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Method for preparing compact copper protection layer on surface of aluminum mold core

A protective layer and aluminum mold technology, applied in coating, metal material coating process, ion implantation plating, etc., can solve the problems of non-dense copper protective layer, poor bonding force between copper protective layer and aluminum mold core, etc., to achieve Avoid the sharp increase of surface roughness, control the surface roughness, and prolong the effect of time

Active Publication Date: 2019-06-21
LASER FUSION RES CENT CHINA ACAD OF ENG PHYSICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the problem that the copper protective layer prepared on the surface of the existing aluminum mold core is not dense, and the bonding force between the copper protective layer and the aluminum mold core is poor, and to provide a method for preparing a dense copper protective layer on the surface of the aluminum mold core

Method used

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  • Method for preparing compact copper protection layer on surface of aluminum mold core
  • Method for preparing compact copper protection layer on surface of aluminum mold core
  • Method for preparing compact copper protection layer on surface of aluminum mold core

Examples

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specific Embodiment approach 1

[0023] Embodiment 1: This embodiment is a method for preparing a dense copper protective layer on the surface of an aluminum mold core, which is specifically completed according to the following steps:

[0024] 1. Copper target pretreatment: first anneal the two copper targets, then put them into the coating device, and the center normal of the two copper targets is 90°, and then pre-sputter for 18 minutes to 22 minutes;

[0025] 2. Aluminum mold core assembly: Clean the aluminum mold core with acetone, absolute ethanol and deionized water in sequence, and then install it into the coating device to ensure that the distance between the aluminum mold core and the two copper targets is adjusted to 100mm-200mm. And the normal line of the center line of the two copper targets and the plane where the aluminum mold core is located are at an angle of 45°, and a baffle is set between the two copper targets and the aluminum mold core;

[0026] 3. Vacuum heating degassing treatment and i...

specific Embodiment approach 2

[0031] Embodiment 2: The difference between this embodiment and Embodiment 1 is that the copper target described in step 1 is an oxygen-free copper target, and the purity of the oxygen-free copper target is >99.95%. Others are the same as the first embodiment.

specific Embodiment approach 3

[0032] Embodiment 3: The difference between this embodiment and Embodiment 1 or 2 is that the specific process of the annealing treatment described in Step 1 is as follows: two copper targets are annealed at a temperature of 650° C. 2h. Others are the same as those in Embodiment 1 or 2.

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Abstract

The invention discloses a method for preparing a compact copper protection layer on the surface of an aluminum mold core, belongs to the field of inertial confinement fusion target preparation, and particularly relates to a method for preparing a high-compactness copper protection layer. The method aims at solving the problems that at present, a copper protection layer prepared on the surface of an aluminum mold core is not compact, and the binding force of the copper protection layer and the aluminum mold core is poor. The method for preparing the compact copper protection layer on the surface of the aluminum mold core comprises the steps that firstly, a copper target is pretreated; secondly, the aluminum mold core is assembled; thirdly, vacuum heating degassing treatment and ion etchingcleaning are carried out; fourthly, magnetron sputtering deposition is carried out on a first copper plated layer; fifthly, in-situ heat treatment is carried out; sixthly, a copper plated layer is etched and deposited; and seventhly, operation of the sixth step is repeated two times, and an aluminum-copper composite core shaft is obtained. The method has the beneficial effects that the surface roughness RMS is smaller than 60 nm, residual stress is reduced to 58 MPa+ / -20 MPa, and the corrosion resisting time in a NaOH solution of 3 mol / L exceeds 24 h. The method is mainly used for preparing the aluminum-copper composite core shaft.

Description

technical field [0001] The invention belongs to the field of inertial confinement fusion target preparation, in particular to a method for preparing a high-density copper protective layer. Background technique [0002] In order to reduce the possibility of black cavity coating being oxidized or hydrogen embrittlement, and reduce the probability of black cavity being over-corroded, the American NIF ignition black cavity development process uses an aluminum-copper composite mandrel (that is, an aluminum mold core with a thickness of different copper protection layer less than 5μm). [0003] According to the literature and existing experimental data, the removal time of the aluminum mold core is about 18h to 48h. The prepared copper protective layer can protect the black cavity coating during the process of removing the mold core. It can not only prevent the NaOH solution from coating the black cavity The corrosion of the layer can also prevent the hydrogen embrittlement cause...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/02C23C14/35C23C14/58C23C14/16
Inventor 邢丕峰赵利平郑凤成柯博易泰民杨蒙生高莎莎李宁王丽雄
Owner LASER FUSION RES CENT CHINA ACAD OF ENG PHYSICS
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