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Photoinitiator and light-shielding photosensitive resin composition containing same

A technology of photoinitiator and photosensitive resin, which is applied in the direction of optics, photomechanical equipment, photoplate making process of pattern surface, etc., can solve the problems of increasing exposure, reducing output, and low sensitivity, so as to improve shading, Excellent deep curing effect

Active Publication Date: 2019-07-09
SAMSANG CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the photoinitiation efficiency of oxime derivative compounds developed earlier is low, and the sensitivity is low especially in the pattern exposure process, so it is necessary to increase the exposure amount, resulting in a problem that the yield decreases

Method used

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  • Photoinitiator and light-shielding photosensitive resin composition containing same
  • Photoinitiator and light-shielding photosensitive resin composition containing same
  • Photoinitiator and light-shielding photosensitive resin composition containing same

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example

[0083] Synthesis example: Preparation of alkali-soluble resin

[0084] a) Preparation of A-1 resin

[0085] After adding 1.5 g of azobisisobutyronitrile (Azobisisobutyronitrile, AIBN) to 200 mL of propylene glycol methyl ether acetate (Propylene Glycol Methyl Ether Acetate, PGMEA), methacrylic acid, glycidyl methacrylate, methyl Methyl acrylate and dicyclopentanyl acrylate (dicyclopentanyl acrylate) were added at a molar ratio of 20:20:40:20 (solid content of acrylic monomer: 40% by weight), and then heated at 70°C under a nitrogen atmosphere. Stirring and polymerization were carried out for 5 hours to prepare an acrylic polymer A-1 resin. It was confirmed that the weight average molecular weight of the copolymer prepared as described above was 25,000.

[0086] b) Preparation of A-2 resin

[0087] 62.5g (0.05 moles) of 3-(triethoxysilyl) propionate (methyl3-(triethoxysilyl) propionate), 51.6g (0.04 moles) of dicycloheptayl triethoxysilane ( bicycloheptanyltriethoxy silane...

Embodiment 1～28 and comparative example 1～6

[0096] Examples 1-28 and Comparative Examples 1-6: Preparation of Photosensitive Resin Composition

[0097] Add 20% by weight of [A] alkali-soluble resin (solid content is 50% by weight, dissolved in solvent (PGMEA)), 5% by weight of [B] di Pentaerythritol hexaacrylate, 20% by weight of [C] lactam black (solid content is 25% by weight, dispersed in PGMEA), 0.5% by weight of [D] photoinitiator and other additives FC-430 (flow of 3M company leveling agent, 0.1% by weight), stirred at room temperature, and then added the remaining amount of solvent so that the total amount of the composition became 100% by weight to prepare a photosensitive resin composition. The types and contents of the alkali-soluble resins and the photoinitiators used in the respective Examples and Comparative Examples are shown in Table 1 below.

[0098] [Compound 1]

[0099]

[0100] [Compound 2]

[0101]

[0102] [Compound 3]

[0103]

[0104] [chemical formula 4]

[0105]

[0106] [chem...

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Abstract

The present invention relates to a photoinitiator and a light-shielding photosensitive resin composition containing the same and, more specifically, to: a photoinitiator comprising compounds of two ormore groups selected from a group of chemical formula 1, a group of chemical formula 2, and a group of chemical formula 3; and a photosensitive resin composition containing the same so as to exhibitimproved light shielding property, and also exhibiting excellent deep curing properties so as to be advantageous in pattern formation and phenomenon processing, which use a photolithographic method, thereby being suitably usable as a light-shielding photosensitive resin composition for an organic light emitting material display panel.

Description

technical field [0001] The present invention relates to a photoinitiator and a light-shielding photosensitive resin composition comprising the photoinitiator, and in more detail, to a photoinitiator and a photosensitive resin composition, wherein the photoinitiator contains a compound selected from chemical formula 1, Two or more compounds in the compound of chemical formula 2 and the compound of chemical formula 3, the photosensitive resin composition contains the photoinitiator and shows improved light-shielding properties, and shows excellent deep curability, which is beneficial to the use of light Therefore, it can be suitably used as a light-shielding photosensitive resin composition for an organic light-emitting material display panel. Background technique [0002] In recent years, low temperature polysilicon (Low Temperature Poly-Silicon, LTPS) and oxide thin film transistor. [0003] In general, oxide thin film transistors change the properties of semiconductors du...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/028G03F7/027G03F7/105C07C271/08G03F7/16H01L51/50
CPCC07C271/08G03F7/027G03F7/028G03F7/105G03F7/16H10K59/10
Inventor 崔正植金兑洙金泰运施允基安廷珉杨英恩吴泉林柳权壹李德熙李元重
Owner SAMSANG CORP