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A kind of preparation method of diamond copper matrix composite material

A copper-based composite material and composite material technology, applied in the field of preparation of diamond copper-based composite materials, can solve the problems of poor wettability and thermal conductivity between diamond and copper

Active Publication Date: 2021-01-08
GUANGXI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the problem of poor wettability and thermal conductivity between diamond and copper, the present invention provides a new method for preparing diamond-copper-based composite materials

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] A diamond-copper matrix composite material prepared from the following raw materials in weight percentage: 35% diamond, 1.5% zirconium, 0.03% erbium, 0.02% niobium, 0.03% tantalum, 1.2% rare earth coupling agent, aluminum zirconium coupling agent 2%, the balance is copper. Its preparation method comprises the following steps:

[0024] (1) Weigh the raw materials according to the above ratio, add diamond, zirconium, erbium, niobium, tantalum, rare earth coupling agent, aluminum zirconium coupling agent, and then add zirconia grinding balls into the ball milling tank with a ball-to-material ratio of 8:1 Ball mill for 3 hours at a rotational speed of 300r / min to obtain a mixed powder;

[0025] (2) Heating the mixed powder to 850° C. for 2.5 hours under the protection of argon, and then press molding under a pressure of 40 MPa to obtain a compact;

[0026] (3) The compact was sintered at a temperature of 1050° C. and a pressure of 40 MPa for 5 hours to obtain a diamond-co...

Embodiment 2

[0029] A diamond-copper-based composite material prepared from the following raw materials in weight percentage: 42% diamond, 1.8% zirconium, 0.05% erbium, 0.01% niobium, 0.03% tantalum, 0.8% rare earth coupling agent, aluminum zirconium coupling agent 1.2%, the balance being copper. Its preparation method comprises the following steps:

[0030] (1) Weigh the raw materials according to the above ratio, add diamond, zirconium, erbium, niobium, tantalum, rare earth coupling agent, aluminum zirconium coupling agent, and then add zirconia grinding balls into the ball milling tank at a ball-to-material ratio of 5:1 Ball milling for 2.5 hours at a rotational speed of 500r / min to obtain a mixed powder;

[0031] (2) Heating the mixed powder to 900° C. for 1.5 hours under the protection of argon, and then press molding under a pressure of 35 MPa to obtain a compact;

[0032] (3) The compact was sintered at a temperature of 1100° C. and a pressure of 35 MPa for 4 hours to obtain a dia...

Embodiment 3

[0035] A diamond-copper-based composite material prepared from the following raw materials in weight percentage: 28% diamond, 2.4% zirconium, 0.03% erbium, 0.02% niobium, 0.01% tantalum, 1.5% rare earth coupling agent, aluminum zirconium coupling agent 2.5%, the balance being copper. Its preparation method comprises the following steps:

[0036] (1) Weigh the raw materials according to the above ratio, add diamond, zirconium, erbium, niobium, tantalum, rare earth coupling agent, aluminum zirconium coupling agent, and then add zirconia grinding balls into the ball milling tank with a ball-to-material ratio of 10:1 Ball mill for 3.5 hours at a rotational speed of 400r / min to obtain a mixed powder;

[0037] (2) Heating the mixed powder to 750° C. for 3 hours under the protection of argon, and then press molding under a pressure of 40 MPa to obtain a green compact;

[0038] (3) The compact was sintered at a temperature of 1050° C. and a pressure of 30 MPa for 5 hours to obtain a...

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Abstract

The invention discloses a preparation method of a diamond copper-based composite material. The preparation method comprises the following raw materials including, by weight, 20%-50% of diamond, 0.5%-2.5% of zirconium, 0.02%-0.05% of erbium, 0.01%-0.05% of niobium, 0.01%-0.05% of tantalum, 0.5%-1.5% of a rare earth coupling agent, 1%-3% of an aluminum zirconium coupling agent and the balance copper. The preparation method comprises the following steps that the diamond, the zirconium, the erbium, the niobium, the tantalum, the rare earth coupling agent, the aluminum zirconium coupling agent andgrinding balls are added into a ball milling tank for ball milling to obtain mixed powder; the mixed powder is heated to 700 DEG C to 900 DEG C to be subjected to heat preservation for 1-3 h under inert gas protection, and then compression moulding is carried out to obtain a pressed shape; and the pressed shape is subjected to plasma discharge sintering to obtain the diamond copper-based compositematerial. According to the diamond copper-based composite material prepared by the method, the heat conductivity reaches more than 520 W / (m.K), the thermal expansion coefficient is less than 3.0*10<-6>m / k, the diamond copper-based composite material can be used as an excellent electronic packaging material, and the diamond copper-based composite material has the broad market prospect.

Description

technical field [0001] The invention relates to the technical field of heat-conducting materials, in particular to a method for preparing a diamond-copper-based composite material. Background technique [0002] The diamond / copper composite material with diamond as the reinforcing phase and copper as the matrix material can achieve high thermal conductivity and adjustable thermal expansion by adjusting the volume fraction of diamond, which can meet the requirements of system heat dissipation and assembly process. It is a very competitive new type of electronic packaging material. With the development of electronic packaging materials in the direction of miniaturization, light weight and high performance, the operating temperature of the circuit continues to rise, and the heating rate per unit volume of the system continues to increase, resulting in unstable system operation. In order to obtain stable performance, heat dissipation conditions must be improved, so the importanc...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C26/00C22C9/00C22C30/02C22C1/05C22C1/10
CPCC22C1/05C22C9/00C22C26/00C22C30/02
Inventor 庞兴志阳习雨湛永钟赵艳君陈荣光刘丞钰邓思源谭志强陈林岳庞明君杨文超杨剑冰
Owner GUANGXI UNIV