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UV (ultraviolet) curing glue with high glass-transition temperature

A technology with transition temperature and high vitrification, applied in the field of curing glue, can solve the problems of low production efficiency, high cost, consumption, etc., and achieve the effect of physical protection and high hardness

Inactive Publication Date: 2019-05-10
广州聚达光电有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the molding compound process requires batch processing, it needs to be pressurized at high temperature to melt the solid epoxy molding compound for flow injection molding, preliminarily solidify and form in the mold, demould, and post-cure to complete the package, so the production efficiency is not high. The release agent And a large amount of consumption of epoxy molding compound leads to high cost

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] Embodiment 1: According to 3,4-epoxycyclohexylmethyl-3, the mass percent of 4-epoxycyclohexane carbonate is 65%, the mass percent of polycaprolactone is 32%, hexafluoroantimonate The mass percentage is 0.9%, and each raw material is added in turn, after adding the fumed silicon micropowder of 2% by mass, after defoaming and stirring, then adding 0.1% of the pigment whose absorption spectrum peak is 450~495nm visible light ( The pigment is shown as blue), after defoaming and stirring, it is filtered through a 200-mesh metal sieve and packed into a can. Use Philips 18-watt ultraviolet light for photocuring. The distance between the lamp and the sample is about 5 cm. When the sample with a thickness of about 0.5-0.6 mm completely changes from liquid to solid, it is called the time required for curing. It needs to be placed at room temperature for 24 hours, and the post-curing is completed, and the hardness will be slightly higher than when the light is completed. The hard...

Embodiment 2

[0020] Embodiment 2: According to 3, the mass percent of 4-epoxycyclohexylmethyl-3,4-epoxycyclohexane carbonate is 65%, the mass percent of polycaprolactone is 32%, hexafluoroantimonate The mass percentage is 0.9%, and each raw material is added in turn, after adding the fumed silicon micropowder of 2% by mass, after defoaming and stirring, then adding 0.1% of the pigment whose absorption spectrum peak is 495~570nm visible light ( The pigment is shown as green), after defoaming and stirring, it is filtered through a 200-mesh metal sieve, and canned. Use Philips 18-watt ultraviolet light for photocuring. The distance between the lamp and the sample is about 5 cm. When the sample with a thickness of about 0.5-0.6 mm completely changes from liquid to solid, it is called the time required for curing. It needs to be placed at room temperature for 24 hours, and the post-curing is completed, and the hardness will be slightly higher than when the light is completed. The hardness was ...

Embodiment 3

[0021] Embodiment 3: According to 3,4-epoxycyclohexylmethyl-3, the mass percent of 4-epoxycyclohexane carbonate is 65%, the mass percent of polycaprolactone is 32%, hexafluoroantimonate The mass percentage is 0.9%, each raw material is added in turn, after adding the fumed silicon micropowder which is 2% by mass, after defoaming and stirring, then add 0.1% by mass of the pigment of 570-590nm visible light (the pigment is shown as Yellow), defoamed and stirred evenly, filtered through a 200-mesh metal sieve, and packed into cans. Use Philips 18-watt ultraviolet light for photocuring. The distance between the lamp and the sample is about 5 cm. When the sample with a thickness of about 0.5-0.6 mm completely changes from liquid to solid, it is called the time required for curing. It needs to be placed at room temperature for 24 hours, and the post-curing is completed, and the hardness will be slightly higher than when the light is completed. The hardness was tested with a Shore D...

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PUM

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Abstract

The invention provides UV (ultraviolet) curing glue with high glass-transition temperature. The ultraviolet curing glue comprises, by weight, 20-45% of epoxy resin, 13-25% of polyhydric alcohol, 30-60% of silica powder, 0.5-2% of silicone coupling agents, 0.1-0.9% of photo-initiators and 0.01-0.9% of pigments, wherein the photo-initiators have absorbing capacity to ultraviolet light with the waveband of 325-365nm, and the pigments have absorbing capacity to visible light with the wave band of 400-800nm. The provided ultraviolet curing glue can be effectively cured through ultraviolet rays, the visible light cannot penetrate the ultraviolet curing glue, the ultraviolet curing glue is high in hardness and cab be used for sealing semiconductor integrated circuit devices, and a chip can be optically protected and can also be physically protected when the ultraviolet curing glue is used.

Description

technical field [0001] The invention relates to a curing glue, in particular to a UV curing glue with a high glass transition temperature. Background technique [0002] Encapsulation of semiconductor devices with liquid encapsulant can protect the chip. At present, the production of encapsulant usually uses black epoxy resin system, which adopts dispensing encapsulation and thermosetting molding. However, the encapsulant used for smart card encapsulation has different. The encapsulation of the smart card is strip-type and needs to be continuously advanced, which requires the smart card encapsulant to be cured in a short period of time, and the UV curing is completed at room temperature, and no temperature change will cause the smart card to deform Therefore, the encapsulation of the smart card should adopt UV light-cured encapsulant. [0003] With the promotion of smart cards such as second-generation ID cards and bank cards, the encapsulation of smart card modules has hig...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J167/00C09J11/04C09J11/06C09J11/08
Inventor 伍淼梁家和
Owner 广州聚达光电有限公司
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