Method for preparing antigravity ultrathin micro heat pipe

Abstract

The invention discloses an antigravity ultrathin micro heat pipe and a preparation method thereof. The preparation method includes the steps that two times of successive laser processing are conductedon monocrystalline silicon pieces, and arrayed shuttle-shaped structures capable of achieving one-way liquid conveyance are processed to serve as capillary liquid sucking cores; then a monocrystalline silicon support is placed between the two monocrystalline silicon pieces with the shuttle-shaped structures, the eutectic bonding technology is adopted to seal the positions between the monocrystalline silicon pieces and the monocrystalline silicon support, then femtosecond laser drilling is adopted to drill vacuum liquid filling holes in the monocrystalline silicon piece of one side, a vacuum pouring machine is used for conducting vacuum pumping on the micro heat pipe, and working medium liquid is poured; and afterwards, the vacuum liquid filling holes are subjected to laser welded sealing,and accordingly the antigravity ultrathin micro heat pipe can be obtained. According to the antigravity ultrathin micro heat pipe, the shuttle-shaped array liquid sucking core structures capable of conducting one-way liquid conveyance are directly processed on the inner wall, and a larger steam backflow channel is available; and extremely-high capillary backflow pressure is brought about throughthe shuttle-shaped array structures, heat transfer performance is good and the antigravity feature is achieved.

Description

technical field [0001] The invention relates to the technical field of preparation of micro heat pipes, in particular to a method for preparing anti-gravity ultra-thin micro heat pipes. Background technique [0002] With the rapid development of microelectronics technology and large-scale integrated circuit technology, the heat flux density through high-power electronic chips has increased significantly, and large-scale and highly integrated circuits have also led to a very narrow cooling space for electronic components. Research data show that the failure rate of electronic components increases exponentially with the rise of their temperature. When the temperature exceeds the rated operating temperature of electronic components, their reliability will decrease significantly. More than 55% of electronic equipment failures are caused by overheating caused by untimely heat dissipation. [0003] As an efficient phase change heat transfer element, the heat pipe has the advantag...

AI Technical Summary

Problems solved by technology

However, with the continuous development of electronic products in the direction of miniaturization and high integration, the traditional cylindrical heat pipe or flattened pipe can no longer meet the requirements of efficient heat dissipation in a small space, and it is difficult to apply to compact and thin electronic equipment. The capillary pressure brought by the liquid-absorbing core structure is insufficient, and the heat pipe cannot be used in anti-gravity occasions

In addition, traditional heat pipes can generally conduct heat in both directions, so for electronic components, when the external temperature is too high, the traditional micro heat pipe will transfer the external heat to the electronic components, resulting in electronic components due to excessive temperature while damaged

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