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Regular hexagonal ebg structure for antenna and its manufacturing process

A technology of regular hexagon and manufacturing process, which is applied in antennas, antenna couplings, antenna components, etc., can solve the problems of difficulty in meeting the miniaturization requirements of wireless communication, poor symmetry performance of dense packing performance, and uneven band gap characteristics, etc. , to achieve the effect of reliable and easy manufacturing process, small matrix porosity and good performance

Active Publication Date: 2021-04-16
扬州市伟荣新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Due to the structural design of the traditional EBG structure, the product size produced is relatively large, which is difficult to meet the miniaturization requirements of the modern wireless communication field
For example, the most common EBG structure is mostly a two-layer structure. Due to the limitation of the number of layers, it is often used to increase the number of periodic structures in the same plane to meet the bandgap performance of the EBG structure. The increase in the number of periodic structures in the same plane will inevitably bring Disadvantages of oversized products
Moreover, the shape of the inductance coil of the traditional EBG structure either has good symmetry performance and poor density performance, or good density performance and poor symmetry performance. uneven
[0004] In addition, the bottom electrode layer of the traditional EBG structure is in the shape of an entire flat plate, and the large-area contact between the silver electrode layer and the raw tape layer makes cracking easily occur between layers, and the product durability is poor

Method used

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  • Regular hexagonal ebg structure for antenna and its manufacturing process
  • Regular hexagonal ebg structure for antenna and its manufacturing process
  • Regular hexagonal ebg structure for antenna and its manufacturing process

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Embodiment 1

[0072] In this embodiment, from top to bottom, the MARK layer, the first-order whiteboard layer group, the coil layer group, the bottom electrode layer, and the second-order whiteboard layer group are superimposed. Among them, the MARK layer is a raw tape layer printed with MARK graphics, and the number of this layer is one; the first-order whiteboard layer group includes six whiteboard layers; the coil layer group includes 18 coil layers, and the coils on the coil layer are composed of several regular hexagonal layers. An array formed by the periodic arrangement of inductance coils in the shape of one side missing, each inductance coil is conductively connected to the inductance coil of the next coil layer through a through hole; the coils on the bottom electrode layer are regularly arranged by a complete regular hexagonal inductance coil cloth, and the inductance coils are connected by conductors in two directions perpendicular to each other in a straight line to realize the ...

Embodiment 2

[0075] The present embodiment is the manufacturing process of embodiment 1, and it comprises the following operation steps:

[0076] 1). Slurry preparation;

[0077] The slurry preparation is the same as the traditional LTCC slurry preparation method. The slurry raw material is a borosilicate glass / ceramic composite system. The dielectric constant of the composite material is 4.6-5.0, and the composition is Al 2 o 3 -B 2 o 3 -SiO 2 -R 2 O, where R 2 O is an alkali metal oxide, the solvent used to prepare the ceramic slurry is toluene and isopropanol, the plasticizer is dioctyl adipate and dibutyl phthalate, and the binder is polymethyl methacrylate , the dispersant is phosphoric acid ester;

[0078] 2). Casting: the slurry prepared in step 1) is dry-cast to obtain a green tape with a thickness of 50 μm, and the raw tape is attached to the PET film, and after cutting, a green tape unit of a fixed size is formed;

[0079] 3).Punching through holes: Each raw tape is laser...

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Abstract

The invention discloses a regular hexagonal EBG structure for antennas and a manufacturing process thereof, which belongs to the technical field of wireless communication and solves the problems that the traditional EBG structure has a large size, is difficult to meet miniaturization requirements, and has uneven band gap characteristics in all directions . It mainly includes MARK layer, first-order whiteboard layer group, coil layer group, bottom electrode layer, and second-order whiteboard layer group superimposed from top to bottom. The invention greatly reduces the size of the product and meets the requirements of the wireless communication field for the miniaturization of the EBG structure; the band gap characteristics in all directions are highly consistent; the process flow is reliable and easy, and the performance of the manufactured product is stable. The performance improvement of the antenna is of great significance and can be widely used in the technical field of wireless communication.

Description

technical field [0001] The invention belongs to the technical field of wireless communication, and in particular relates to a regular hexagonal EBG structure for an antenna with excellent band gap performance and miniaturization and a manufacturing process thereof. Background technique [0002] The design principle of the EBG structure is mainly based on two mechanisms: the first is the Bragg scattering mechanism, the periodic arrangement of units causes the periodic distribution of the scattered wave phase, the scattered wave is superimposed, and the scattered wave is superimposed in antiphase at a specific frequency in a specific direction. Cancellation of each other, the performance of preventing the propagation of electromagnetic waves, that is, the formation of electromagnetic wave forbidden band. Under this mechanism, the period constant a when designing the EBG structure needs to satisfy the Bragg condition, that is, a=λg / 2, where λg is the wavelength corresponding to...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01Q1/52
CPCH01Q1/526
Inventor 陈可芳
Owner 扬州市伟荣新材料有限公司
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