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High-performance conductive silver paste

A conductive silver paste, high-performance technology, applied in the direction of conductive materials dispersed in non-conductive inorganic materials, etc., can solve the problems of electromigration, restrictions on the popularization and application of conductive paste, expensive use of silver, etc.

Active Publication Date: 2019-03-22
TAIYUAN HYPERION NEW MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, at present, most of the conductive pastes with better comprehensive performance use high-content silver powder as the conductive filler. Due to the high use cost of silver and the characteristics of easy electromigration, the popularization and application of conductive pastes is limited.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0050] Weigh 9g of acrylic resin BR115 (Mr=5500) and 75g of propylene glycol methyl ether propionate into a three-necked flask, raise the temperature to 70°C, stir at a speed of 400r / min, and stir for 30min until the resin is completely dissolved. Put it into a closed container and drop to room temperature for subsequent use to obtain the mixture;

[0051] 28g of flake silver powder (particle size is 8μm), 3g of nano-iron powder (particle size of 5nm), 69g of the above mixture are added to the container, and 1g of nano-silver carbonate, 0.5g of Sbarron 6650 and 0.5g of Tween-80, using a high-speed disperser to premix for 10 minutes to obtain a premix;

[0052] The above-mentioned premix is ​​ground with a three-roll machine. When grinding, the coarse roll is performed twice, and then the three-roll machine is adjusted, and the fine roll is performed five times. The detection fineness is 8 microns, and the material is collected to obtain low-silver high-performance conductive ...

Embodiment 2

[0057]Weigh 6g of polyurethane resin HK-651 (500±1000mPa.s), 1g of rosin resin, 1g of epoxy resin DER664UE (epoxy equivalent 860-930), and 70g of triethylene glycol methyl ether into a three-necked flask , heated up to 70°C, stirred at a speed of 400r / min, and stirred for 30min until the resin was completely dissolved, then poured into a closed container and lowered to room temperature for later use, to obtain a mixture;

[0058] Add 32g of flaky silver powder (with a particle size of 8μm), 2g of nickel nanospheres (with a particle size of 3nm), and 66g of the above-mentioned mixture into the container, while adding 1g of 9,10-epoxy octadecatrienoic acid, 0.3g Organobentonite, 0.2g of Tego-20 dispersant, premixed for 10min using a high-speed disperser to obtain a premix;

[0059] The above-mentioned premix is ​​ground with a three-roll machine. When grinding, the coarse roll is first carried out 2 times, and then the three-roll machine is adjusted, and the fine roll is carried...

Embodiment 3

[0064] Weigh 4g of bisphenol F epoxy resin REF-170 (epoxy equivalent 160~180), 1g of associative 2026 thickener, 35g of isophorone, and 25g of diacetone alcohol into a three-necked flask, Raise the temperature to 70°C, stir at a speed of 400r / min, and stir for 30min until the resin is completely dissolved, then pour it into a closed container and cool it down to room temperature for later use to obtain a mixture;

[0065] Add 35g of flake silver powder (with a particle size of 2μm), 5g of nano-copper powder (with a particle size of 3nm), and 60g of the above mixture into the container, while adding 3g of eicosatrienoic acid, 0.4g of organic diatomaceous earth and 0.2 g of WT-102 thickener, using a high-speed disperser to premix for 10 minutes to obtain a premix;

[0066] The above-mentioned premix is ​​ground with a three-roll machine. When grinding, the coarse roll is first carried out 2 times, and then the three-roll machine is adjusted, and the fine roll is carried out 5 ti...

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Abstract

The invention provides a high-performance conductive silver paste, which comprises the following components in parts by weight: 15-50 parts of silver powder, 0.1-10 parts of nano-scale metal powder, 2-12 parts of resin, 38-83 parts of an organic solvent, 0.1-5 parts of a compound and 0-5 parts of an additive, wherein the granularity of the silver powder is 2-10 [mu]m; the granularity of the nano-scale metal powder is 1-1000nm; and the compound includes one or more of metal acid salt and unsaturated fatty acid compounds. In the high-performance conductive silver paste provided by the invention,the micron-scale silver powder and the nano-scale metal powder are used in a matched manner to serve as a conductive filler, the compound with specific components is contained at the same time, and the conductive silver paste is enabled to have good conductive performance under the comprehensive effect of the metal powder with different granularities and the compound with specific components.

Description

technical field [0001] The invention relates to the technical field of silver paste, in particular to a high-performance conductive silver paste. Background technique [0002] In recent years, with the rapid development of the electronics industry, the demand for electronic products such as membrane switches, flexible printed circuit boards, electromagnetic shields, potentiometers, radio frequency identification systems, and solar cells has increased rapidly. The development and application of key functional materials for components have also attracted widespread attention. According to analysis, only in terms of the conductive silver paste market, it has a market size of billions of dollars every year. During the rapid development of the information industry, slurry plays an important role as a key material. High-performance, low-cost paste can greatly improve the competitiveness of products, which is an inevitable trend in the development of electronic paste. [0003] T...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22
CPCH01B1/22
Inventor 黄翟
Owner TAIYUAN HYPERION NEW MATERIAL CO LTD
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