A kind of polishing liquid and its preparation method and the processing method of silicon carbide crystal
A processing method and technology of silicon carbide, which is applied in the fields of polishing compositions containing abrasives, semiconductor/solid-state device manufacturing, electrical components, etc., can solve the problems of low polishing efficiency, reduce the time of fine polishing, increase hardness, and avoid surface scratch effect
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Embodiment 1
[0076] The preparation method of the polishing liquid of the present embodiment comprises the steps:
[0077] (1) Take 50g of polycrystalline diamond powder with D50=0.125μm, 100g of inorganic bentonite, 35g of BYK-345, 50g of AFE-3168, and 10g of borax, add 5kg of pure water, and stir ultrasonically for 0.5h;
[0078] (2) Add 5 kg of silica sol with a solid content of 40% and a particle size of 70 nm to the material in step (1), and then ultrasonically stir for 0.5 h to obtain a polishing solution.
Embodiment 2
[0080] The preparation method of the polishing liquid of the present embodiment comprises the steps:
[0081] (1) Take 25g of polycrystalline diamond powder with D50=0.5μm, 45g of Silok7370W, 60g of BYK-W 9010, 20g of BYK-024, 10g of BYK-094 and 50g of methyl monoethanolamine, add 5kg of pure water, and ultrasonically stir for 0.5h ;
[0082] (2) Add 5 kg of silica sol with a solid content of 45% and a particle size of 80 nm to the material in step (1), and then ultrasonically stir for 0.5 h to obtain a polishing solution.
Embodiment 3
[0084] The preparation method of the polishing liquid of the present embodiment comprises the steps:
[0085] (1) Take 100g D50=0.25μm polycrystalline diamond powder, 30g BYK-431, 30g TRITON CF-10, 45g FOAMEX 825, and 20g of potassium hydroxide, add 5kg of pure water, after ultrasonic stirring for 0.5h;
[0086] (2) Add 5 kg of silica sol with a solid content of 50% and a particle size of 60 nm to the material in step (1), and then ultrasonically stir for 0.5 h to obtain a polishing solution.
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