Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Sn-based soldering flux and preparation method thereof

A technology of solder and base alloy, which is applied in the field of Sn-based solder and its preparation, can solve problems such as the inconsistency between the amount of nanoparticles added and the theoretical amount, and the uneven distribution of nanoparticles, so as to solve microscopic cracking, reduce crystal nucleation energy, and improve creep life changing effect

Active Publication Date: 2019-08-23
BEIJING COMPO ADVANCED TECH
View PDF7 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The first object of the present invention is to provide a kind of Sn-based solder, this solder solves the problem of uneven dispersion of nanoparticles in tin-based alloys
[0009] The second object of the present invention is to provide the preparation method of the above-mentioned Sn-based solder, which solves the problem of uneven dispersion and distribution of nanoparticles in tin-based alloys on the one hand, and also solves the problem that the actual amount of nanoparticles added is inconsistent with the theoretical amount on the other hand.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Sn-based soldering flux and preparation method thereof
  • Sn-based soldering flux and preparation method thereof
  • Sn-based soldering flux and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0049] A high-reliability Sn-based solder alloy, in weight percentage, the solder alloy comprises: SnAg 3.0 Cu 0.5 Alloy 80%; nano-alumina dispersion strengthened copper (Cu-Al 2 o 3 ) powder is 20%, of which Al 2 o 3 The weight percentage is 5.0%, the rest is Cu, nano Al 2 o 3 The scale of the phase is 5nm. The method for preparing the solder alloy comprises the following steps:

[0050] 1) Preparation of SnAg 3.0 Cu 0.5 Solder alloy, according to the alloy ratio, the Sn, Ag, Cu raw materials are melted in a vacuum melting furnace and kept warm, SnAg 3.0 Cu 0.5 The melting point is 217°C, and the holding temperature is 302-310°C;

[0051] 2) The nano-alumina dispersion strengthened copper (Cu-Al 2 o 3 ) powder was added to the molten Sn-based alloy solution according to the design ratio, and vacuumized to 1×10 -2 -1×10 -1 Pa, filled with nitrogen and stirred at a high speed, the stirring time is 30-40min, and the stirring speed is 6000-8000rpm, so that the Sn-b...

Embodiment 2

[0053] A high-reliability Sn-based solder alloy, in weight percentage, the solder alloy comprises: SnBi 45 Sb 1.0 Ag 0.9 Alloy 85%, nano-alumina dispersion strengthened copper (Cu-Al) prepared by mechanical alloying method 2 o 3) powder is 15%, of which Al 2 o 3 The weight percentage is 2%, the rest is Cu, nano Al 2 o 3 The scale of the phase is 15 nm. The method for preparing the solder alloy comprises the following steps:

[0054] 1) Preparation of SnBi 45 Sb 1.0 Ag 0.9 Solder alloy, the raw materials are melted and kept warm in a vacuum melting furnace according to the alloy ratio, SnBi 45 Sb 1.0 Ag 0.9 The melting point is 146°C, and the holding temperature is 230-240°C;

[0055] 2) Nano-alumina dispersion-strengthened copper (Cu-Al 2 o 3 ) powder is added to the molten SnBi according to the design ratio 45 Sb 1.0 Ag 0.9 In the alloy melt, vacuumize to 1×10 -2 -1×10 -1 Pa, filled with nitrogen and then stirred, the stirring time is 30-40min, and the st...

Embodiment 3

[0058] A high-reliability Sn-based solder alloy, in weight percentage, the solder alloy comprises: SnIn 48 Bi 10 Alloy 82%, nano-alumina dispersion strengthened copper (Cu-Al) prepared by mechanical alloying method 2 o 3 ) powder is 18%, of which Al 2 o 3 The weight percentage content is 50ppm, the rest is Cu, nano Al 2 o 3 The scale of the phase is 100 nm. The method for preparing the solder alloy comprises the following steps:

[0059] 1) Preparation of SnIn 48 Bi 10 Solder alloy, the raw materials are melted and kept warm in a vacuum melting furnace according to the alloy ratio, SnIn 48 Bi 10 The melting point is 130°C, and the holding temperature is 217-225°C;

[0060] 2) Nano-alumina dispersion-strengthened copper (Cu-Al 2 o 3 ) powder is added to the molten SnIn according to the design ratio 48 Bi 10 In the molten gold, vacuumize to 1×10 -2 -1×10 -1 Pa, filled with nitrogen and stirred, the stirring time is 30-40min, and the stirring speed is 6000-8000rp...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
melting pointaaaaaaaaaa
melting pointaaaaaaaaaa
melting pointaaaaaaaaaa
Login to View More

Abstract

The invention relates to a Sn-based soldering flux and a preparation method thereof. The Sn-based soldering flux is mainly prepared by uniformly mixing nano-alumina dispersion strengthened copper Cu-Al2O3 with a molten-state Sn-based alloy. According to the Sn-based soldering flux and the preparation method thereof, the problem of non-uniform dispersion distribution of nano-particles in the Sn-based alloy is solved; and compared with an existing product, the soldering flux has the advantages of being high in tensile strength, high in elongation, high in bonding strength after welding, excellent in high-temperature and low-temperature cyclic impact resistance, high in welding reliability, and the like.

Description

technical field [0001] The invention relates to the field of alloy materials, in particular to a Sn-based solder and a preparation method thereof. Background technique [0002] With the advent of the 5G era, future unmanned vehicles, new medical devices, aerospace control systems, etc. will put forward more stringent technical requirements for the reliability of integrated circuits under high-frequency application conditions. How to ensure the high reliability of chip integration and thus ensure the safety of electronic products, among which the research on chip interconnection technology and its interconnection solder is particularly critical. At this stage, the size of the chip is getting larger and larger, the number of pins is increasing rapidly (up to 10,000), the pitch of the pins is getting smaller and smaller (tens of microns), and the wafer-level narrow / super-pitch bump (bump) / solder ball (solder ball) will become the mainstream. The size of advanced packaging i...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26B23K35/40
CPCB23K35/262B23K35/40
Inventor 张少明贺会军刘希学王志刚赵朝辉刘建林卓贤安宁朱学新张焕鹍
Owner BEIJING COMPO ADVANCED TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com