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Method of manufacturing miniaturized switch filter

A switching filter and chip technology, which is applied in the manufacture of electrical solid-state devices, semiconductor devices, semiconductor/solid-state devices, etc., can solve the problems of large size and small size of switching filters, and achieve light weight, small size, and improved robustness. Effect

Inactive Publication Date: 2019-03-19
CETC DEQING HUAYING ELECTRONICS +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to solve the problem of relatively large volume of the switching filter in the prior art, and to provide a method for preparing a miniaturized switching filter. The prepared filter can be laminated and made into a patch shape with a smaller size , thinner and lighter

Method used

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  • Method of manufacturing miniaturized switch filter
  • Method of manufacturing miniaturized switch filter
  • Method of manufacturing miniaturized switch filter

Examples

Experimental program
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Effect test

Embodiment 1

[0036] A method for preparing a miniaturized switching filter, comprising the steps of:

[0037] S1. Prepare the chip and the substrate of the switching filter, the chip is provided with a plurality of metal pads in an array, and the substrate is correspondingly provided with a plurality of metal pads; the surface of the chip metal pads is gold-plated, and the substrate metal pad The surface of the disc is plated with gold; the substrate is a silicon substrate with a metal layer on the upper surface of the silicon substrate, the metal layer is gold, and the thickness of the metal layer is 1 micron.

[0038] S2. Using a ball planting machine to prepare gold bumps on the chip pads:

[0039] Plant balls on the metal pads of the chip by gold wire ball bonding to make gold bumps. The purity of the gold wires is required to be 99.99%, and the diameter of the gold wires is 25 μm; the height of the gold bumps is 30 μm, and the gold bumps The diameter is 60 μm, and the ball planting t...

Embodiment 2

[0046] A method for preparing a miniaturized switching filter, comprising the steps of:

[0047] S1. Prepare the chip and the substrate of the switching filter, the chip is provided with a plurality of metal pads in an array, and the substrate is correspondingly provided with a plurality of metal pads; the surface of the chip metal pads is gold-plated, and the substrate metal pad The surface of the disc is plated with gold; the substrate is a silicon substrate, and the upper surface of the silicon substrate has a metal layer, the metal layer is gold, and the thickness of the metal layer is 2 microns.

[0048] S2. Using a ball planting machine to prepare gold bumps on the chip pads:

[0049] Plant balls on the metal pads of the chip by gold wire ball bonding to make gold bumps. The purity of the gold wires is required to be 99.99%, and the diameter of the gold wires is 25 μm; the height of the gold bumps is 35 μm, and the gold bumps The diameter of the ball is 55 μm, and the bal...

Embodiment 3

[0054] A method for preparing a miniaturized switching filter, comprising the steps of:

[0055] S1. Prepare the chip and the substrate of the switching filter, the chip is provided with a plurality of metal pads in an array, and the substrate is correspondingly provided with a plurality of metal pads; the surface of the chip metal pads is gold-plated, and the substrate metal pad The surface of the disc is plated with gold; the substrate is a silicon substrate with a metal layer on the upper surface of the silicon substrate, the metal layer is gold, and the thickness of the metal layer is 1 micron.

[0056] S2. Using a ball planting machine to prepare gold bumps on the chip pads:

[0057] Plant balls on the metal pads of the chip by gold wire ball bonding to make gold bumps. The purity of the gold wires is required to be 99.99%, and the diameter of the gold wires is 25 μm; the height of the gold bumps is 40 μm, and the gold bumps The diameter of the ball is 70 μm, and the bal...

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Abstract

The invention relates to a method of manufacturing a miniaturized switch filter, which belongs to the technical field of switch filters. The method of manufacturing the miniaturized switch filter comprises the following steps: S1, a switch chip and a substrate are manufactured, wherein multiple metal pads are arrayed on the chip, and multiple metal pads are correspondingly arranged on the substrate; S2, a ball mounter is adopted to manufacture golden bumps on the metal pads of the chip; and S3, flip chip mounting and welding are carried out: a welding technology is adopted to enable the goldenbumps of the chip in the second step to be subjected to flip chip and welding on the metal pads of the substrate, and the chip is connected with the substrate through the golden bump array. The filter manufactured in the invention is smaller, thinner and lighter; the performance is improved, short interconnection reduces inductance, capacitance and resistance, and the signal integrity and the frequency characteristics are better; and the method has a simple process, the operability is strong, the operation process is simple and convenient, the application range is wide, the applicability is strong, and a feasible method is provided for miniaturization of the switch filter.

Description

technical field [0001] The invention relates to the technical field of switching filters, in particular to a method for preparing miniaturized switching filters. Background technique [0002] Switch filtering is widely used in microwave systems and is an essential part of electronic systems such as phased array radar and electronic countermeasures. Its role is to complete the selection of radar receiving frequency and the suppression of heteroharmonics. The switch filter bank is composed of multiple switch filters, which can be switched to the required band through the switch bank, which can meet the requirements of broadband communication. The traditional switch filter components are relatively large in size, and miniaturization is the main bottleneck of the switch filter components. [0003] With the miniaturization, light weight, thinning, high performance, increase of I / O terminals and the development of functional diversification of switching filter products, the tradi...

Claims

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Application Information

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IPC IPC(8): H01L21/60H01L21/607H03H1/00
CPCH01L24/81H01L2224/81205H01L2224/81207H03H1/00H03H2001/0064H01L2224/16225
Inventor 田飞飞周明张君直李勇刘清君
Owner CETC DEQING HUAYING ELECTRONICS