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High-strength low-temperature lead-free welding flux and tin soldering paste thereof

A lead-free solder and solder paste technology, used in welding/cutting media/materials, welding media, welding equipment, etc., can solve problems such as tissue coarsening, stress imbalance, solder joint peeling, etc., to improve shear strength and The effect of tensile strength

Inactive Publication Date: 2019-08-16
深圳市唯特偶新材料股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] At present, the commonly used low-melting point lead-free solder is based on Sn-Bi alloy, and some alloy elements are added to it. The low-temperature solder has a relatively large melting range, and dendrite segregation, coarse structure, and stress imbalance are prone to occur during the solidification process. , will cause solder joint delamination

Method used

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Embodiment Construction

[0016] This specific embodiment is only an explanation of the present invention, and it is not a limitation of the present invention. Those skilled in the art can make modifications to this embodiment as required after reading this specification, but as long as they are within the rights of the present invention All claims are protected by patent law.

[0017] This embodiment relates to a solder paste, which is prepared from low-temperature lead-free solder, and the preparation method adopts conventional technical means. The solder paste has the advantages of good pad adhesion, high soldering strength, low melting point and moderate cost.

[0018] Among them, the high-strength low-temperature lead-free solder and its solder paste are made by adding alloy element In into the existing Sn-Bi solder system, wherein, calculated by mass percentage, In accounts for 15%-45%.

[0019] Further, the weight percentage components of Sn, Bi and In in the solder alloy powder of low-temperat...

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Abstract

The invention discloses high-strength low-temperature lead-free welding flux and tin soldering paste thereof. According to the high-strength low-temperature lead-free welding flux and tin soldering paste thereof disclosed by the invention, an alloy element In is added into an existing Sn-Bi brazing filler metal system, and In accounts for 15%-45% in percentage by mass. In the high-strength low-temperature lead-free welding flux and tin soldering paste thereof, components are as follows in percentage by weight: 34%-36% of Sn, 38%-40% of Bi, 24%-27% of In or the balance of In, based on 100% in total. With the adoption of the technical scheme, the high-strength low-temperature lead-free welding flux and tin soldering paste thereof have the advantages of being good in bonding pad adhesion, high in welding strength, low in melting point and moderate in cost.

Description

technical field [0001] The invention relates to the technical field of soldering, in particular to a high-strength low-temperature lead-free solder and solder paste thereof. Background technique [0002] Lead and its compounds are toxic substances that damage human health and pollute the environment. With the enhancement of human awareness of environmental protection, countries around the world have successively issued a series of laws and regulations to prevent and control the ecological problems caused by electronic products, and limit the use of lead in electronic products. Under the general trend of lead-free green manufacturing, scientific research institutions and enterprises in many countries have begun to increase investment in research and development of lead-free solder, and actively promote its application. [0003] At present, the commonly used low-melting point lead-free solder is based on Sn-Bi alloy, and some alloying elements are added to it. The low-tempera...

Claims

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Application Information

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IPC IPC(8): B23K35/26
CPCB23K35/268
Inventor 吴晶唐欣廖高兵李维俊张瑜郑世忠郭万强
Owner 深圳市唯特偶新材料股份有限公司
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