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Preparation method of polyurethane modified phenolic resin composition for semiconductor packaging

A technology of polyurethane modification and phenolic resin, which is applied in the direction of epoxy resin glue, adhesive type, adhesive, etc., can solve the problems of poor compatibility, high interfacial tension, and inability to take into account other properties of materials, and achieve weather resistance and mechanical properties. Excellent strength, reduced stress, lower dielectric constant and lower water absorption

Active Publication Date: 2019-04-26
NINGBO DUNHE TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is prepared solely by adding organic fluorine or single-phase phenolic solidification. The interfacial tension of the two phases of organic fluorine and phenolic formaldehyde in the material is too large, the compatibility is poor, and other properties of the material cannot be considered.

Method used

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  • Preparation method of polyurethane modified phenolic resin composition for semiconductor packaging
  • Preparation method of polyurethane modified phenolic resin composition for semiconductor packaging

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Add 450ml of isopropanol, 336g of hexafluorobisphenol A, 100g of bisphenol A to a 2-liter reaction kettle with a thermometer, a stirrer and a reflux condenser, and stir at 60°C to make the hexafluorobisphenol A and bisphenol A fully dissolve. Then 5 g of oxalic acid was added and the temperature was raised to 80°C. Add a total of 90g of paraformaldehyde in batches, about 10g for the first feeding, and about 8g for each subsequent feeding. Control the feeding time within 45 minutes. After feeding, the temperature was raised to 95°C, and the reaction was vigorously stirred for about 5 hours. The temperature was raised to 160° C., and the mixture was distilled under reduced pressure under a vacuum of -0.8 MPa, and the solvent was condensed and recovered through a condenser to obtain a fluorine-containing phenolic resin preparatory solution.

[0029] Add isophorone diisocyanate (IPDI) and polyphenolic propane into another reaction kettle in a molar ratio of 2:1, and reac...

Embodiment 2

[0031] Add 450 ml of toluene, 400 g of trifluoromethyl phenol, 50 g of phenol and 8 g of benzoic acid to a 2-liter reaction kettle with a thermometer, a stirrer and a reflux condenser, and stir at 60°C to fully dissolve the trifluoromethyl phenol and phenol. . Then 8 g of benzoic acid were added and the temperature was raised to 80°C. Then 60 g of paraformaldehyde was dissolved in methanol at a ratio of 1:6, and added to the trifluoromethylphenol and phenol solution at a drop rate of 1 drop per second. Control the feeding time within 45 minutes. After feeding, the temperature was raised to 95°C, and the reaction was vigorously stirred for about 5 hours. The temperature was raised to 160° C., and the mixture was distilled under reduced pressure under a vacuum of -0.8 MPa, and the solvent was condensed and recovered through a condenser to obtain a fluorine-containing phenolic resin preparatory solution.

[0032] Toluene diisocyanate (TDI) and polyethylene glycol were added in...

Embodiment 3

[0034] Add 450 ml of toluene and 500 g of hexafluorobisphenol A, 250 g of p-cresol and 6 g of salicylic acid into a 2-liter reactor with a thermometer, a stirrer and a reflux condenser at the same time, and stir at 60 °C to make hexafluorobisphenol A. Phenol A and p-cresol were fully dissolved. Then 6 g of salicylic acid was added and the temperature was raised to 80°C. Then, 90 g of paraformaldehyde was dissolved in methanol at a ratio of 1:6, and added to the solution of hexafluorobisphenol A and p-cresol at a drop rate of 1 drop per second. Control the feeding time within 45 minutes. After feeding, the temperature was raised to 95°C, and the reaction was vigorously stirred for about 5 hours. The temperature was raised to 160° C., and the mixture was distilled under reduced pressure under a vacuum of -0.8 MPa, and the solvent was condensed and recovered through a condenser to obtain a fluorine-containing phenolic resin preparatory solution.

[0035] Add isophorone diisocy...

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Abstract

The invention provides a preparation method of polyurethane modified phenolic resin. The obtained polyurethane modified phenolic resin is suitable for semiconductor packaging. According to the methodprovided by the invention, an organic fluorine group and a polyurethane group are bonded in a phenolic resin compound through chemical bonds by controlling a ratio of the organic fluorine group to thepolyurethane group in the phenolic resin, thereby realizing effective dispersion of the organic fluorine group and the polyurethane group in phenolic resin, and the mechanical properties and surfaceproperties of a polyurethane modified phenolic resin material can be effectively adjusted. By applying the polyurethane modified phenolic resin as a curing agent to modification of an epoxy resin composition, the modulus of the epoxy resin composition can be greatly reduced, and meanwhile, the processability and solder resistance of the epoxy resin composition in the semiconductor packaging can beimproved. The polyurethane modified phenolic resin for semiconductor packaging provided by the invention also has necessary fluidity, filling property and flame retardancy.

Description

technical field [0001] The invention relates to the field of composite materials, in particular to a preparation method of a polyurethane-modified phenolic resin composition for semiconductor encapsulation. Background technique [0002] Epoxy resin, as one of the three general-purpose thermosetting resins, has been paid more and more attention by people and has been widely used in various fields. Epoxy resin contains unique active groups and polar groups such as epoxy groups, hydroxyl groups, ether bonds, etc., so it has many excellent properties and is widely used as semiconductor packaging materials, coatings, adhesives, molding materials, The matrix resin of fiber-reinforced composite materials is currently the most widely used matrix resin of high-performance composite materials. In order to meet the special requirements of materials for new use environments, people began to develop special epoxy resins. [0003] As a curing agent for epoxy resins, phenolic resins are ...

Claims

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Application Information

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IPC IPC(8): C08G8/28C08G59/62C09J163/00
CPCC08G8/28C08G59/62C09J163/00
Inventor 赵艳朱婷
Owner NINGBO DUNHE TECH CO LTD
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