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A method for flotation separation of copper and tin in waste circuit boards

A waste circuit board and flotation technology, which is applied in solid separation, wet separation, chemical instruments and methods, etc., can solve the problems of high heating methods and methods, toxic and harmful substances in circuit boards, and tin is not easy to melt. , to achieve a significant separation effect, is conducive to separation, reduce the effect of tin content

Active Publication Date: 2021-02-09
CENT SOUTH UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Tin metal is expensive, but due to the small difference in properties between copper and copper-tin alloys, it is generally difficult to separate
At present, in order to recover tin in circuit boards, hydrometallurgy is generally used to leach copper with oxidants and strong acids or to leach tin with alkali to achieve separation. In the process, due to the complex composition of wastewater, water treatment is troublesome and pollutes the environment; physical processes are also used. For tin recovery, the main method is to heat the circuit board before it is broken, so that the tin will fall off in the form of melt. This method has high requirements for the heating method and method. If the temperature is too low, tin is not easy to melt. Too high will cause the circuit board to produce toxic and harmful substances, and the equipment is more complicated

Method used

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  • A method for flotation separation of copper and tin in waste circuit boards
  • A method for flotation separation of copper and tin in waste circuit boards
  • A method for flotation separation of copper and tin in waste circuit boards

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Embodiment 1

[0019] The flotation process flow chart of the present embodiment is as figure 1 As shown, it specifically includes the following steps:

[0020] Disposal The waste circuit boards are pyrolyzed at 700°C, and the materials are physically separated to obtain large-particle copper products, iron products, non-metallic products and small-particle copper-tin mixture materials. Wherein the small-particle copper-tin mixture material is mainly copper element and copper-tin alloy (solder), and the grade of copper product in the copper-tin mixture product is 62.32%, and the grade of tin is 23.79%;

[0021] Grind the copper-tin mixed product to -0.074mm and account for 72%. The flotation machine is stirred at 1500r / min for 4min and the pulp concentration is adjusted to 30%; The addition amount is 300g / t) and stir for 2min, then add foaming agent terpineol (compared to the additive of raw ore: 50g / t) and stir for 1.5min, and add pH regulator sodium hydroxide to adjust the pH of the pulp ...

Embodiment 2

[0026] The waste circuit board is pyrolyzed at 700°C, the material is selectively sheared and crushed, and then sieved. The tin in the material under the sieve accounts for about 90% of the original waste circuit board. After the non-metallic and magnetic substances are removed from the material under the sieve, copper is obtained. The tin mixed material, wherein the copper-tin mixed material mainly includes metallic copper and tin alloy (solder), is subjected to flotation, wherein the grade of copper product is 65.88%, and the grade of tin is 22.33%. Grind the copper-tin mixed product to -0.074mm and account for 85%. The flotation machine stirs at 1000r / min for 4min and adjusts the pulp concentration to 25%. Then add collector z-200 (compared to the raw ore The addition amount is 350g / t) and stirs for 3min, then adds foaming agent No. 2 oil (compared to the additive of raw ore is 50g / t), and adds pH adjuster sodium bicarbonate, adjusts the pH of ore pulp to be 6, carries out r...

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Abstract

The invention discloses a method for separating metallic copper and tin in waste circuit boards by flotation, which comprises the following steps: after physically sorting the waste circuit boards, large-particle copper products, iron products, non-metallic materials and copper-tin mixtures are obtained Products: Grinding copper-tin alloy mixture products to obtain ore pulp, adding flotation agents to the ore pulp for flotation to obtain copper concentrate and tin alloy tailings; smelting copper concentrate to obtain copper and tin alloy tailings Copper and tin are obtained separately by hydrometallurgy. The present invention first divides copper in waste circuit boards into ① large-grain copper products and ② small-grain copper and copper-tin alloy through physical separation method, so that tin metal is enriched, which is more conducive to the recovery of tin. The present invention adopts a flotation process to further separate small-particle copper from copper-tin alloy, further enrich tin, and is more conducive to the separation of tin metal; and the separation of small-particle copper can also reduce the pressure of subsequent separation steps.

Description

technical field [0001] The invention belongs to the technical field of metal recovery, in particular to a method for separating copper and tin in waste circuit boards by flotation. Background technique [0002] Since the 21st century, economic development and technological innovation have been accelerating, especially in the electronics industry. Electronic products are changing very fast, and the market demand is huge. But the ensuing problem is that the amount of electronic waste produced is huge and the damage to the environment caused by electronic waste is relatively serious. Electronic waste has become one of the fastest growing pollution in the world. Electronic waste contains various harmful substances, such as lead, bromide, etc. At the same time, electronic waste contains a large amount of valuable metals such as copper, tin, gold, and silver. Therefore, the recycling of waste electronic waste resources It is not only conducive to the secondary utilization of wast...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B03B7/00
CPCB03B7/00
Inventor 焦芬刘维覃文庆王荀韩俊伟杨聪仁许佳琦
Owner CENT SOUTH UNIV