Low-bubble electronic ceramic preparation system

Abstract

The invention belongs to the technical field of electronic ceramic preparation, and particularly relates to a low-bubble electronic ceramic preparation system. The low-bubble electronic ceramic preparation system comprises a machine body, a motor, a stirring module, a bubble clearing module and a negative pressure module; the motor is installed at the center position of the top of the machine body, and a controller is installed at the position, located on one side of the motor, of the top of the machine body; a hollow rotating shaft is rotatably connected to a vertical center line position ofthe inner part of the machine body, and the motor is connected with the top end of the hollow rotating shaft in a transmission mode; the stirring module is installed at the top end of the inner part of the machine body; the bubble clearing module, a separating plate and the negative pressure module are sequentially arranged at the positions, located under the stirring module, in the machine body from top to bottom; a feeding module is arranged at the top of the separating plate; the stirring module comprises a mixing cabin and a stirring paddle; and the mixing cabin is rotatably connected to the bottom of a top plate of the machine body, and the bottom of the mixing cabin is fixedly connected with the outer pillar surface of the hollow rotating shaft. According to the low-bubble electronicceramic preparation system, thick liquid materials can be subjected to multi-stage debubble treatment, the content of the bubbles in the thick liquid materials is reduced effectively, and the improvement of the intensity of electronic ceramics is facilitated.

Description

technical field [0001] The invention belongs to the technical field of electronic ceramic preparation, in particular to a low-bubble electronic ceramic preparation system. Background technique [0002] Electronic ceramics, or ceramics for the electronic industry, are essentially different from general electrical ceramics in terms of chemical composition, microstructure and electromechanical properties. These differences are formed by a series of special technical requirements put forward by the electronics industry for electronic ceramics, the most important of which are high mechanical strength, high temperature and high humidity resistance, radiation resistance, and a wide range of dielectric constants. The dielectric loss tangent is small, and the capacitance temperature coefficient can be adjusted (or the capacitance change rate can be adjusted). High dielectric strength and insulation resistance, and excellent aging performance. It can be widely used in energy, househ...

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Problems solved by technology

However, in this type of electronic ceramic preparation and impurity removal equipment, only vibration is used to defoam the slurry, which causes the small air bubbles in the

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