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Composite adhesive film and preparation method thereof

A composite adhesive and film technology, applied in the field of materials, can solve the problems of high energy consumption, high cost, and difficulty in applying electromagnetic shielding materials for graphene, and achieve the effects of low cost, simple structure, excellent heat dissipation and electromagnetic shielding efficiency.

Pending Publication Date: 2019-08-13
SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] The purpose of the present invention is to overcome the above-mentioned deficiencies of the prior art, to provide a composite adhesive film and a preparation method thereof, aiming to solve the problem that the existing graphene is difficult to be applied to electromagnetic shielding materials, and the preparation cost of the existing electromagnetic shielding materials is high and energy-efficient. costly technical issues

Method used

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  • Composite adhesive film and preparation method thereof

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preparation example Construction

[0022] On the other hand, the embodiment of the present invention also provides a method for preparing a composite adhesive film, comprising the following steps:

[0023] S01: providing a dispersant and a grinding aid, dissolving the dispersant and the grinding aid in an organic solvent to obtain a mixed solution;

[0024] S02: providing graphite raw materials, adding the graphite raw materials into the mixed solution for grinding to obtain a graphene dispersion;

[0025] S03: providing a high molecular polymer and a curing agent, adding the high molecular polymer and the curing agent to the graphene dispersion and mixing to obtain a coating liquid;

[0026] S04: Coating the coating solution on the surface of the substrate film, and performing curing treatment to obtain a composite adhesive film.

[0027] In the preparation method of the above-mentioned composite adhesive film provided in the embodiments of the present invention, the graphite raw material is first ground to o...

Embodiment 1

[0036] A composite adhesive film with heat dissipation and electromagnetic shielding effects, the preparation method of which comprises the steps of:

[0037] S11: adding 1 part by weight of polyvinylpyrrolidone to 96.5 parts by weight of nitrogen-methylpyrrolidone, stirring and dissolving at room temperature, adding 2 parts by weight of sodium hydroxide to obtain a mixed solution;

[0038] S12: Transfer the above mixed solution to a 5-liter grinding jar, add 0.5 parts of natural flake graphite and 50 parts by weight of zirconia balls, turn on the grinder, set the speed at 200 rpm, and grind for 24 hours; collect the grinding liquid , using a 100-mesh copper mesh sieve to remove zirconia balls to obtain a graphene dispersion with a mass fraction of 0.5%;

[0039] S13: Take the above-mentioned 100 parts by weight of the graphene dispersion, add 9.5 parts by weight of epoxy bisphenol A resin, stir evenly, add 5 parts of methyl hexahydrophthalic anhydride, and continue stirring t...

Embodiment 2

[0043] A composite adhesive film with heat dissipation and electromagnetic shielding effects, the preparation method of which comprises the steps of:

[0044] S21: adding 2 parts by weight of cetylbenzenesulfonic acid to 93 parts by weight of dimethylformamide, stirring and dissolving at room temperature, adding 2 parts by weight of potassium hydroxide to obtain a mixed solution;

[0045] S22: Transfer the above mixed solution to a 50-liter grinding jar, add 3 parts of natural flake graphite and 100 parts by weight of zirconia balls, turn on the grinder, set the speed at 500 rpm, grind for 48 hours, and collect the grinding liquid , using a 100-mesh copper mesh sieve to remove zirconia balls to obtain a graphene dispersion with a mass fraction of 3%;

[0046] S23: Take the above-mentioned 100 parts by weight of the graphene dispersion, add 27 parts by weight of epoxy bisphenol A resin, stir evenly, add 20 parts of m-phenylenediamine, and continue stirring to obtain a coating s...

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Abstract

The invention particularly relates to a composite adhesive film and a preparation method thereof. The composite adhesive film comprises a base material thin film and a coating layer coating the surface of the base material thin film, and the coating layer is mainly prepared from graphene, a high-molecular polymer and a curing agent. The preparation method of the composite adhesive film comprises the following steps that a dispersion agent and a grinding assistant are provided and dissolved in an organic solvent to obtain a mixed solution; a graphite raw material is provided and added into themixed solution for grinding, and a graphene dispersion solution is obtained; the high-molecular polymer and the curing agent are provided and added into the graphene dispersion solution, and the mixture is mixed to obtain a coating solution; the surface of the base material thin film is coated with the coating solution, and after curing treatment is conducted, the composite adhesive film is obtained. The composite adhesive film has both excellent properties, namely, a heat dissipating property and an electromagnetic shielding property, and is simple in structure, low in cost and wide in application prospect.

Description

technical field [0001] The invention belongs to the technical field of materials, and in particular relates to a composite adhesive film and a preparation method thereof. Background technique [0002] With the rapid development of science and technology and electronic information industry, all kinds of electronic and electrical equipment have spread all over the fields of people's life and work. While these equipment bring convenience to people's life, they also bring a series of hidden safety hazards and hazards, such as Insufficient heat dissipation will cause an explosion, and electromagnetic radiation will harm the human body and the environment. [0003] In recent years, with the development of microelectronic devices towards miniaturization, light weight, high density, and high integration, the problem of heat dissipation of heating elements such as chips in electronic equipment has become increasingly prominent. At present, the most commonly used method is to fill th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J7/04C09D163/00C09D175/04C08G18/58H05K9/00C08L79/08
CPCC09D163/00C09D175/04C09D7/63C09D7/62C09D7/70C08G18/58H05K9/0073C08J2379/08C08K2201/003C08J7/0427C08K9/00C08K9/08C08K7/00C08K5/1539C08K9/04C08K5/18C08K5/17
Inventor 孙蓉叶晃青赵涛张保坦胡友根梁先文
Owner SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI