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An ultra-low dielectric loss polyimide film

A technology of polyimide film and dielectric loss factor, which is applied in the direction of synthetic resin layered products, chemical instruments and methods, layered products, etc., can solve the problems that it is difficult to meet the requirements of the dielectric properties of materials, and achieve low dielectric loss , Excellent dielectric loss, improved bonding effect

Active Publication Date: 2020-07-03
RAYITEK HI TECH FILM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, ordinary polyimide films are difficult to meet the requirements of the electronic industry for the dielectric properties of materials in the future 5G era

Method used

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  • An ultra-low dielectric loss polyimide film
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  • An ultra-low dielectric loss polyimide film

Examples

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preparation example Construction

[0040] Preparation method of ultra-low dielectric loss multilayer polyimide film

[0041] 1. Preparation of core polyimide film

Embodiment 11

[0043]In a 500ml four-necked flask equipped with heating, cooling and internal stirring devices, nitrogen gas was continuously passed through, 220g of N-methylpyrrolidone was added and heated to 60°C, and 0.02mol of 1,3-bis(3-trifluoro Methyl-4-aminophenoxy)benzene, 0.06mol of 4,4'-diaminooctafluorobiphenyl and 0.02mol of 1,3-bis(4-aminophenoxy)neopentane were stirred to make the above The diamine is completely dissolved. 0.0995 mol of 2,3,3',4'-biphenyltetracarboxylic dianhydride was added step by step, kept in a nitrogen atmosphere, stirred and reacted at a constant temperature of 60°C for 6 hours, and then the resin synthesis reaction was completed to obtain a polyamic acid resin. After finishing the reaction, the polyamic acid resin is defoamed and then coated under a vacuum condition of vacuum degree -0.1 MPa. According to the coating process, the heating rate is 10 ℃ / min, rising from 60 ℃ to 390 ℃, and keeping it for 5 minutes after reaching the temperature, completing ...

Embodiment 12

[0045] According to the method of embodiment 1.1, wherein 2,3,3',4'-biphenyltetracarboxylic dianhydride is changed to 4,4'-(hexafluoroisopropene)tetracarboxylic dianhydride (6FDA), and other conditions remain unchanged , to obtain polyamic acid resin. In the coating process, the heating rate is 10°C / min, from 60°C to 330°C. After reaching the temperature, keep it for 5 minutes to complete thermal imidization, and then slowly cool to room temperature to obtain a core polyimide film.

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Abstract

The invention provides a polyimide film with ultralow dielectric loss and a preparation method thereof, the polyimide film is capable of being directly adhered to a copper foil, the polyimide film comprises a core layer and a surface layer, or the polyimide film comprises two surface layers and a core layer which is sandwiched between the two surface layers, the dielectric loss factor of the polyimide film at 10GHz test frequency is 0.0030-0.0060, and the dielectric constant is less than 3.0.

Description

technical field [0001] The invention relates to a multi-layer polyimide film material with ultra-low dielectric loss. Background technique [0002] At present, the widespread popularization of mobile services has brought about a surge in mobile and wireless traffic, and an explosive growth in the amount of information. The deployment of 4G networks is in full swing, and the research on 5G has also begun. Many countries or organizations are actively conducting , with the advancement of time, 5G technology will be commercialized after 2020. In the future, 5G technology will bring people's communication life to a new stage, and will be able to meet the needs of the rapid development of mobile Internet services in the future, bringing users Come for a new experience. At present, 4G technology has greatly improved the data rate. It can achieve a transmission speed of 1Gb / s when it is still and a transmission speed of 100Mbit / s when it is moving. 5G will enable faster transfer r...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B27/28B32B27/18B32B27/08C08G73/10C08J5/18C08L79/08
CPCB32B27/08B32B27/18B32B27/281B32B2307/734C08G73/1007C08G73/106C08G73/1071C08J5/18C08J2379/08
Inventor 李磊袁舜齐何志斌
Owner RAYITEK HI TECH FILM CO LTD
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