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Low-cost polysulfone alloy

A low-cost, polysulfone technology, applied in the field of low-cost polysulfone alloys, can solve the problems of reduced heat resistance and mechanical properties, and achieve the effects of improving toughness and modulus, reducing costs, and excellent comprehensive performance.

Active Publication Date: 2019-03-22
NINGBO INST OF MATERIALS TECH & ENG CHINESE ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The Chinese patent document with publication number CN105273405A discloses a characteristic polysulfone, including: polysulfone resin 40-60g, glass fiber 20-50g, weather resistance agent 0.1-0.3g, dimethylacetamide 0.2-2.8g, N- Methylpyrrolidone 0.2-1.8g, but this patent only improves the weather resistance of polysulfone, and its heat resistance and mechanical properties will be reduced to a certain extent

Method used

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Examples

Experimental program
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Effect test

Embodiment 1

[0040] (1) Blast dry PSU resin and polycarbonate resin (PC) at 150°C for 4-5 hours, then dry the dried PSU resin, PC with compatibilizer POE-GMA, antioxidant and other additives Put it into an 80°C high-mixer and mix it at 200rpm for 8 minutes. The high-temperature friction can make some additives adhere to the PC surface. The mass fraction and proportion of the above components are shown in Table 1. The weight average molecular weight of PSU resin is 53,000, and the melt index of PC is 12g / 10min.

[0041] (2) Extrude and granulate the mixture obtained in step (1) in a low-shear twin-screw extruder. The temperature of zone 5 and zone 5 is 270, 280, 290°C respectively; the temperature of zone 6 and zone 7 is 305°C and 305°C; the temperature of the head is 300°C; the screw speed is 200r / min.

Embodiment 2

[0043] The preparation process is the same as in Example 1, the difference is that the ratio of PSU to PC is different, and the mass fraction and proportion of other components are shown in Table 1; the temperature settings of the twin-screw are as follows: the temperatures in the first zone and the second zone are 250 and 260°C respectively , the temperatures in the third, fourth and fifth zones are 275, 285 and 295°C respectively, the temperatures in the sixth and seventh zones are 310 and 320°C respectively, and the head temperature is 310°C; the screw speed is 300r / min.

[0044] The weight average molecular weight of PSU resin is 53,000, and the melt index of PC is 12g / 10min.

Embodiment 3

[0046] The preparation process is the same as in Example 1, the difference is that the ratio of PSU to PC is different, and the mass fraction and proportion of other components are shown in Table 1; the temperature settings of the twin-screw are as follows: the temperatures in the first zone and the second zone are 250 and 260°C respectively , the temperatures in the third, fourth and fifth zones are 280, 290 and 300°C respectively, the temperatures in the sixth and seventh zones are 315 and 325°C respectively, and the head temperature is 310°C; the screw speed is 250r / min.

[0047] The weight average molecular weight of PSU resin is 53,000, and the melt index of PC is 12g / 10min.

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Abstract

The invention discloses a low-cost polysulfone alloy. The alloy is prepared from the following raw materials by mass percent: 40-70% of polysulfone resin, 20-40% of polycarbonate resin, 0-30% of glassfiber, 3-8% of a compatibilizer and 0.5-2.0% of an auxiliary agent. According to the polysulfone alloy provided by the invention, the cost is reduced when the advantages of high temperature resistance and mechanical properties of the polysulfone resin are maintained simultaneously, the added polycarbonate significantly reduces the processing temperature of the polysulfone resin, the highest processing temperature is lowered from 340-370 DEG C to 305-340 DEG C, meanwhile, the good melt fluidity is maintained, the energy consumption is reduced when the production efficiency is maintained, and the service life of equipment is prolonged.

Description

technical field [0001] The invention belongs to the field of special polymer materials and polymer molding processing, and in particular relates to a low-cost polysulfone resin. Background technique [0002] Polysulfone resin contains hydrocarbon group-SO in the main chain of the molecule 2 -The non-crystalline thermoplastic polymer of the hydrocarbon-based chain segment has excellent mechanical properties, high rigidity, wear resistance, and high strength. It can also maintain its excellent mechanical properties at -100-150 ° C. The long-term use temperature of polysulfone reinforced by filling is as high as 160°C, short-term use temperature is 190°C. Hydrolysis resistance, good dimensional stability, small molding shrinkage, non-toxic, radiation resistance, and a certain self-flame retardant effect. It has excellent electrical properties in a wide range of temperature and frequency. Therefore, it is widely used in fire helmets, medical appliances, feeding bottles, and h...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L81/06C08L69/00C08K7/14
CPCC08K2201/003C08L81/06C08L2201/08C08L2205/03C08L69/00C08K7/14
Inventor 龙昱黄骏成那海宁张若愚朱锦
Owner NINGBO INST OF MATERIALS TECH & ENG CHINESE ACADEMY OF SCI
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