An organic-inorganic composite silicate high temperature resistant film-forming drilling fluid system
A composite silicate and organosilicate technology, applied in the field of drilling fluid, to achieve uniform film formation, good filtration loss reduction, and the effect of satisfying the well wall
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Embodiment 1
[0035] Example 1: The organic-inorganic composite silicate high temperature resistant film-forming drilling fluid system in this example contains methyl silicate with a concentration of 0.2mol / L and silicate C with a concentration of 0.06mol / L, and is prepared by the following steps Obtained: Add weighed methyl silicate and silicate C into 300mL of distilled water, stir magnetically for 20min, put them into a high-temperature reactor with 40g of cuttings, react at 180°C for 16h, and dry Weigh its quality after treatment, and observe the filming phenomenon on the surface of cuttings, see figure 1 .
Embodiment 2
[0036] Example 2: The organic-inorganic composite silicate high temperature resistant film-forming drilling fluid system in this example contains 2% organosilane by mass fraction and 1% silicate D by mass fraction, and is prepared by the following steps: Add the weighed organosilane and silicate D into 300mL of distilled water, stir magnetically for 20min, put it into a high-temperature reaction kettle with 40g of cuttings, react at 180°C for 16h, and weigh it after drying , and observe the film formation phenomenon on the surface of cuttings, see figure 2 .
Embodiment 3
[0037] Example 3: The organic-inorganic composite silicate high temperature resistant film-forming drilling fluid system in this example contains methyl silicate with a concentration of 0.2mol / L and silicate C with a concentration of 0.06mol / L, and is prepared by the following steps Obtained: Add weighed methyl silicate A and silicate C into 300mL of distilled water, stir magnetically for 20min, put them into a high-temperature reaction kettle with 40g of cuttings, react at 220°C for 16h, bake Weigh its mass after dry treatment, and observe the film formation phenomenon on the surface of cuttings, see image 3 .
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