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Glass-based heat conducting circuit board

A glass-based, circuit board technology, applied in circuit substrate materials, printed circuits, printed circuit manufacturing, etc., can solve problems such as heat dissipation and poor light transmittance, and achieve the effects of simple manufacturing process, reduced packaging costs, and fast heat dissipation

Inactive Publication Date: 2019-09-10
深圳市昱谷科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The invention adopts a special process to manufacture a LED circuit board with a transparent function, which mainly solves the problems of heat dissipation and poor light transmittance, and has the characteristics of fast heat dissipation, high transparency, and simple manufacturing process.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] 1. Manufacture of glass-based copper clad laminate

[0027] Glass and copper foil use epoxy resin as the basic adhesive to produce glass-based copper clad laminates through vacuum hot pressing.

[0028] a. Epoxy resin adhesive formula:

[0029] material name parts by weight A-80 epoxy resin 1000 Dicyandiamide 100 PVB 80 1# Additive 4 2# Additive 4 KH-560 100 filler Appropriate amount solvent 1400

[0030] After the above formula is mixed, stirred and matured, the formula resin is uniformly coated on the copper foil on the resin coating machine. Schematic diagram of the coating resin as Figure 4

[0031] b. Pressed glass-based copper clad laminate

[0032] Place the glass and glued copper foil as shown in the figure below ( Figure 5 ) after being stacked and pressed into a vacuum press.

[0033] c. Manufacture of glass-based circuit boards

[0034] The circuit part is manufactured by the circuit bo...

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Abstract

The invention belongs to the field of heat dissipation substrates for LED, and specifically relates to a glass-based heat conducting circuit board. The glass-based heat conducting circuit board is manufactured according to the following steps: S1, manufacturing of a glass-based copper clad laminate; a glass-based copper clad laminate is manufactured by vacuum hot pressing of glass and copper foilthrough epoxy resin as basic adhesive; S2, pressing of the glass-based copper clad laminate; the glass and the glued copper foil are stacked and put in a vacuum press for pressing; S3, manufacturing of a glass-based circuit board: a circuit part is manufactured by using a circuit board manufacturing technology; and S4, laser ablation of resin: laser of corresponding intensity is selected and usedto ablate the resin part outside the circuit to expose a transparent glass substrate. The structure does not have a circuit board and adhesive bonding part compared with the existing transparent screen, so that the thermal conductivity of the glass-based heat conducting circuit board is much better that of the existing product. Because the surface-mounted circuit board part is omitted, the thickness of the transparent screen can be reduced ultimately.

Description

technical field [0001] The invention belongs to the field of heat-dissipating substrates used in LEDs, and in particular relates to a glass-based heat-conducting circuit board. Background technique [0002] At present, heat dissipation substrates used in the LED field generally use heat dissipation metals such as aluminum substrates and copper substrates as heat dissipation materials. These materials have great limitations in light transmission performance. With the diverse applications of products, there is a great demand for LED products that require better light transmittance in the market. For example, outdoor advertising, shopping mall window design, road landscape design, stage effect design, vehicle glass dynamic advertising and many other aspects have this demand. [0003] In August 2018, at the closing ceremony of the Winter Olympics in Pyeongchang, South Korea, an "ice screen" made with a special process appeared, which attracted attention in the field of transpa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/02H05K3/00H05K1/03H05K3/34G09F9/33
CPCG09F9/33H05K1/0306H05K3/0032H05K3/022H05K3/341
Inventor 刘玉群
Owner 深圳市昱谷科技有限公司
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