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Resin composition, resin sheet, multilayer printed circuit board, and semiconductor device

A resin composition and resin technology, applied in the directions of printed circuits, printed circuit components, circuit substrate materials, etc., can solve the problems of long processing time, and achieve the effects of excellent heat resistance and excellent developability

Active Publication Date: 2019-03-01
MITSUBISHI GAS CHEM CO INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] On the other hand, the drilling by laser processing has the problem that the processing time becomes longer as a high-density substrate with a large number of holes is formed.

Method used

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  • Resin composition, resin sheet, multilayer printed circuit board, and semiconductor device
  • Resin composition, resin sheet, multilayer printed circuit board, and semiconductor device
  • Resin composition, resin sheet, multilayer printed circuit board, and semiconductor device

Examples

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Embodiment

[0228] Hereinafter, although an Example demonstrates this invention more concretely, this invention is not limited at all by these Examples.

Synthetic example 1

[0230] (Synthesis of Cyanate Compounds)

[0231] Dissolve 1-naphthol aralkyl resin (manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.) 300 g (1.28 mol in terms of OH groups) and 194.6 g (1.92 mol) of triethylamine (1.5 mol per 1 mol of hydroxyl group) This was made into solution 1 in 1800 g of dichloromethane.

[0232] Under the condition of stirring, 125.9g (2.05mol) of cyanogen chloride (1.6mol relative to 1mol of hydroxyl), 293.8g of dichloromethane, 194.5g (1.92mol) of 36% hydrochloric acid (1.5mol of relative to 1mol of hydroxyl) 1. Water 1205.9g was kept at a liquid temperature of -2 to -0.5°C, and the solution 1 was injected for 30 minutes. After solution 1 was injected, it was stirred at this temperature for 30 minutes, and then a solution obtained by dissolving 65 g (0.64 mol) of triethylamine (0.5 mol per 1 mol of hydroxyl) in 65 g of dichloromethane was injected over 10 minutes (solution 2 ). After the injection of solution 2 was completed, the reaction w...

Embodiment 1

[0236] (Manufacture of resin composition and resin sheet)

[0237] The biphenyl aralkyl type epoxy resin (n in the formula (1) is 1-3 as the biphenyl aralkyl type epoxy resin (A) represented by formula (1). NC3000L (trade name), Nippon Kayaku Co., Ltd.) 22.4 parts by mass, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1 (Irgacure (registered trademark) 369, manufactured by BASFJAPAN LTD.) 6.5 parts by mass, propylene glycol monomethyl ether acetate (hereinafter sometimes abbreviated as PGMEA.) solution of TrisP-PA epoxy acrylate compound as compound (C) (KAYARAD (registered Trademark) ZCR-6007H, non-volatile content 65% by mass, acid value: 70 mgKOH / g, manufactured by Nippon Kayaku Co., Ltd.) 77.5 parts by mass (50.4 parts by mass in terms of non-volatile content), as components other than (C) 17.4 parts by mass of dipentaerythritol hexaacrylate (KAYARAD (registered trademark) DPHA, manufactured by Nippon Kayaku Co., Ltd.) of the compound (D) having an ethylenicall...

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Abstract

Provided is a resin composition that, when used in a multilayer printed circuit board, exhibits superior heat resistance and coating, and exhibits superior plating adhesion and developability. Also provided are a resin sheet with a support body, and a multilayer printed circuit board and a semiconductor device that use said resin composition and said resin sheet with a support body. The resin composition includes a biphenyl aralkyl-type epoxy resin (A) expressed by formula (1), a photocuring initiator (B), a compound (C) expressed by formula (2), and a compound (D) that has an ethylenically unsaturated group other than the (C) component.

Description

technical field [0001] The present invention relates to a resin composition, a resin sheet using the same, a multilayer printed wiring board, and a semiconductor device. Background technique [0002] Due to the miniaturization and high density of multilayer printed wiring boards, researches on reducing the thickness of laminated boards used in multilayer printed wiring boards are being actively carried out. Along with the thinning, the insulating layer is also required to be thinned, and a resin sheet that does not contain glass cloth is required. The main resin composition used as a material of the insulating layer is a thermosetting resin, and drilling for obtaining conduction between the insulating layers is usually performed by laser processing. In addition, as a method of forming a conductive circuit on an insulating layer for a resin sheet using a thermosetting resin, a method of forming a conductive circuit by copper plating is generally used. [0003] On the other ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/32H05K1/03
CPCC08G59/32H05K1/03C08F290/144C08G59/3218C08G59/4042C08G59/4223C08J5/18C08L63/00H05K1/0326
Inventor 喜多村慎也铃木卓也四家诚司
Owner MITSUBISHI GAS CHEM CO INC
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