Multi-layer structured heat conducting composite containing heat conducting film and preparation method of multi-layer structured heat conducting composite

A heat-conducting composite material and multi-layer structure technology, applied in the direction of heat exchange materials, chemical instruments and methods, lamination, etc., can solve the problem of small increase in thermal conductivity, unsatisfactory modification effect, strong interlayer force, etc. problem, to achieve the effect of improving horizontal thermal conductivity, excellent horizontal thermal conductivity, and simple method

Active Publication Date: 2019-06-21
HEFEI INSTITUTES OF PHYSICAL SCIENCE - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, there are still problems of small increase in thermal conductivity and chemical reagent pollution in surface modification, which is not environmentally friendly enough.
In addition, because t

Method used

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  • Multi-layer structured heat conducting composite containing heat conducting film and preparation method of multi-layer structured heat conducting composite
  • Multi-layer structured heat conducting composite containing heat conducting film and preparation method of multi-layer structured heat conducting composite
  • Multi-layer structured heat conducting composite containing heat conducting film and preparation method of multi-layer structured heat conducting composite

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] Using nanocellulose (CNF) as the matrix and hexagonal boron nitride as the thermally conductive filler, hexagonal boron nitride is subjected to liquid-phase ultrasonic exfoliation to obtain boron nitride nanosheets (BNNS), and then with the help of specific instruments, the method of shear-induced orientation is used. Preparation of boron nitride nanosheet / nanocellulose (BNNS / CNF) thermally conductive alignment film;

[0041] According to the ratio of 100:90:1, weigh 10g of epoxy resin, 9g of amine curing agent, and 0.1g of imidazole curing accelerator, put them in a constant temperature water bath, and stir at 45°C for 30 minutes;

[0042] According to the ratio of 1:1, weigh 4.1g of h-BN particles with a particle size of 25μm and 4.1g of AlN particles with a particle size of 1μm (that is, the filler content is 30wt%), and gradually add the two fillers to the above epoxy In the resin mixture, stirring was continued for 3 hours at 45°C;

[0043] Use a needle roller to me...

Embodiment 2

[0050] Using nanocellulose (CNF) as the matrix and hexagonal boron nitride as the thermally conductive filler, hexagonal boron nitride is subjected to liquid-phase ultrasonic exfoliation to obtain boron nitride nanosheets (BNNS), and then with the help of specific instruments, the method of shear-induced orientation is used. Preparation of boron nitride nanosheet / nanocellulose (BNNS / CNF) thermally conductive alignment film;

[0051] According to the ratio of 100:90:1, weigh 10g of epoxy resin, 9g of amine curing agent, and 0.1g of imidazole curing accelerator, put them in a constant temperature water bath, and stir at 45°C for 30 minutes;

[0052] According to the ratio of 1:1, weigh 4.1g of h-BN particles with a particle size of 25μm and 4.1g of AlN particles with a particle size of 1μm (that is, the filler content is 30wt%), and gradually add the two fillers to the above epoxy In the resin mixture, stirring was continued for 3 hours at 45°C;

[0053] Use a needle roller to ...

Embodiment 3

[0058] Using nanocellulose (CNF) as the matrix and hexagonal boron nitride as the thermally conductive filler, hexagonal boron nitride is subjected to liquid-phase ultrasonic exfoliation to obtain boron nitride nanosheets (BNNS), and then with the help of specific instruments, the method of shear-induced orientation is used. Preparation of boron nitride nanosheet / nanocellulose (BNNS / CNF) thermally conductive alignment film;

[0059] According to the ratio of 100:90:1, weigh 10g of epoxy resin, 9g of amine curing agent, and 0.1g of imidazole curing accelerator, put them in a constant temperature water bath, and stir at 45°C for 30 minutes;

[0060] According to the ratio of 1:1, weigh 4.1g of h-BN particles with a particle size of 25μm and 4.1g of AlN particles with a particle size of 1μm (that is, the filler content is 30wt%), and gradually add the two fillers to the above epoxy In the resin mixture, stirring was continued for 3 hours at 45°C;

[0061] Use a needle roller to ...

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Abstract

The invention discloses a multi-layer structured heat conducting composite containing a heat conducting film and a preparation method of the multi-layer structured heat conducting composite. The multi-layer structured heat conducting composite is prepared by steps as follows: epoxy resin is taken as a matrix, the heat conducting film with high heat conductivity is taken as a heat conducting medium, flaky hexagonal boron nitride and granular heat conducting filler are used for compound filling, and then the multi-layer structured heat conducting composite is prepared by layer-by-layer stacking,pre-curing and hot press molding. The multi-layer structured heat conducting composite has the following advantages: flaky hexagonal boron nitride is horizontally oriented under hot press condition and forms a heat conducting pathway in the horizontal direction together with the horizontally laid heat conducting film; the granular heat conducting filler plays a bridging role in the system and fills gaps between flaky hexagonal boron nitride, so that a heat conducting network is perfect, and a heat conducting pathway in the vertical direction is constructed. The horizontal heat conductivity ofthe composite is increased by 4639%, the vertical heat conductivity of the composite is increased by 439%, and the composite has the advantages of high heat conductivity, good heat stability, low dielectric constant and dielectric loss, excellent mechanical properties and the like.

Description

technical field [0001] The invention belongs to the technical field of heat-conducting materials, and in particular relates to a multi-layer structure heat-conducting composite material containing a heat-conducting film and a preparation method thereof. Background technique [0002] In recent years, microelectronics integration and assembly technology has developed rapidly, electronic equipment and components have become increasingly miniaturized and multi-functional, their operating frequency has increased sharply, heat generated during work has accumulated rapidly, and the ambient temperature has continued to rise. If the accumulated heat cannot be diffused outward in time, it will greatly affect the reliability of equipment and components and shorten the service life. Therefore, in order to ensure the smooth and efficient operation of equipment and components, how to dissipate heat in a timely manner has become an urgent problem to be solved in the field of microelectroni...

Claims

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Application Information

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IPC IPC(8): C09K5/14B32B9/00B32B9/04B32B37/06B32B37/10B32B3/24
Inventor 陈璐郑康田兴友肖超张献汤云潞
Owner HEFEI INSTITUTES OF PHYSICAL SCIENCE - CHINESE ACAD OF SCI
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