A kind of thermal interface composite material and its preparation method and application

Abstract

The invention provides a thermal interface composite material and its preparation method and application. The thermal interface composite material includes a carbon fiber skeleton, and a polymer matrix filling and covering the carbon fiber skeleton; the carbon fibers in the carbon fiber skeleton are in a single orientation arrangement. In the present invention, the oriented carbon fibers establish a thermal conduction channel in the vertical direction of the thermal interface composite material, and the carbon fibers contact and connect with each other in this direction, which reduces the overall interface thermal resistance of the material and greatly improves the thermal interface composite material. Thermal conductivity; and the synergy between the carbon fiber skeleton and the polymer matrix makes the thermal interface composite material have a high glass transition temperature and good mechanical properties such as strength and toughness. The thermal interface composite material provided by the invention has excellent thermal conductivity and mechanical properties, and the preparation method is simple and easy to operate, and is a new type of thermal conductive material with large-scale industrial production prospects.

Description

technical field [0001] The invention belongs to the technical field of polymer composite materials, and in particular relates to a thermal interface composite material and its preparation method and application. Background technique [0002] The miniaturization and high integration of electronic components not only endow electronic products with more functions and higher efficiency, but also greatly increase the working power per unit volume in electronic products, which brings serious heat dissipation problems. The dissipation and heat generation of electronic components will directly lead to an increase in the temperature and thermal stress of electronic equipment, which poses a serious threat to the reliability of microelectronic equipment. The most important heat dissipation design of electronic components is to rely on thermal interface materials to connect chips with substrates and substrate heat dissipation systems. The industry generally believes that the bottleneck ...

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Problems solved by technology

[0006] However, in the prior art, thermal interface materials based on compound powder-type thermally conductive fillers have problems such as difficult processing and high cost, and materials with a high proportion of compound powder and good thermal conductivity often have reduced mechanical properties, poor toughness, and are not durable Corrosion; the thermal interface material with carbon nanotubes has excellent performance, but the preparation process of carbon nanotubes is complicated and the cost is high, which is not suitable for industrial application; graphene, as a two-dimensional thermal conductivity material, has anisotropic thermal conductivity, so based on Graphene thermal interface materials exhibit good in-plane thermal conductivity, but low out-of-plane thermal conductivity, making it difficult to achieve good out-of-plane heat dissipation performance

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