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Phosphorus-containing epoxy resin composition and prepreg and laminated board prepared by using phosphorus-containing epoxy resin composition

An epoxy resin and prepreg technology, applied in synthetic resin layered products, applications, chemical instruments and methods, etc., can solve the problems of resin reaction, high water absorption, and high water absorption of resin system

Active Publication Date: 2019-03-29
SHENGYI TECH SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the high water absorption rate of the DOPO ring under high temperature, high humidity or alkaline conditions, it affects the dielectric properties and heat and humidity resistance of the circuit board.
[0004] On the other hand, the additive flame retardants in the prior art are all physically blended in the resin system and cannot react with the resin, resulting in high water absorption and poor heat resistance of the resin system

Method used

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  • Phosphorus-containing epoxy resin composition and prepreg and laminated board prepared by using phosphorus-containing epoxy resin composition
  • Phosphorus-containing epoxy resin composition and prepreg and laminated board prepared by using phosphorus-containing epoxy resin composition
  • Phosphorus-containing epoxy resin composition and prepreg and laminated board prepared by using phosphorus-containing epoxy resin composition

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0067] With DOPO (structural formula 4) 21.6g, with 3-isocyanatopropyl trimethoxysilane 20.5g, methylene chloride 70g, triethylamine 0.2g, join in the four-port reactor that is equipped with stirring condensation equipment and nitrogen, The temperature was raised to 110° C., the reaction was carried out for 8 hours, and the dichloromethane was distilled off under reduced pressure to obtain powder DOPO-3-isocyanatopropyltrimethoxysilane.

Synthetic example 2

[0069] 324g of DOPO-HQ (structural formula 5), ​​41g of 3-isocyanatopropyltrimethoxysilane, 100g of xylene, and 0.25g of triethylamine were added to the four-port reaction kettle equipped with stirring and condensing equipment and nitrogen, and the temperature was increased. At 140°C, the reaction was carried out for 6 hours, and the xylene was distilled off under reduced pressure to obtain powder DOPO-HQ-3-isocyanatopropyltrimethoxysilane.

Synthetic example 3

[0071] With DOPO-NQ (structural formula 6) 374g, and 3-isocyanatopropyl trimethoxysilane 41g, toluene 100g, triethylamine 0.3g, join in the four-port reaction kettle equipped with stirring and condensing equipment and nitrogen, be warming up to The reaction was carried out at 180° C. for 7 hours, and the toluene was distilled off under reduced pressure to obtain powder DOPO-NQ-3-isocyanatopropyltrimethoxysilane.

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PUM

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Abstract

The invention discloses a phosphorus-containing epoxy resin composition, which comprises the following ingredients (by weight): (A) 100 parts of phosphorus compound modified epoxy resin; and (B) 0-100parts of a curing agent. The phosphorus-containing epoxy resin composition is halogen-free and flame-retardant, and has characteristics of high damp heat resistance, low water absorption, high fire resistance, high peel strength and good dielectric property. A prepreg and a laminated board prepared by using the phosphorus-containing epoxy resin composition are both halogen-free and flame-retardant and have characteristics of high damp heat resistance, low water absorption, high fire resistance, high peel strength and good dielectric property, and can be used as a printed wiring board for electronic instruments.

Description

technical field [0001] The invention relates to a phosphorus-containing epoxy resin composition and a prepreg and a laminate prepared by using the same, belonging to the technical field of electronic materials. Background technique [0002] In the prior art, traditional brominated flame retardants, such as brominated epoxy resin, tetrabromobisphenol A, etc., have excellent flame retardancy and relatively low price, and have always been the main flame retardants for common FR-4 copper clad laminates. However, with the improvement of people's quality of life and safety awareness, people have higher and higher requirements for the safety of electronic products around them. Brominated flame retardants produce irritant and corrosive toxic gases such as dioxins and polybrominated dibenzofurans, hydrogen bromide, during the combustion process, which endangers people's health and causes pollution. In addition, due to the weak bond energy of the carbon-bromine bond in the brominated...

Claims

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Application Information

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IPC IPC(8): C08G59/14C08G59/62C08G59/40C08G59/50C08K3/36C08J5/24B32B15/092B32B15/20B32B27/04B32B27/38B32B33/00
CPCB32B15/092B32B15/20B32B33/00B32B2260/021B32B2260/046B32B2307/306B32B2307/3065B32B2457/08C08G59/1488C08G59/4014C08G59/504C08G59/62C08J5/24C08J2363/00C08K3/36
Inventor 马建陈诚崔春梅何继亮黄荣辉杨宋储正振
Owner SHENGYI TECH SUZHOU
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