A high-sensitivity, high-frequency response, and overload-resistant silicon carbide high-temperature vibration sensor

A vibration sensor, silicon carbide technology, used in instruments, measuring devices, electrical devices, etc., can solve the problems of sensor temperature resistance limit, low sensor use temperature, etc., to prevent fracture or damage, good high temperature stability, stiffness improved effect

Active Publication Date: 2021-02-09
XI AN JIAOTONG UNIV
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, vibration sensors mainly include piezoresistive, capacitive, resonant, etc., but due to the working principle of the sensor, material characteristics, and packaging technology, the temperature resistance of the sensor is limited, and the operating temperature of the sensor is generally low. Meet the requirements for normal operation in high temperature environments above 600°C; in addition, the contradiction between sensor sensitivity and stiffness has always been a key issue limiting the performance improvement of piezoresistive vibration sensors; and in many high-temperature application environments mentioned above, The sensor must have a good anti-overload ability to effectively resist unexpected high-frequency, high-energy impacts and ensure that it is not damaged

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A high-sensitivity, high-frequency response, and overload-resistant silicon carbide high-temperature vibration sensor
  • A high-sensitivity, high-frequency response, and overload-resistant silicon carbide high-temperature vibration sensor
  • A high-sensitivity, high-frequency response, and overload-resistant silicon carbide high-temperature vibration sensor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0038] The present invention will be described in further detail below in conjunction with the accompanying drawings and embodiments. The examples are only used to explain the present invention, but not to limit the protection scope of the present invention.

[0039] figure 1 The structure of the high-sensitivity, high-response, and overload-resistant silicon carbide high-temperature vibration sensor provided by the embodiment of the present invention is shown. The silicon carbide high-temperature vibration sensor includes: a silicon carbide chip 1100, a bonding sheet 1200, a heat insulating layer 1300, and a package Housing 1400 and Kovar pin 1500.

[0040] It should be understood that figure 1 It is a schematic cross-sectional view of the high-sensitivity, high-response, and overload-resistant silicon carbide high-temperature vibration sensor structure. The silicon carbide chip 1100 includes a supporting sheet 1110 , a cantilever beam 1120 and a proof mass 1130 . Wherein...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a high-sensitivity, high-frequency response, and overload-resistant silicon carbide high-temperature vibration sensor, which includes a silicon carbide chip, a silicon carbide bonding sheet, a thermal insulation layer, a packaging shell and a Kovar pin; the silicon carbide chip includes a supporting sheet, a cantilever beam and a mass block; the supporting sheet and the silicon carbide bonding sheet form a bonding body; the mass block and the cantilever beam are arranged in the cavity of the bonding body, and a chip circuit is arranged on the cantilever beam ; The Kovar pins extend into the bonding compound along the through holes arranged on the package shell, the heat insulating layer and the silicon carbide bonding sheet, and are connected with the chip circuit. The invention proposes that the high-temperature vibration sensor has the characteristics of high sensitivity, high-frequency response, and overload resistance, and can realize accurate and timely measurement of vibration signals in a high-temperature environment.

Description

technical field [0001] The invention relates to the technical field of vibration sensors, in particular to a silicon carbide high temperature vibration sensor with high sensitivity, high frequency response and anti-overload. Background technique [0002] Vibration measurement in high temperature environment is widely used in aerospace, petrochemical, automobile industry and other fields, such as vibration measurement of aero-engine combustion chamber, vibration monitoring of nuclear reactor equipment, oil drilling safety monitoring, etc. At present, vibration sensors mainly include piezoresistive, capacitive, resonant, etc., but due to the working principle of the sensor, material characteristics, and packaging technology, the temperature resistance of the sensor is limited, and the operating temperature of the sensor is generally low. Meet the requirements for normal operation in high temperature environments above 600°C; in addition, the contradiction between sensor sensit...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): G01H11/06
Inventor 赵友赵玉龙葛晓慧
Owner XI AN JIAOTONG UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products