QLED device and its preparation method
A device and prefabricator technology, applied in the field of QLED devices and their preparation, can solve problems affecting electron injection efficiency, etc., and achieve the effects of increasing electron injection efficiency, promoting electron injection, and improving device efficiency
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[0038] As an embodiment, the preparation method of the QLED device includes the following steps:
[0039] S01 provides a prefabricated device, the surface of the prefabricated device is provided with the electronic functional layer;
[0040] S02 Depositing an interface modification layer material on the surface of the electronic functional layer to form an interface modification layer.
[0041] As another embodiment, the preparation method of the QLED device includes the following steps:
[0042] Q01 provides a prefabricated device, the surface of the prefabricated device is provided with the cathode;
[0043] Q02 Depositing an interface modification layer material on the surface of the cathode to form an interface modification layer.
[0044] The preparation method of the QLED device provided by the embodiment of the present invention only needs to deposit a layer of fullerene lipid derivatives and fullerene alcohol derivatives on the surface of the cathode or electron tran...
Embodiment 1
[0051] An inverse QLED device, comprising a substrate, a cathode binding station on the surface of the substrate, an interface modification layer, an electron transport layer, a quantum dot light-emitting layer, a hole transport layer and an anode sequentially arranged on the surface of the cathode, Wherein, the material of the interface modification layer is a fullerene lipid derivative (IPBBM), a fullerene alcohol derivative (PCBE-OH), a fullerene carboxylic acid derivative (PCBA), a fullerene phosphate At least one of ester derivatives (BPCPO) and fullerene cyano derivatives (PCBB-CN-C8).
[0052] The preparation method of the inverted QLED device comprises the following steps:
[0053] Place the patterned ITO substrate in acetone, lotion, deionized water, and isopropanol in sequence for ultrasonic cleaning. Each of the above steps requires about 15 minutes of ultrasonic cleaning; after the ultrasonic is completed, place the ITO in a clean oven to dry Dry and set aside.
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Embodiment 2
[0060] A positive QLED device, comprising a substrate, an anode bonded to the surface of the substrate, a hole transport layer, a quantum dot light-emitting layer, an electron transport layer, an interface modification layer and a cathode sequentially arranged on the anode, wherein , the material of the interface modification layer is a fullerene lipid derivative (IPBBM), a fullerene alcohol derivative (PCBE-OH), a fullerene carboxylic acid derivative (PCBA), a fullerene phosphate At least one of fullerene cyano derivatives (BPCPO) and fullerene cyano derivatives (PCBB-CN-C8).
[0061] The preparation method of the positive QLED device comprises the following steps:
[0062] Deposit the hole transport layer PVK on the ITO, the thickness of this layer is 50nm, heat and anneal at 150°C for 15min.
[0063] After the upper sheet is cooled, QDs are deposited on it. The thickness of this layer is 40nm without heating.
[0064] Afterwards, an electron transport layer ZnO is deposit...
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