2results about How to "Effective interconnection" patented technology

This invention discloses a method, apparatus, device, and storage medium for interconnecting modules, comprising: selecting a target bus from a chip interconnect channel according to preset requirements for connecting a transmitting module and a receiving module, and adjusting the routing of the target bus based on the receiving module; configuring a credit transmission channel interconnect structure and a bus matrix for the adjusted target bus; adjusting the bus connection method of the transmitting module and the receiving module based on the bus matrix, and performing protocol-free interconnection through the credit transmission channel interconnect structure. By adjusting the routing of the target bus for interconnecting modules on the chip interconnect channel based on the receiving module to alleviate wiring congestion in the interconnect channel, thereby facilitating physical implementation and high-speed interconnection, and by configuring a credit transmission channel interconnect structure and a bus matrix on the target bus after routing adjustment to perform protocol-free interconnection of the transmitting module and the receiving module, the transmission efficiency is improved while ensuring effective module interconnection.

The application discloses a kind of interpenetrating structure copolymer organic inverters and preparation method, including substrate, 2 organic field effect transistors, power supply end, ground terminal, output terminal, input terminal and interconnection line;Each organic field effect transistor includes organic semiconductor layer, photoetching dielectric barrier layer, source, drain and gate;Source includes n source fingers;Drain includes n drain fingers, n drain fingers and n source fingers equidistantly staggered, and form 2n-1 source-drain gap;Gate includes 2n-1 gate fingers arranged directly above source-drain gap.The application can effectively utilize photoetching dielectric barrier layer, introduce photoetching into the preparation of organic circuit, can effectively protect organic semiconductor material, and can be integrated on the same substrate Multiple organic field effect transistors are realized.In addition, interpenetrating structure can improve the on-current of circuit and reduce on-resistance, while the circuit opening voltage can be well reduced, and the power consumption of circuit is reduced.