A kind of high heat-resistant polyamide composition and its preparation method

A polyamide composition and polyamide technology are applied in the field of polymer materials and can solve the problems of high temperature thermal aging properties and insufficient mechanical properties.

Active Publication Date: 2021-12-10
江苏晋伦塑料科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The main purpose of the present invention is to overcome the problems of insufficient high-temperature thermal aging properties and mechanical properties of existing polyamide molding compositions, and provide a high heat-resistant polyamide composition with improved high-temperature thermal aging properties and good mechanical properties, and cost advantage

Method used

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  • A kind of high heat-resistant polyamide composition and its preparation method
  • A kind of high heat-resistant polyamide composition and its preparation method
  • A kind of high heat-resistant polyamide composition and its preparation method

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Embodiment Construction

[0060] The present invention is further illustrated by the following examples. It should be understood that the following examples are for illustrative purposes only, and are not intended to limit the present invention.

[0061] The following materials were used in the examples and comparative examples:

[0062] PA66-1 refers to a PA66 resin having about 50 mmol / kg of amino terminal groups and about 80 mmol / kg of carboxyl terminal groups, a relative viscosity of 2.7, a melting point of 260° C., and a glass transition temperature of 60° C., commercially available.

[0063] PA66-2 refers to a PA66 resin having about 85 mmol / kg of amino terminal groups and about 45 mmol / kg of carboxyl terminal groups, a relative viscosity of 2.7, a melting point of 260° C., and a glass transition temperature of 60° C., commercially available.

[0064] PA6 refers to PA6 resin, with a relative viscosity of 2.7, a melting point of 220°C, and a glass transition temperature of 55°C, a commercially av...

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Abstract

The invention discloses a high heat-resistant polyamide composition and a preparation method thereof, comprising 25.0-98.0 wt% of polyamide, 0.5-15.0 wt% of epoxy resin, 0.01-3.0 wt% of stabilizer and 0.01-60.0 wt% of reinforcing agent %, or also include 0.01-5.0wt% of functional additives, and the sum of the mass percentages is 100wt%. 100-2500g / eq. The invention reduces the generation of free radicals by selecting polyamide substrates with high-end amino groups and low-end carboxyl groups, and at the same time utilizes the high-temperature aging resistance of epoxy resins to prevent oxygen from eroding polyamide resins from thermal-oxidative aging, and through the strong epoxy groups The polarity improves the compatibility of the polyamide and the reinforcing agent, and overcomes the problems of insufficient high-temperature heat aging performance and mechanical properties of the existing polyamide molding composition.

Description

technical field [0001] The invention belongs to the technical field of polymer materials, and in particular relates to a high heat-resistant polyamide composition and a preparation method thereof. Background technique [0002] Polyamide composition has excellent mechanical properties, durability, corrosion resistance, heat resistance and other characteristics, and is being used more and more in the field of "replacing steel with plastic". These products are often exposed to high temperatures during their lifetime, requiring long-term resistance to thermo-oxidative aging degradation. Under some extreme conditions, such as the intercooler air chamber of an automobile turbocharged engine, the long-term working temperature of polyamide composite parts exceeds 200 °C, and the parts are required to have a longer warranty period than traditional engineering plastic parts. At a temperature exceeding 200°C, the traditional polyamide composition will be thermally and oxidatively degr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L77/06C08L77/02C08L63/00C08L51/04C08K7/14C08K13/04C08K5/18C08K5/053C08K3/16C08K5/098
CPCC08L77/06C08L2201/08C08L2205/02C08L2205/03C08L2205/025C08L2205/06C08K2201/003C08K2201/014C08L77/02C08L63/00C08K7/14C08K13/04C08K5/18C08K5/053C08K3/16C08K5/098C08L51/04
Inventor 陈跃民陈原振林柏龄
Owner 江苏晋伦塑料科技有限公司
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