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Electrodeposition solution and method for producing conductor with insulating film using same

A technology of electrodeposition and solid components, applied in the direction of insulators, plastic/resin/wax insulators, electrophoretic plating, etc., can solve the problems of difficulty in forming thick films, easy foaming, and fast solvent volatilization, and reduce the amount of encapsulation , Inhibit foaming, improve the effect of insulation breakdown voltage

Pending Publication Date: 2019-09-13
MITSUBISHI MATERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, in the aqueous dispersion liquid for forming a low dielectric constant insulating film shown in the above-mentioned conventional patent document 1, the particle size of the organic particles is not shown, and the proportion of water in the solvent in the electrodeposition liquid is relatively small. High, so it also has the problem that the volatilization rate of the solvent during drying is fast and foaming is easy to occur, making it difficult to form a thick film
On the other hand, in the method for producing an insulated electric wire shown in the above-mentioned conventional patent document 2, the particle size of the polyimide resin is not shown, and all the solvents in the water-dispersed resin latex (electrodeposition solution) are Water, so there is a problem that the solvent evaporates quickly during drying and foaming is easy to occur, making it difficult to form a thick film

Method used

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  • Electrodeposition solution and method for producing conductor with insulating film using same
  • Electrodeposition solution and method for producing conductor with insulating film using same
  • Electrodeposition solution and method for producing conductor with insulating film using same

Examples

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Effect test

preparation example Construction

[0030] [Preparation of dispersion liquid of polyimide-based resin particles]

[0031] Next, the polyimide resin varnish obtained above was further diluted with an organic solvent, and after adding a basic compound, it stirred and added water at room temperature. Thereby, the dispersion liquid of the polyimide-type resin particle whose median diameter is 50-400 nm is obtained.

[0032] [Preparation of dispersion of fluororesin particles]

[0033] After diluting commercially available fluororesin particles with water and then stirring, a dispersion of fluororesin particles having a median diameter of 50 to 500 nm was obtained.

[0034] [Preparation of Electrodeposition Solution]

[0035] An electrodeposition solution is obtained by mixing a dispersion of polyimide-based resin particles and a dispersion of fluororesin particles.

[0036] When using the above-mentioned electrodeposition solution to form an insulating coating on the surface of a conductor, it is preferable to us...

Embodiment

[0039] Next, examples of the present invention will be described in detail together with comparative examples.

[0040]

[0041] A method for producing an electrodeposition solution will be described.

[0042] [Synthesis of polyimide resin varnish]

[0043] First, 747 g of N-methyl-2-pyrrolidone (polar solvent) and 298 g (1.19 mol) of diphenylmethane were charged into a 2-liter four-necked flask equipped with a stirrer, a cooling tube, a nitrogen gas introduction tube, and a thermometer. - 4,4'-diisocyanate (MDI, isocyanate component) and 227 g (1.18 mol) of trimellitic anhydride (TMA, acid component) were heated up to 130°C. By reacting at this temperature for about 4 hours, a polymer (polyamideimide resin) having a number average molecular weight of 17,000 was obtained. Then, the polyamideimide resin synthesized above was diluted with N-methyl-2-pyrrolidone (polar solvent) so that the concentration of the polyamideimide resin (non-volatile component) became 20% by mass, ...

Embodiment 2～ Embodiment 10 and comparative example 1～ comparative example 8

[0053] As shown in Table 1, the types of polyimide-based resin particles and fluorine-based resin particles, the content ratio of polyimide-based resin particles in the solid content, the content ratio of fluororesin particles in the solid content, and the dispersion ratio were changed. The content ratio of the polar solvent in the medium, the water content ratio in the dispersion medium, the alkali content ratio in the dispersion medium and the median diameter of the polyimide resin particles were prepared in the same manner as in Example 1. An electrodeposition solution, using the electrodeposition solution, a copper wire with an insulating coating was produced. These insulating-coated copper wires were used as Example 2-Example 10 and Comparative Example 1-Comparative Example 5.

[0054]

[0055]The appearances of the insulation coatings of the copper wires with insulation coatings of Examples 1 to 10 and Comparative Examples 1 to 5 were observed, and the relative permitt...

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Abstract

An electrodeposition solution comprises a dispersion medium (13) and a solids fraction (11). The solids fraction (11) includes polyimide resin particles (11a) and fluorine resin particles (11b). Also,the content ratio of fluorine resin particles (11b) in the solids fraction (11) is 20-70 mass%. In addition, the median diameter of the polyimide resin particles (11a) is 50-400 nm.

Description

technical field [0001] The present invention relates to an electrodeposition liquid for forming an insulating film with a low dielectric constant and a high dielectric breakdown voltage, and a method for manufacturing a conductor with an insulating film using the electrodeposition liquid. [0002] This application claims priority based on Patent Application No. 2017-027100 for which it applied in Japan on February 16, 2017, and uses the content here. Background technique [0003] Conventionally, an aqueous dispersion for forming a low-dielectric constant insulating film has been disclosed in which non-film-forming fine particles having an average particle diameter of 1 μm or less and a relative permittivity of 3 or less are mixed with polymerizable compounds and polymers. Organic particles of at least one composition are dispersed in an aqueous medium, and an insulating film can be formed by electrodeposition (for example, refer to Patent Document 1). In the aqueous dispers...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D179/08C09D5/44C09D7/40C09D127/12C25D13/06C25D13/16C25D15/00H01B3/30H01B3/44
CPCC09D179/08C25D13/16H01B3/306H01B3/445C08G73/14C08L79/08C09D127/18C09D5/4473C09D7/68C09D5/44C09D5/4461C09D127/12C09D7/40C25D15/00H01B3/30H01B3/44C08L27/18C25D13/08
Inventor 饭田慎太郎樱井英章
Owner MITSUBISHI MATERIALS CORP
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