High-precision electronics PUR (polyurethane resin) hot melt glue and preparation method thereof

A high-precision, hot-melt adhesive technology, used in adhesives, adhesive types, polyurea/polyurethane adhesives, etc., can solve problems such as degumming of plastic casings or circuit boards, expensive imported products, and poor universality. Achieving the effect of moderate price, outstanding low temperature resistance and low cost

Inactive Publication Date: 2019-05-10
SHANGHAI JORLE FINE CHEM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The electronics industry, especially the high-precision electronics industry, has high requirements for the bonding of PUR and plastic parts. Domestic products are prone to degu

Method used

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  • High-precision electronics PUR (polyurethane resin) hot melt glue and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] A PUR hot melt adhesive for high-precision electronics, its raw materials include isocyanate, synthetic resin and catalyst;

[0023] The synthetic resin is prepared from polyols and long-chain dibasic acids at 140° C. for 3 hours, and the mass ratio of polyols to dibasic acids is 100:75. The synthetic resin has a molecular weight of 1000-5000 and a functionality of 1.5. The polyhydric alcohol is 1,2 propanediol.

[0024] The isocyanate is toluene diisocyanate (TDI), and the total mole number of isocyanate is 1.01 times of the total mole number of hydroxyl groups.

[0025] A preparation method of PUR hot melt adhesive for high-precision electronics, prepared according to the following method:

[0026] S1. Synthetic resin and TDI are placed in the prepolymerization reactor, be heated to 40 ℃, after stirring while reacting for 1 hour, cooling, stirring does not stop during cooling, makes prepolymer; Described isocyanate is TDI (toluene Diisocyanate), the total number of...

Embodiment 2

[0029] A PUR hot melt adhesive for high-precision electronics, its raw materials include isocyanate, synthetic resin and catalyst;

[0030] The synthetic resin is prepared by reacting polyols and long-chain dibasic acids at 240° C. for 18 hours, and the mass ratio of polyols to dibasic acids is 100:225. The synthetic resin has a molecular weight of 1000-5000 and a functionality of 4. The polyol is trimethylolpropane.

[0031] The isocyanate is diphenylmethane diisocyanate (MDI), and the total mole number of the isocyanate is twice the total mole number of hydroxyl groups.

[0032] A preparation method of PUR hot melt adhesive for high-precision electronics, prepared according to the following method:

[0033] S1. Put synthetic resin, MDI, and chain extender in a prepolymerization reactor, heat to 150°C, react while stirring for 12 hours, then cool, and stir without stopping during cooling to obtain a prepolymer; The chain agent is 1,4 butanediol. The isocyanate is MDI (dip...

Embodiment 3

[0036] A PUR hot melt adhesive for high-precision electronics, its raw materials include isocyanate, synthetic resin and catalyst;

[0037] The synthetic resin is prepared by reacting polyols and long-chain dibasic acids at 200° C. for 10 hours, and the mass ratio of polyols to dibasic acids is 100:125. The synthetic resin has a molecular weight of 1000-5000 and a functionality of 2.5. The polyhydric alcohol is trimethylolpropane, and the dosage is 1% of the total moles of hydroxyl groups.

[0038] The isocyanate is hexamethylene diisocyanate (HDI), and the total mole number of the isocyanate is 1.5 times of the total mole number of hydroxyl groups.

[0039] A preparation method of PUR hot melt adhesive for high-precision electronics, prepared according to the following method:

[0040] S1. Put synthetic resin, HDI, and chain extender in a prepolymerization reactor, heat to 100°C, react while stirring for 6 hours, then cool, and stir without stopping during cooling to obtain...

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Abstract

The invention discloses a high-precision electronics PUR hot melt glue. The high-precision electronics PUR hot melt glue is composed of raw materials of isocyanate, synthetic resin and catalysts, wherein the synthetic resin is prepared by subjecting polyols and long-chain binary acids to reaction under action of chain extender at 140-240 DEG C for 3-18 hours, and the weight ratio of the polyols and the binary acids ranges between 100:75 and 100:225. The prepared high-precision electronics PUR hot melt glue can achieve high adhesion force on most low-polarity plastic base materials such ABS (acrylonitrile butadiene styrene), PA (polyamide) and PET (polyethylene terephthalate), is good in flexibility, outstanding in low temperature resistance, free from solvent, low in melting point, more environmentally friendly, safer, good in technical performance, low in cost and moderate in price, thereby having a broad application prospect.

Description

technical field [0001] The invention relates to the technical field of polymer materials, in particular to a PUR hot-melt adhesive for high-precision electronics and a preparation method thereof. Background technique [0002] Reactive polyurethane hot melt adhesive (PUR) is heated and melted into a fluid under the condition of inhibiting chemical reaction, so as to facilitate coating; after the two adherends are bonded, the glue layer coagulates to play a bonding role; Or the moisture attached to the surface of the adherend reacts with it and extends the chain to form a high-molecular polymer with high cohesion, which significantly improves the adhesion and heat resistance. It not only has the characteristics of solvent-free, high initial viscosity, and rapid positioning during assembly of hot-melt adhesives, but also has the properties of water resistance, temperature resistance, creep resistance, moisture resistance and medium resistance of reactive adhesives. [0003] At...

Claims

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Application Information

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IPC IPC(8): C09J175/06C08G18/66C08G18/42C08G18/32
Inventor 陈华朱博雅王轩
Owner SHANGHAI JORLE FINE CHEM
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