3), heat to 40-50°C, stir evenly, pour film or brush onto release paper after ultrasonic degassing;

[0043] (5) Step (4) The product that is filled with film or painted on the release paper is put into a vacuum drying oven and vacuum dried at 45-65°C for 12-18min;

[0044] (6) Step (5) The product is removed fr...

Embodiment 1

[0049] In terms of parts by weight, weigh 7 parts of E-44 epoxy resin (epoxy value is 0.44 equivalent / g), place it in a water bath at 50°C for ultrasonic preheating, heat for 5 minutes until the resin has good fluidity, and vacuum off To be mixed after soaking;

[0050] Add 2 parts of absolute ethanol, 3 parts of micron silver-coated copper (size is 48 microns; silver-containing mass percentage composition is 7%), 1 part of dioctyl phthalate to the preheated epoxy resin, and then continue Stir ultrasonically at 50°C until there is no phase separation, mix well and vacuum defoam for later use;

[0051] Add m-phenylenediamine to the mixed material, the amount added is 20% of the amount of E-44 epoxy resin, stir evenly until the viscosity is moderate, and pour into the mold after ultrasonic defoaming;

[0052] Put the mold containing the conductive adhesive into a vacuum drying oven and dry it in vacuum for 15 minutes;

[0053] Move the conductive adhesive after vacuuming into ...

Embodiment 2

[0056] In terms of parts by weight, weigh 7 parts of E-51 epoxy resin (epoxy value 0.51 equivalent / g), place it in a water bath at 50°C for ultrasonic preheating, heat for 5 minutes until the resin has good fluidity, and vacuum off To be mixed after soaking;

[0057] Add 2 parts of absolute ethanol, 3 parts of micron silver-coated copper (size is 4 microns; silver-containing mass percentage composition is 47%), 1 part of phthalic acid bis(2-butoxy) to the preheated epoxy resin base) ethyl ester, and then continue to stir ultrasonically at 50°C until there is no phase separation, mix well and vacuum defoam for later use;

[0058] Add phthalic anhydride curing agent to the mixed material, the amount added is 10% of the amount of E-51 epoxy resin, stir evenly until the viscosity is moderate, and pour the mold after ultrasonic defoaming;

[0059] Put the mold containing the conductive adhesive into a vacuum drying oven and dry it in vacuum for 15 minutes;

[0060] Move the conduct...

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Abstract

The invention discloses a low-temperature curing silver-coated copper conducting resin, the low-temperature curing silver-coated copper conducting resin is prepared from the following raw materials byweight: 100 parts of epoxy resin, 5-20 parts of a curing agent, 10-30 parts of a diluent, 2-40 parts of a plasticizer, and 50-85 parts of conductive filler; and the conductive filler is micron silver-coated copper powder. The invention discloses a preparation method of the conducting resin. The problem of easy oxidation of the copper powder as the conductive filler is solved by adding the silver-coated copper conductive filler, meanwhile, the cost of the conducting resin is lowered, the electrical conductivity and other use performances of the conducting resin are kept or even improved; the excellent synergistic effect is produced through the mixed use of amine and anhydride curing agents, and the conducting resin is rapidly cured at the low temperature, and has certain advantages that the operability of the conducting resin is improved and the production efficiency of the conducting resin is improved.

Description

technical field [0001] The invention relates to the technical field of conductive adhesive materials, in particular to a low-temperature curing silver-coated copper conductive adhesive and a preparation method thereof. Background technique [0002] In recent years, various electronic products have been widely used in industry, agriculture, national defense and daily life. With the gradual development of electronic products in the direction of miniaturization, portability and integration, higher requirements are also put forward for electronic packaging technology. [0003] In the past, tin-lead solder (Pb / Sn) has been mainly used as a conductive connection material for electronic packaging due to its good electrical conductivity, relatively low price, good stability, and low melting point. With the improvement of people's awareness of environmental protection, at present, the application of Pb / Sn soldering in the field of electronic packaging is gradually decreasing, becaus...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J9/02C08G59/58
CPCC09J9/02C09J163/00C08G59/58C08K2003/0806C08K2003/085C08K9/10C08K3/08
Inventor 马艾丽何波矫庆泽宁芮林均秀
Owner BEIJING INST OF TECH ZHUHAI CAMPUS