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Copolyamide hot melt adhesive and preparation method thereof

A copolyamide and hot-melt adhesive technology, which is applied in adhesives, adhesive additives, non-polymer adhesive additives, etc., can solve the problems of non-elastic deformation and low elastic recovery rate, and achieve high elastic recovery rate and ensure adhesion. Bonding effect, high yield strength effect

Inactive Publication Date: 2019-03-29
SHANGHAI TIANYANG HOT MELT ADHESIVE CO LTD +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the common copolyamide hot melt adhesives on the market are used in the form of film, strip or fiber, due to their low elastic recovery rate, they are prone to inelastic deformation after being stressed.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] A hot-melt copolyamide whose raw materials include: 67.8g of caprolactam, 109.5g of adipic acid, 86.1g of hexamethylenediamine, 15g of PEG400, 0.139g of tetrabutyl titanate, and 0.53g of antioxidant (brand 1010).

[0026] The preparation method of above-mentioned copolyamide hot-melt adhesive, the steps are as follows:

[0027] (1) Referring to the composition of the raw materials, put caprolactam, adipic acid, and hexamethylenediamine into the reaction kettle, first replace it with nitrogen twice, slowly raise the temperature to 120°C, start stirring, and continue to heat up to 230°C, when the pressure reaches After 1.3MPa, keep the pressure between 1.3MPa and 1.5MPa, the temperature between 230°C and 250°C, and react for 1.5h;

[0028] (2) After slowly releasing the pressure to normal pressure for 1 hour, add PEG400 and tetrabutyl titanate, and then keep the temperature between 230°C and 250°C for 2 hours;

[0029] (3) Control the temperature within the range of 240°...

Embodiment 2

[0033] A copolyamide hot-melt adhesive whose raw materials include: 67.8g of caprolactam, 101g of sebacic acid, 84.3g of decanediamine, 6g of PEG600, 0.259g of tetrabutyl titanate, and 1.3g of antioxidant (brand 168).

[0034] The preparation method of the above-mentioned copolyamide hot-melt adhesive is the same as in Example 1.

[0035] A sample of the product prepared by Example 2 is labeled A2.

Embodiment 3

[0037] A kind of copolyamide hot-melt adhesive, its raw material composition comprises: laurolactam 70.9g, dodecanedioic acid 103.5g, dodecanediamine 85.5g, PTMG600 13.5g, and tetrabutyl titanate 0.137g, anti- Oxygen agent (grade 1096) 0.546g.

[0038] The preparation method of the above-mentioned copolyamide hot-melt adhesive is the same as in Example 1.

[0039] A sample of the product prepared by Example 3 is labeled A3.

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Abstract

The invention relates to a copolyamide hot melt adhesive and a preparation method thereof, and especially relates to a copolyamide hot melt adhesive with a high elastic recovery rate and a high yieldstrength, and a preparation method thereof. Raw materials of the copolyamide hot melt adhesive comprise a main material and an auxiliary material, and the main material is composed of aliphatic lactam, aliphatic dicarboxylic acid, aliphatic diamine and polyether polyol; and a ratio of the aliphatic lactam to the aliphatic dicarboxylic acid to the sum of the moles of the aliphatic diamine and the polyether polyol is (0.8-1.3):1:(0.98-1), and a molar ratio of the aliphatic diamine to the polyether polyol is 1:(0.02-0.05). The introduction of an elastic aliphatic polyether segment reduces the steric hindrance of the movement of polymer molecules and provides a certain elasticity, so the copolyamide hot melt adhesive prepared in the invention has the advantages of good bonding effect, good elastic recovery rate and high yield strength.

Description

technical field [0001] The invention relates to a copolyamide hot-melt adhesive and a preparation method thereof, in particular to a copolyamide hot-melt adhesive with relatively high elastic recovery rate and yield strength and a preparation method thereof. Background technique [0002] Polymer emulsion-based adhesives and solvent-based adhesives are two common forms of adhesives. During their production and use, they are often accompanied by the use and volatilization of solvents, which bring certain environmental hazards. With the continuous development of my country's industrialization process, environmental issues have become a problem that cannot be underestimated. With the country's increasing requirements on the environment and emissions, all walks of life should choose more environmentally friendly adhesives. [0003] Hot melt adhesives are mainly composed of thermoplastic polymers. Compared with polymer emulsions and solvent-based adhesives, there are no problems ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J177/00C09J11/06C08G69/36
CPCC08G69/36C09J11/06C09J177/00C08K5/134
Inventor 林一流郑仁峰
Owner SHANGHAI TIANYANG HOT MELT ADHESIVE CO LTD
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