Perovskite thin film and preparation method thereof, and applications
A technology of perovskite and perovskite precursors, which can be used in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., can solve the problems of low performance of light-emitting devices, small cesium ion radius, and small exciton binding energy. , to achieve the effect of improving coverage and regularity, promoting grain size, and simple method
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0047] A kind of preparation method of perovskite film, comprises the following steps:
[0048] (1) Add 0.3mmol (138.3mg) lead iodide to 1mL dimethylformamide (DMF) solvent, heat 50°C in the glove box to dissolve lead iodide, and prepare 0.3mmol / mL lead iodide ( PB 2 ) solution;
[0049] (2) Add 0.2835mmol (73.65mg) cesium iodide (CsI) and 0.0315mmol (8.974mg) 1-naphthylmethylammonium iodide (NMAI) into the lead iodide solution, stir at 50°C for 12h to obtain NMAI doped Mixed perovskite precursor solution;
[0050] (3) Add 12 mg of polyethylene oxide into 2 mL of dimethylformamide solvent, heat in a glove box at 50°C to dissolve the polyethylene oxide, and prepare a 6 mg / mL polyethylene oxide solution;
[0051] (4) Mix the NMAI-doped perovskite precursor solution and the polyethylene oxide solution in equal volumes, and stir at 50° C. for 2 hours to obtain a mixed solution;
[0052] (5) Perform one-step spin coating of the mixed solution, the speed of the homogenizer is 60...
Embodiment 2
[0055] A kind of preparation method of perovskite film, comprises the following steps:
[0056] (1) Take 0.3mmol (138.3mg) of lead iodide in 1mL of dimethylformamide (DMF) solvent, heat in a glove box at 50°C to dissolve lead iodide, and prepare a 0.3mmol / mL lead iodide solution ;
[0057] (2) Add 0.2520mmol (65.47mg) cesium iodide (CsI) and 0.063mmol (17.95mg) 1-naphthylmethylammonium iodide (NMAI) to the lead iodide solution, stir overnight at 50°C (12h) , to obtain NMAI-doped perovskite precursor solution;
[0058] (3) Put 12mg of polyethylene oxide in 2mL of dimethylformamide solvent, heat 50°C in the glove box to dissolve the polyethylene oxide, and prepare a 6mg / mL polyethylene oxide solution;
[0059] (4) Mix the NMAI-doped perovskite precursor solution and the polyethylene oxide solution in equal volumes, and stir at 50° C. for 2 hours to obtain a mixed solution;
[0060] (5) Perform one-step spin coating of the mixed solution, the speed of the homogenizer is 6000rp...
Embodiment 3
[0063] A kind of preparation method of perovskite film, comprises the following steps:
[0064] (1) Take 0.3mmol (138.3mg) of lead iodide in 1mL of dimethylformamide (DMF) solvent, heat in a glove box at 50°C to dissolve lead iodide, and prepare a 0.3mmol / mL lead iodide solution ;
[0065] (2) 0.2394mmol (62.20mg) cesium iodide (CsI), 0.0599mmol (10.29mg) formamidine hydroiodide (FAI), 0.0158mmol (4.487mg) 1-naphthylmethylammonium iodide (NMAI) And adding it to the lead iodide solution, stirring overnight (12h) at 50°C to obtain a NMAI-doped perovskite precursor solution;
[0066] (3) Put 12mg of polyethylene oxide in 2mL of dimethylformamide solvent, heat 50°C in the glove box to dissolve the polyethylene oxide, and prepare a 6mg / mL polyethylene oxide solution;
[0067] (4) Mix the NMAI-doped perovskite precursor solution and the polyethylene oxide solution in equal volumes, and stir at 50° C. for 2 hours to obtain a mixed solution;
[0068] (5) Perform one-step spin coati...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com