Large-size silicon carbide wafer diamond wire cutting machine tool

A silicon carbide crystal and diamond wire technology, applied in stone processing equipment, fine working devices, manufacturing tools, etc., can solve the problems of unstable processing quality and insufficient cutting wire length, and achieve simple structure, stable and reliable processing quality, Create convenient effects

Pending Publication Date: 2019-08-09
TAIZHOU CHEN HONG NC EQUIP MFG CO LTD
View PDF0 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to design a large-size silicon carbide wafer diamond wire-cutting machine tool with stable cutting and long wi

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Large-size silicon carbide wafer diamond wire cutting machine tool
  • Large-size silicon carbide wafer diamond wire cutting machine tool

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0018] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0019] Such as Figure 1-2 shown.

[0020] A large-size silicon carbide wafer diamond wire cutting machine tool, which includes a base 1, a door-shaped column 12 is installed in the center of the base 1, and a guide wire assembly is installed on the door-shaped column 12, and the guide wire assembly includes symmetrically arranged transition guide wheels 8 , tension pulley 9, tension detection wheel 10 and capstan pulley 11, the structure of each part in the guide wire assembly is all identical with prior art, can directly be contained on the lathe of the present invention to relevant parts on the existing equipment, as figure 1 shown. The base 1 on both sides of the door-shaped column 12 is respectively equipped with a wire transporting part 2, and the wire transporting part 2 is generally composed of a wire transporting spindle motor and a wire drum...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Lengthaaaaaaaaaa
Login to view more

Abstract

The invention discloses a large-size silicon carbide wafer diamond wire cutting machine tool. The large-size silicon carbide wafer diamond wire cutting machine tool comprises a base (1) and a portal-shaped upright post (12) provided with a guide wire assembly. The large-size silicon carbide wafer diamond wire cutting machine tool is characterized in that a wire conveying component (2) is respectively mounted on the base (1) on two sides of the portal-shaped upright post (12); a sliding block is mounted on a guide rail and driven by a servo motor to achieve stepping wire releasing or wire collecting; the center of the base (1) is provided with a Y-direction herringbone upright post (3); the Y-direction herringbone upright post (3) is driven by a Y-direction driving mechanism (4) to move forwards and backwards; a Z-direction sliding plate is installed on the Y-direction herringbone upright post (3); the Z-direction sliding plate is driven to move up and down by a Z-direction driving mechanism (5) installed on the upper part of the Y-direction herringbone upright post (3); a workpiece clamping mechanism (7) is installed on a C-axis driving mechanism (6); and the C-axis driving mechanism (6) drives a workpiece to be machined on the workpiece clamping mechanism (7) to rotate or swing. The large-size silicon carbide wafer diamond wire cutting machine tool has simple structure, convenient manufacture, stable and reliable machining quality and high efficiency.

Description

technical field [0001] The invention relates to a wire-cutting machine tool, in particular to a wire-cutting machine tool with a long wire changing period, in particular to a large-size silicon carbide wafer diamond wire-cutting machine tool. Background technique [0002] Silicon carbide is a polymorphic compound. At a high temperature of 560 degrees Celsius, silicon carbide wafers can still work without cooling devices, and have irreplaceable advantages in extreme environments such as aerospace, military industry, and nuclear energy. [0003] Silicon carbide wafer is a third-generation semiconductor material, which has the advantages of large band gap, high critical breakdown field strength, and high thermal conductivity. It is an ideal material for making high-voltage and high-power semiconductor devices. High-quality and large-diameter silicon carbide single crystal is extremely important, but wafer processing plays a decisive role in the surface quality of the wafer. Am...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): B28D5/04
CPCB28D5/04B28D5/045
Inventor 徐晨影华卫东
Owner TAIZHOU CHEN HONG NC EQUIP MFG CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products