High-strength, high-electrical-conductivity and high-heat-conductivity copper-silver series alloy wire material and preparation method thereof

Abstract

The invention relates to a high-strength, high-electrical-conductivity and high-heat-conductivity copper-silver series alloy wire material and a preparation method thereof and belongs to the technicalfield of metal material preparation. The preparation method for the high-strength, high-electrical-conductivity and high-heat-conductivity copper-silver series alloy wire material comprises the following steps of (1), batching and smelting; (2), hot type horizontal continuous casting, specifically, a melt adopts the hot type horizontal continuous casting to obtain a blank material, a crystallizerof the hot type horizontal continuous casting is a hot type crystallizer, the temperature of the melt inside the hot type crystallizer is maintained above the melting point of the copper-silver series alloy wire material, and a cooling method of the hot type horizontal continuous casting is twice cooling and is water cooling; and (3), combined thermomechanical treatment, specifically, solid solution treatment, drawing plastic deformation treatment and aging heat treatment are performed on the blank material in sequence, and the high-strength, high-electrical-conductivity and high-heat-conductivity copper-silver series alloy wire material is obtained. By means of the preparation method for the high-strength, high-electrical-conductivity and high-heat-conductivity copper-silver series alloywire material, improvement of casting-state structures is facilitated, the electrical conductivity, the heat conductivity and the tensile strength of copper-silver alloy are improved, and continuousproduction can be realized.

Description

technical field [0001] The invention belongs to the technical field of metal material preparation, and in particular relates to a high-strength, high-conductivity and high-heat-conduction copper-silver alloy wire and a preparation method thereof. Background technique [0002] Copper-silver alloys are often used as key materials for signal transmission in electronic communication equipment. With the development of copper alloy profiles in the direction of high transmission rate, high-fidelity, and high-definition, the strength, electrical conductivity, thermal conductivity, and organizational consistency of materials And uniformity, etc. put forward higher requirements. The traditional copper-silver alloy bar preparation methods are: melting, semi-continuous casting, extrusion or forging, multi-pass drawing, heat treatment, etc. It has the following limitations: due to the traditional copper-silver alloy bar preparation process, it is necessary to melt and cast the ingot fir...

AI Technical Summary

Problems solved by technology

It has the following limitations: due to the traditional copper-silver alloy bar preparation process, it is necessary to melt and cast the ingot first, then perform machining on the ingot such as peeling and removing the riser, and then carry out secondary heating plastic deformation, and finally through multiple Improvement of microstructure and properties of rod after drawing and heat treatment in one pass

Different from other copper-based materials, silver itself has excellent electrical conductivity, and the electrical conductivity is less reduced after being added to copper. At the same time, other microalloying elements such as Cr, Zr, and Nb can also be added to copper-based materials. Under these conditions, the solid solubility of microalloying elements in copper has a large difference, which can play a significant effect of aging precipitation strengthening. Casting, hot-cold combined continuous casting process, it is difficult to form a stable and almost parallel crystallization solidification trend along the horizontal continuous casting direction at the front of the liquid-solid interface, so that it is impossible to achieve a directional solidification structure with few grain boundaries, or even a single crystal structure. Microstructure plays an important role in improving the electrical and thermal conductivity of alloys

In addition, after the copper-silver alloy is continuously casted by hot-cold combination, solution treatment, drawing treatment and aging treatment are carried out in sequence. The front of the liquid-solid interface is easy to form a V-shaped interface due to the existence of excessive undercooling, and the solidification structure cannot be realized. Oriented growth, resulting in subsequent solid solution, drawing, and aging treatments, but the final performance will be due to the inhomogeneous structure and performance, disordered grain orientation and other problems caused by the inheritance of the congenital cast structure

The copper-silver alloys in the prior art do not undergo the steps of solid solution treatment, drawing treatment and aging treatment in sequence after hot-type continuous casting

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