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Application of carbon nanotube conductive paste in black hole direct electroplating

A technology of carbon nanotubes and conductive paste, which is applied in the direction of carbon compounds, inorganic chemistry, chemical instruments and methods, etc., can solve the problems of multiple steps and strict requirements on the compactness of the conductive layer, and achieve firm bonding, improved electroplating efficiency, and stable performance Effect

Active Publication Date: 2019-05-31
YANTAI HENGNUO CHEM TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The present invention aims at the problem that the existing black hole direct electroplating technology has many steps and has strict requirements on the compactness of the conductive layer, and provides an application of carbon nanotube conductive paste in black hole direct electroplating

Method used

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  • Application of carbon nanotube conductive paste in black hole direct electroplating
  • Application of carbon nanotube conductive paste in black hole direct electroplating
  • Application of carbon nanotube conductive paste in black hole direct electroplating

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Embodiment 1

[0032] An application of carbon nanotube conductive paste in black hole direct electroplating, comprising preparing carbon nanotube conductive paste and using the prepared carbon nanotube conductive paste to carry out black hole direct electroplating, the steps are:

[0033] A. Preparation of carbon nanotube conductive paste

[0034] A1) Preparation of carbon nanotube powder: immerse 10 g of carbon nanotubes in a mixed acid of 100 ml of concentrated sulfuric acid and 20 ml of concentrated nitric acid, soak for 12 hours at room temperature and then filter, and wash the filter cake with deionized water until the pH of the lotion is 6-7 After a period of time, the filter cake was placed in a vacuum drying oven, and vacuum-dried at 100° C. for 8 hours to obtain carbon nanotube powder;

[0035] A2) Modified carbon nanotubes: Soak the carbon nanotube powder in the coupling agent KH550 at 30°C for 15h, vacuum filter after soaking, wash the filter cake with ethanol, and dry it in a va...

Embodiment 2

[0044] An application of carbon nanotube conductive paste in black hole direct electroplating, comprising preparing carbon nanotube conductive paste and using the prepared carbon nanotube conductive paste to carry out black hole direct electroplating, the steps are:

[0045] A. Preparation of carbon nanotube conductive paste

[0046] A1) Preparation of carbon nanotube powder: immerse 10 g of carbon nanotubes in a mixed acid of 100 ml of concentrated sulfuric acid and 20 ml of concentrated nitric acid, soak for 18 hours at room temperature and then filter, and wash the filter cake with deionized water until the pH value of the lotion is 6-7 After a period of time, the filter cake was placed in a vacuum drying oven, and vacuum-dried at 90° C. for 8 hours to obtain carbon nanotube powder;

[0047] A2) Modified carbon nanotubes: Soak the carbon nanotube powder in the coupling agent KH570 at 30°C for 13h, vacuum filter after soaking, wash the filter cake with acetone, and dry it in...

Embodiment 3

[0056] An application of carbon nanotube conductive paste in black hole direct electroplating, comprising preparing carbon nanotube conductive paste and using the prepared carbon nanotube conductive paste to carry out black hole direct electroplating, the steps are:

[0057] A. Preparation of carbon nanotube conductive paste

[0058] A1) Preparation of carbon nanotube powder: immerse 10 g of carbon nanotubes in a mixed acid of 100 ml of concentrated sulfuric acid and 20 ml of concentrated nitric acid, soak for 24 hours at room temperature and then filter, and wash the filter cake with deionized water until the pH value of the lotion is 6-7 After the interval, the filter cake was placed in a vacuum drying oven, and vacuum-dried at 80° C. for 8 hours to obtain carbon nanotube powder;

[0059] A2) Modified carbon nanotubes: Soak carbon nanotube powder in isocyanatosilane coupling agent IPTS701 at 30°C for 12 hours, vacuum filter after soaking, wash the filter cake with ethanol or...

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Abstract

The invention discloses an application of a carbon nanotube conductive paste in black hole direct electroplating. The application of the carbon nanotube conductive paste in black hole direct electroplating comprises the steps of preparing the carbon nanotube conductive paste and using the prepared carbon nanotube conductive paste to perform black hole direct electroplating. According to the application of the carbon nanotube conductive paste in black hole direct electroplating, by modifying a carbon nanotube, the surface of the carbon nanotube contains an isocyanate group so that the carbon nanotube conductive paste possesses very high fluidity and film-forming property; an attached carbon nanotube compact layer possesses stable continuity; the strength of the compact layer can be more preferably enhanced while the conductive ability is improved; fine cracks or breakage is also uneasy to generate when an electroplating is deformed; and the service life of a conductive plate is prolonged. Compared with an existing black hole direct electroplating process, the process of using the carbon nanotube conductive paste to perform black hole direct electroplating has the advantages that thesteps are greatly simplified, the whole electroplating process can be finished only by repeating the coating once, the operation is simple, and the rate of finished products is high.

Description

technical field [0001] The invention relates to black hole direct electroplating technology, in particular to the application of carbon nanotube conductive paste in black hole direct electroplating. Background technique [0002] Printed circuit board (PCB, FPC) hole metallization technology is one of the keys to printed board manufacturing technology. For a long time, people have used the method of electroless copper deposition (PTH), but the PTH solution contains various substances that are harmful to the ecological environment. Chemical substances, such as EDTA, NTA, EDTP and easily carcinogenic formaldehyde, make wastewater treatment complex and costly. In addition, the stability of the PTH solution is poor, and the analysis and maintenance of the solution are complicated; at the same time, the mechanical properties of the PTH copper plating layer are relatively poor, and the process is cumbersome. Therefore, the industry has been looking for a new hole metallization tech...

Claims

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Application Information

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IPC IPC(8): C25D5/54C25D5/00C01B32/168C01B32/174
Inventor 任朋成
Owner YANTAI HENGNUO CHEM TECH CO LTD