Diamond sheet grinding wheel

Abstract

The invention provides a diamond sheet grinding wheel. The diamond sheet grinding wheel comprises, by size ratio, 25% of diamond abrasive material, 45% of resin binder, 10% of copper powder, 4% of zinc oxide, 6% of chromium oxide, 10% of SiC micro powder and cresol. The diamond abrasive material is prepared by compounding any one of an abrasive material with the particle size being 107-139 micrometers and an abrasive material with the particle size being 5-10 micrometers, 35-45 micrometers or 65-85 micrometers. On the basis of the same formula, by adjusting different diamond particle size ratios, the optimal particle size parameter suitable for the formula is determined. Under the circumstance that the size ratio of the resin binder diamond grinding wheel formula is determined, the abrasive material with the fine particle size is mixed into the diamond abrasive material with the rough particle size to manufacture the diamond sheet grinding wheel, although the grinding effect of diamondwith the fine particle size is weak, the transition and replacement function is achieved after mixing with the diamond with the rough particle size, the distance among particles is increased, abrasive to a metal sintered body due to abrasive dust is reduced, and the grinding effect is better than that of an abrasive material with the single rough particle size.

Description

technical field

[0001] The invention relates to the field of thin-slice grinding wheels, and more specifically relates to a formula and a preparation method of a diamond thin-slice grinding wheel material. Background technique

[0002] Resin bonded diamond flake grinding wheel uses resin powder as a bonding agent to bond diamond abrasives together, add a certain amount of filler material, and go through hot pressing molding, curing, etc. a tool. The thickness is usually between 1~5mm or even thinner. Thin slice grinding wheels are mainly used for precision grooving or cutting of metal and non-metal materials in metallurgical industry, building materials industry, machinery industry, automobile industry, aerospace industry, shipbuilding industry, and silicon, germanium, sapphire, graphite, ceramics, etc. in the semiconductor industry. processing. With the rapid development of semiconductor information technology and photovoltaic technology, the cutting requirements for pre...

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