Graphene/silicon carbide nanowire compound structure thermal interface material

A technology of silicon carbide nanowires and thermal interface materials, applied in the field of chemical materials, can solve the problems of low out-of-plane thermal conductivity and difficulty in meeting heat dissipation requirements, and achieve the effect of improving thermal conductivity

Active Publication Date: 2020-08-04
NINGBO INST OF MATERIALS TECH & ENG CHINESE ACADEMY OF SCI
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Problems solved by technology

But for traditional graphene paper, its out-of-plane thermal conductivity (0.1~3.4W·m -1 K -1 ) is much lower than the in-plane thermal conductivity
Jiang et al. (J. Zhang, G. Shi, C. Jiang, S. Ju, D. Jiang. 3D Bridged Carbon Nanoring/Graphene Hybrid Paper as a High-Performance Lateral Heat Spreader[J].Small 2015,11,6197 .) Using polymethyl methacry

Method used

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  • Graphene/silicon carbide nanowire compound structure thermal interface material
  • Graphene/silicon carbide nanowire compound structure thermal interface material
  • Graphene/silicon carbide nanowire compound structure thermal interface material

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preparation example Construction

[0069] The preparation of the thermal interface material comprises the following steps:

[0070] (1) Graphene oxide sheets and graphene sheets modified by silica nanoparticles are mixed in ethanol at a mass ratio of 1:10 to obtain a dispersion;

[0071] (2) the dispersion liquid in suction filtration step (1) obtains thin film, i.e. composite graphene paper;

[0072] (3) The film (composite graphene paper) in step (2) is subjected to high-frequency heat treatment to obtain the thermal interface material.

Embodiment 1

[0074] Disperse 120 mg of graphene oxide in a mixed solution of 240 mL of ethanol and 24 mL of deionized water, and sonicate for 120 min. Add 4mL ammonia water and 0.5mL tetraethyl orthosilicate, and sonicate for 180min. Vacuum filter and wash several times with deionized water, dry. Weigh 20 mg of dried powder and 180 mg of graphene sheets and disperse them in ethanol, ultrasonicate, and suction filter to obtain composite graphene paper. The suction-filtered film (composite graphene paper) was heated at 1400°C for 4 minutes at high frequency (frequency 250kHz) to obtain silicon carbide nanowire / graphene sheet hybrid paper, which is the thermal interface material described above, which is designated as sample 1#.

Embodiment 2

[0076] Disperse 120 mg of graphene oxide in a mixed solution of 240 mL of ethanol and 24 mL of deionized water, and sonicate for 120 min. Add 4mL ammonia water and 0.5mL tetraethyl orthosilicate, and sonicate for 180min. Vacuum filter and wash several times with deionized water, dry. Weigh 20 mg of dried powder and 180 mg of graphene sheets and disperse them in ethanol, ultrasonicate, and suction filter to obtain composite graphene paper. The suction-filtered film (composite graphene paper) was heated at 1400°C for 4 minutes at high frequency (frequency 300kHz), and then a pressure of 75 psi was applied to the film to obtain silicon carbide nanowire / graphene sheet hybrid paper, which is the thermal interface material , recorded as sample 2#.

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Abstract

The invention discloses a graphene/silicon carbide nanowire composite structure thermal interface material and a preparation method thereof. The thermal interface material comprises graphene sheets and silicon carbide nanowires, and the graphene sheets and the silicon carbide nanowires are mutually staggered. According to the thermal interface material, the silicon carbide nanowires are subjectedto in-situ polymerization among the graphene sheets under a high-temperature condition to form an interlayer heat conduction path, so that the out-of-plane heat conductivity of a graphene film is improved, and the problem of low out-of-plane heat conductivity of a thermal interface material is solved.

Description

technical field [0001] The application relates to a graphene / silicon carbide nanowire composite structure thermal interface material, which belongs to the field of chemical materials. Background technique [0002] The miniaturization and integration of electronic components put forward higher requirements for heat dissipation performance. Excessive heat affects its service life and operational reliability. Due to the existence of microscopic surface roughness, the actual contact area of ​​two solids only accounts for 1-2% of their apparent contact area, and the rest is due to the thermal conductivity of only 0.026W m -1 K -1 Filled with air, a large contact thermal resistance is formed between the heat source and the heat sink, which limits the heat dissipation. [0003] To solve this problem, a thermal interface material is used to fill the air gap between the heat source and the heat sink to reduce the contact thermal resistance and improve the heat dissipation efficien...

Claims

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Application Information

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IPC IPC(8): C09K5/14
CPCC09K5/14
Inventor 代文谭雪林正得江南吕乐颜庆伟
Owner NINGBO INST OF MATERIALS TECH & ENG CHINESE ACADEMY OF SCI
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