Microporous array processing device and microporous array processing method

Abstract

The invention discloses a microporous array processing device and a microporous array processing method. The microporous array processing method comprises the following steps of S1, converting a laserbeam into Bessel spots by means of an axicon principle, and focusing the spots to the surface of a to-be-processed component; S2, adjusting the axicon according to a microporous array needed by the to-be-processed component to obtain quantity and distribution of the needed spots; and S3, processing the spots to the to-be-processed component by means of laser pulse to form the microporous array. The microporous array processing device comprises a laser light source, a light source adjusting assembly, the axicon and a moving table successively arranged along the direction of propagation of light, wherein the axicon is mounted on a five-axis precision rotary table and is driven by the five-axis precision rotary table to adjust the angle the axicon and an incident beam. The microporous arrayprocessing device and the microporous array processing method process multiple micropores at single time, so that the work efficiency is improved. The heat effect is relatively long, the action of pulse laser is small, and the quality of a processed material is improved.

Description

technical field [0001] The invention relates to the field of microhole array processing, in particular to a microhole array processing device and method. Background technique [0002] The processing and manufacturing of micropores plays an extremely important role in related fields such as aviation, aerospace, and microfluidic devices. With the continuous development of laser technology, it is of great practical significance to apply laser technology to micropore manufacturing. Laser microhole manufacturing overcomes the influence of mutual contact of previous mechanical processing technologies, and will not cause mechanical damage to the processed material, nor will it cause fracture damage due to the hardness of the processed material, so it has a good application prospect. [0003] Such as figure 1 As shown, the prior art discloses a laser microhole array processing device, including a laser system 1 arranged in sequence along the light propagation direction for generati...

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Problems solved by technology

[0003] like figure 1 As shown, the prior art discloses a laser microhole array processing device, including a laser system 1 arranged in sequence along the light propagation direction for generating laser light; a half-wave plate and a polarization 2 for adjusting laser energy; a pyramid Prism 3 is used to produce Bessel spot; Reflector 5; Plano-convex lens 4 and focusing objective lens 6 form telescopic system, described Bessel beam is narrowed into micro-Bessel beam; Motion table 7 is used for placing and Adjust the components to be processed. This device mainly processes the microhole array through the high-speed movement of the moving table 7, but only one hole is processed at a time, and in order to control the size of the heat-affected zone, a smaller laser single pulse energy is generally used. , and then perform micro-hole processing by layer-by-layer scanning, this processing method seriously affects the improvement of productivity

[0004] In the prior art, microhole array processing is also performed by using the rotating motion of the scanning galvanometer, which is similar to the above-mentioned method. It is a single single hole processing, and multiple microholes cannot be processed at the same time; In order to reduce the heat-affected zone, the pulse energy of the laser is controlled within a small range, which also affects the improvement of processing efficiency.

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