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Preparation method for welding material with high thermal conductivity, high electric conductivity and high connection performance based on copper nanoparticles

A technology of copper nanoparticles and welding materials, which is applied in the direction of welding/cutting media/materials, welding equipment, welding media, etc., can solve the problems that hinder the heat conduction, electrical conduction, and connection performance of copper nanoparticles, and achieve good connection performance and reduce production. Cost, Effect of High Thermal Conductivity

Active Publication Date: 2019-03-19
CHINA UNIV OF MINING & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, copper nanoparticles are easily oxidized during storage, and a copper oxide layer is formed on the surface, which seriously hinders the thermal conductivity, electrical conductivity, and connection performance of copper nanoparticles.

Method used

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  • Preparation method for welding material with high thermal conductivity, high electric conductivity and high connection performance based on copper nanoparticles
  • Preparation method for welding material with high thermal conductivity, high electric conductivity and high connection performance based on copper nanoparticles

Examples

Experimental program
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Effect test

Embodiment 1

[0020] A method for preparing a solder material with high thermal conductivity and high connection performance based on copper nanoparticles, comprising the following steps:

[0021] (1) At room temperature, mix 1000nm copper nanoparticles with glacial acetic acid and put them into an ultrasonic disperser. The mass-to-volume ratio of copper nanoparticles to glacial acetic acid is 375g / L. Ultrasonic dispersion with 380W power for 6 minutes results in uniform mixing Copper nanoparticles acetic acid solution;

[0022] (2) Copper nanoparticles acetic acid solution is put into centrifuge to separate copper nanoparticles with the rotating speed of 1500r / min;

[0023] (3) the isolated copper nanoparticles are poured into the dehydrated ethanol for cleaning, the mass volume ratio of copper nanoparticles and ethanol is 500g / L, and the copper nanoparticles ethanol solution is obtained after repeated cleaning for 6 times;

[0024] (4) putting the copper nanoparticle ethanol solution int...

Embodiment 2

[0029] A method for preparing a solder material with high thermal conductivity and high connection performance based on copper nanoparticles, comprising the following steps:

[0030] (1) At room temperature, mix 1000nm copper nanoparticles with glacial acetic acid and put them into an ultrasonic disperser. The mass-to-volume ratio of copper nanoparticles to glacial acetic acid is 437.5g / L. Ultrasonic dispersion with 390W power for 5.5min results in Copper nanoparticles acetic acid solution mixed uniformly;

[0031] (2) Copper nanoparticles acetic acid solution is put into centrifuge to separate copper nanoparticles with the rotating speed of 1750r / min;

[0032] (3) Pour the isolated copper nanoparticles into dehydrated ethanol for cleaning, the mass volume ratio of copper nanoparticles to ethanol is 500-800g / L, and repeat cleaning for 6-8 times to obtain copper nanoparticles ethanol solution;

[0033] (4) putting the copper nanoparticle ethanol solution into a centrifuge to s...

Embodiment 3

[0038] A method for preparing a solder material with high thermal conductivity and high connection performance based on copper nanoparticles, comprising the following steps:

[0039] (1) At room temperature, mix 500nm copper nanoparticles with glacial acetic acid and put them into an ultrasonic disperser. The mass-to-volume ratio of copper nanoparticles to glacial acetic acid is 500g / L. Ultrasonic dispersion with 400W power for 5 minutes results in uniform mixing Copper nanoparticles acetic acid solution;

[0040] (2) putting the copper nanoparticle acetic acid solution into a centrifuge to separate the copper nanoparticles at a speed of 2000r / min;

[0041] (3) Pour the isolated copper nanoparticles into dehydrated ethanol for cleaning, the mass volume ratio of copper nanoparticles to ethanol is 500-800g / L, and repeat cleaning for 6-8 times to obtain copper nanoparticles ethanol solution;

[0042] (4) putting the copper nanoparticle ethanol solution into a centrifuge to separ...

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Abstract

The invention relates to a preparation method for a welding material with high thermal conductivity, high electrical conductivity and high connection performance based on copper nanoparticles. The preparation method comprises the following steps that the copper nanoparticles are mixed with glacial acetic acid at the room temperature, then the mixture is put into an ultrasonic dispersion machine, the mass-volume ratio of the copper nanoparticles to the glacial acetic acid is 375-625 g / L, and the copper nanoparticles are centrifugally separated after ultrasonic dispersion; the copper nanoparticles are washed with anhydrous ethanol, the mass-volume ratio of the copper nanoparticles to the ethanol is 500-800 g / L, washing is repeated for 6-8 times, and then the mixture is put into a centrifugeto separate the copper nanoparticles; drying, pressing and forming are carried out, and the copper nanoparticle welding material is obtained; and the welding material is put into a tubular furnace andsintered for 25-35 min, the sintering temperature is 30-200 DEG C, and the temperature rise rate in the tubular furnace is 8-12 DEG C / min. By the adoption of the preparation method, the thermal conductivity coefficient of the copper nanoparticle welding material can be increased, the electrical conductivity and connection performance of the copper nanoparticle welding material can be improved, sintering at the low temperature can be realized, a copper acetate coating is formed on the surfaces of the copper particles, and the oxidation resistance is good.

Description

technical field [0001] The invention belongs to the technical field of nanomaterial synthesis methods, and in particular relates to a preparation method of a copper nanoparticle-based welding material with high thermal conductivity and high connection performance. Background technique [0002] Microelectronic packaging copper-copper interconnection technology is a research hotspot in the United States, Japan and other technologically advanced countries, but the copper-copper interconnection structure technology faces many technical problems. With the development of nanotechnology, Lockheed Martin Space Systems Co., Ltd. In 2012, the Advanced Technology Center's (ATC) Advanced Materials and Nanotechnology Division developed a revolutionary nano-copper dielectric interconnect material. This dielectric material is based on a widely recognized law: when the particle size of metal particles is reduced to the nanometer scale, due to the positive increase in specific surface area, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/40
CPCB23K35/40
Inventor 黄丛亮吴东旭皇强强王誉凯
Owner CHINA UNIV OF MINING & TECH