A kind of high thermal conductivity polyimide multilayer composite film and preparation method thereof

Abstract

The invention discloses a high thermal conductivity polyimide multilayer composite film and a preparation method thereof. The composite film is composed of at least three thermal conductive film layers, and the adjacent two layers are film layers of different shapes of thermal conductive networks. The upper and lower surface layers contain at least one kind of heat-conducting filler with flake shape, and the film layer between the upper and lower surface layers contains at least one kind of heat-conducting filler with non-flaky shape. The preparation method is to uniformly disperse two or more thermally conductive fillers in the polyamic acid solution through a dispersant. After the polyamic acid solution is defoamed, the film is laid, the solvent is removed, the mold is cooled at room temperature, and the film layer is rolled out. , take more than three film layers, stack them neatly, calender a composite film with a specific thickness, and prepare a high thermal conductivity polyimide multilayer composite film after complete thermal imidization. The thin film has the characteristics of high thermal conductivity and high toughness, and the composite thin film has great application prospects in the fields of electronics, aerospace and machinery.

Description

technical field [0001] The invention belongs to the technical field of polyimide films, and in particular relates to a polyimide multilayer composite film with high thermal conductivity and a preparation method thereof. Background technique [0002] With the development of electronic equipment toward integration, miniaturization, and ultra-thinning, the volume of its electronic components is getting smaller and smaller, and the density is gradually increasing. With people enjoying the advantages of convenience, the heat dissipation problem of their electronic equipment is also increasingly causing people s concern. As an electronic packaging material, polyimide puts forward higher requirements for high thermal conductivity and insulation under the strict needs of reality. [0003] In order to achieve the purpose of improving the thermal conductivity, a thermal network is constructed by adding suitable thermal conductive fillers. In quantum physics, it is explained as const...

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Problems solved by technology

At present, the performance of thermally conductive polyimide films in the market is uneven; in addition, some manufacturers often add a higher content of thermally conductive fillers in order to obtain films with higher thermal conductivity, resulting in a decrease in the flexibility and toughness of the film, so the invention provides a A kind of high thermal conductivity polyimide film and preparation method thereof, make its film not only have high thermal conductivity but also can have good flexibility and toughness, then this film has very big market space prospect

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